A coil for transfer of information or energy is described. The coil includes an electrically conductive magnetically insulative first layer and a magnetically conductive second layer bonded to the first layer along the length of the first layer. The first and second layers are wound to form a plurality of substantially concentric loops. A width and a length of the second layer may be substantially co-extensive with a respective width and length of the first layer so as to expose opposing longitudinal edge surfaces of the first layer along the length of the first layer. At least one of the opposing longitudinal edge surfaces may include a regular pattern extending substantially along a same first direction and across substantially the entire coil. A method of making the coil is described.

The present disclosure provides a magnetic element and a method for manufacturing same. The method includes: forming a first metal wiring layer on a surface of at least one segment of a magnetic core; forming a first metal protection layer on the first metal wiring layer; removing a portion of the first metal protection layer with a direct writing technique to expose a portion of the first metal wiring layer; and etching the exposed first metal wiring layer in such a manner that the first metal wiring layer forms at least one first pattern to function as a winding, where at least one turn of the first pattern surrounds the magnetic core. The magnetic element and the method for manufacturing the magnetic element provided in the present disclosure can improve space utilization of the magnetic element.

Disclosed is a method of manufacturing a coil module that receives or transmits electric power or signals wireless by using an electromagnetic field. The method includes preparing a substrate, forming a coil on the substrate, and forming a magnetic part covering at least a portion of the coil while directly contacting a surface of the coil, and that acts as an electromagnetic booster that enhances an intensity of the electromagnetic field generated on the surface of the coil, and the magnetic part is formed through at least one of electroless plating, electro-plating, deposition, and printing.

A mixture for making a multilayer inductor, wherein the mixture comprises a first magnetic powder, a second magnetic powder, and a glass material, wherein each of the first magnetic powder and the second magnetic powder comprises an amorphous or nanocrystalline magnetic powder, wherein a softening point temperature of the glass material is in a range of 300°˜430° C.

A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers on top of one another and that has a coil built thereinto, and a first outer electrode and a second outer electrode that are electrically connected to the coil. The coil is formed by electrically connecting a plurality of coil conductors to one another. A first main surface of the multilayer body is a mounting surface. A stacking direction of the multilayer body and an axial direction of the coil are parallel to the mounting surface. The insulating layers between the coil conductors are composed of a material containing at least one out of a magnetic material and a non-magnetic material. A content percentage of the non-magnetic material in the insulating layers changes in a direction from a first end surface toward a second end surface of the multilayer body.

According to one or more embodiments, a wireless charge coil for wireless charging of a portable terminal includes an installation member, and a conducting wire portion arranged at the installation member, wherein the conducting wire portion comprises a conductor and a magnetic material plating layer arranged on at least one surface of the conductor, and wherein the magnetic material plating layer has a thickness of about 1 .Math.m to about 8 .Math.m.

According to one or more embodiments, a wireless charge coil for wireless charging of a portable terminal includes an installation member, and a conducting wire portion arranged at the installation member, wherein the conducting wire portion comprises a conductor and a shielding layer arranged on at least one surface of the conductor, and wherein the shielding layer includes a plurality of magnetic layers and at least one non-magnetic layer.

The present disclosure relates to inductor structures and fabricating methods. One example inductor structure includes a first magnetic material layer, an insulation layer, where the insulation layer comprises a polymer structure with longitudinal length which greater than lateral length, the polymer structure comprises an arched upper surface, a first side surface, a second side surface, a bottom surface in a longitudinal direction, at least one of a corner between the arched upper surface and the first side surface and a corner between the arched upper surface and the second side surface is a rounded corner, and at least one of an angle formed between the first side surface and the bottom surface and an angle formed between the second side surface and the bottom surface is less than 90 degree, at least one conductive wire structure passing through the insulation layer, and a second magnetic material layer.

A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a magnetic element over the semiconductor substrate. The semiconductor device structure also includes an isolation layer covering the magnetic element and a portion of the semiconductor substrate. The isolation layer contains a polymer material. The semiconductor device structure further includes a conductive line over the isolation layer and extending exceeding edges of the magnetic element.

An inductor conductor is configured such that, with respect to a height-wise dimension of the inductor conductor between the top surface and the bottom surface thereof, the height-wise dimension of a central portion of the top surface is smaller than the height-wise dimension of an edge portion of the top surface at a cross section of the inductor conductor taken in a direction orthogonal to an extending direction of the inductor conductor.