A coil structure includes metal plates each including a spiral conductor, and a row of terminals, aligned in a predetermined direction on an outer side of the conductor, and formed by plate portions thicker than the conductor. Two ends of the conductor are connected to two adjacent plate portions for each metal plate. The row of terminals of a first metal plate is bonded to the row of terminals of a second, adjacent metal plate. The position where the two ends of the conductor connect to the two adjacent plate portions shifts one place toward the second end for each upward increase in level within a laminate along a laminated direction of the metal plates, so that the conductors of each of the metal plates are connected in series to form a spiral coil.

A system and method for providing and programming a programmable inductor is provided. The structure of the programmable inductor includes multiple turns, with programmable interconnects incorporated at various points around the turns to provide a desired isolation of the turns during programming. In an embodiment the programming may be controlled using the size of the vias, the number of vias, or the shapes of the interconnects.

A system and method for providing and programming a programmable inductor is provided. The structure of the programmable inductor includes multiple turns, with programmable interconnects incorporated at various points around the turns to provide a desired isolation of the turns during programming. In an embodiment the programming may be controlled using the size of the vias, the number of vias, or the shapes of the interconnects.

Disclosed are a method for manufacturing a coil, a coil, and an electronic device. The method includes: bonding a first side of a metal sheet onto a laser-transmitting substrate by an adhesive layer; cutting a coil pattern on a second side of the metal sheet by the laser to form a coil running through the two sides of the metal sheet on the metal sheet; bonding the second side of the metal sheet onto an adhesive tape; transmitting the laser through the laser-transmitting substrate to act on the adhesive layer to detach the laser-transmitting substrate and the adhesive layer from the first side of the metal sheet; exposing the coil pattern on the first side of the metal sheet; and forming an encapsulation layer on the coil to encapsulate the first side of the coil.

An inductive device includes an insulating layer, a lower magnetic layer, and an upper magnetic layer that are formed such that the insulating layer does not separate the lower magnetic layer and the upper magnetic layer at the outer edges or wings of the inductive device. The lower magnetic layer and the upper magnetic layer form a continuous magnetic layer around the insulating layer and the conductors of the inductive device. Magnetic leakage paths are provided by forming openings through the upper magnetic layer. The openings may be formed through the upper magnetic layer by semiconductor processes that have relatively higher precision and accuracy compared to semiconductor processes for forming the insulating layer such as spin coating. This reduces magnetic leakage path variation within the inductive device and from inductive device to inductive device.

Magnetic pastes which include a magnetic powder (A) and a binder resin (B), in which, in the particle diameter distribution of the component (A), the 10% particle diameter (D.sub.10) is 0.2 μm or larger and 2.0 μm or smaller, the 50% particle diameter (D.sub.50) is 2.0 μm or larger and 4.3 μm or smaller, and the 90% particle diameter (D.sub.90) is 4.3 μm or larger and 8.5 μm or smaller, suppress the magnetic powder from being unevenly distributed, and are useful for forming inductor elements and circuit boards.

Inductor trimming using sacrificial magnetically coupled loops is provided. Embodiments disclosed herein realize a trimmable inductor by using one or more magnetic sacrificial loops that are galvanically isolated from an adjacent primary loop of an inductor structure and which can be disabled by interrupting conduction in the sacrificial loop. When the magnetic sacrificial loop is closed, it magnetically couples to the primary loop and impacts an overall structure inductance. When conduction through the sacrificial loop is interrupted, there is no more magnetic coupling to the primary loop and there is no inductance impact from that particular sacrificial loop. The trimmable inductor can be permanently or temporarily trimmed. For example, conduction through the one or more sacrificial loops can be interrupted by removing a portion or the entire sacrificial loop (e.g., using a laser cut process). In other examples, conduction can be interrupted by a switching element, such as a transistor.

A method for applying AOI to copper coils thinned by laser etching includes placing a half-finished product under a scanning unit; scanning the half-finished product to generate an image; sending the image to an image analysis unit which is activated to analyze the image, identify cutting boundaries of the half-finished product, compare the cutting boundaries with an original processing path file, and identify defects of the half-finished product; activating the image analysis unit to find points around the half-finished product; activating the image analysis unit to simulate an optimum path; activating the image analysis unit to convert the optimum path into an optimum processing path file; activating the image analysis unit to send the optimum processing path file to a program unit; conveying the half-finished product to dispose under a laser processing unit; and activating the program unit to instruct the laser processing unit to process the half-finished product.

A flat coil, a manufacturing method thereof and an electronic apparatus are disclosed. The manufacturing method comprises: rolling a metal foil lamination onto a carrier roller to form a foil rod, wherein the metal foil lamination includes at least one layer of metal foil; sliding the foil rod from the carrier roller; slicing the foil rod into thin disks; and processing the thin disks to form at least one flat coil, wherein a pressing roller is pressed against the carrier roller via the metal foil lamination with a controlled pressing force as the metal foil lamination is rolled.

Disclosed are a method for manufacturing a coil, a coil, and an electronic device. The method includes: bonding a first side of a metal sheet onto a laser-transmitting substrate by an adhesive layer; cutting a coil pattern on a second side of the metal sheet by the laser to form a coil running through the two sides of the metal sheet on the metal sheet; bonding the second side of the metal sheet onto an adhesive tape; transmitting the laser through the laser-transmitting substrate to act on the adhesive layer to detach the laser-transmitting substrate and the adhesive layer from the first side of the metal sheet; exposing the coil pattern on the first side of the metal sheet; and forming an encapsulation layer on the coil to encapsulate the first side of the coil.