Embodiments include package substrates and method of forming the package substrates. A package substrate includes a first encapsulation layer over a substrate, and a second encapsulation layer below the substrate. The package substrate also includes a first interconnect and a second interconnect vertically in the first encapsulation layer, the second encapsulation layer, and the substrate. The first interconnect includes a first plated-through-hole (PTH) core, a first via, and a second via, and the second interconnect includes a second PTH core, a third via, and a fourth via. The package substrate further includes a magnetic portion that vertically surrounds the first interconnect. The first PTH core has a top surface directly coupled to the first via, and a bottom surface directly coupled to the second via. The second PTH core has a top surface directly coupled to the third via, and a bottom surface directly coupled to the fourth via.

Described are microelectronic devices including an embedded microelectronic package for use as an integrated voltage regulator with a microelectronic system. The microelectronic package can include a substrate and a magnetic foil. The substrate can define at least one layer having one or more of electrically conductive elements separated by a dielectric material. The magnetic foil can have ferromagnetic alloy ribbons and can be embedded within the substrate adjacent to the one or more of electrically conductive elements. The magnetic foil can be positioned to interface with and be spaced from the one or more of electrically conductive element.

A microelectronic device has bump bonds and an inductor on a die. The microelectronic device includes first lateral conductors extending along a terminal surface of the die, wherein at least some of the first lateral conductors contact at least some of terminals of the die. The microelectronic device also includes conductive columns on the first lateral conductors, extending perpendicularly from the terminal surface, and second lateral conductors on the conductive columns, opposite from the first lateral conductors, extending laterally in a plane parallel to the terminal surface. A first set of the first lateral conductors, the conductive columns, and the second lateral conductors provide the bump bonds of the microelectronic device. A second set of the first lateral conductors, the conductive columns, and the second lateral conductors are electrically coupled in series to form the inductor. Methods of forming the microelectronic device are also disclosed.

To provide a new type of coil component capable of providing a high inductance and excellent in insulation reliability. A coil component according to one embodiment of the present invention is provided with an insulating body, a first external electrode provided on a surface of the insulating body, a second external electrode provided on a surface of the insulating body, and a coil conductor provided between the first external electrode and the second external electrode. In the coil conductor, a conductor pattern having a larger potential difference from the second external electrode is arranged farther from the second external electrode, and a conductor pattern having a larger potential difference from the first external electrode is arranged farther from the first external electrode.

An embedded transformer module device includes an insulating substrate including a first side and a second side opposite to the first side and including a first cavity, a magnetic core in the first cavity, a primary winding wound horizontally around the magnetic core and having a spiral shape with more than one turn, and a secondary winding wound horizontally around the magnetic core, spaced away from the primary winding, and having a spiral shape with more than one turn.

To provide an electronic component having printing, which can achieve both of a moisture resistance capability and visibility of printing, and a method of manufacturing the same. A method of manufacturing an electronic component having printing, including preparing an electronic component before being subjected to printing, which is provided with a magnetic element body made of an alloy magnetic material containing a transition metal on a surface thereof, and a glass layer that contains Bi with which the magnetic element body is at least partly coated and does not contain a transition metal, and irradiating the electronic component before being subjected to printing with laser light having a wavelength of 1064 nm so that the laser light is transmitted through the glass layer, so that a printing portion is formed at a partial glass portion in a vicinity of an interface between the magnetic element body and the glass layer.

A thin film inductor includes a body including a coil part disposed therein, wherein the coil part includes a patterned insulating film disposed on a substrate and a coil pattern formed between the patterned insulating films, the coil pattern having a lower height than the insulating film, such that the coil pattern may be formed in a structure with a high aspect ratio while having a uniform thickness, thereby increasing a cross-sectional area of the coil part and improving direct current resistance (Rdc) characteristics.

Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a substrate, where the substrate comprises glass. In an embodiment, a magnetic ring is embedded in the substrate. In an embodiment, a loop is around the magnetic ring. In an embodiment, the loop is conductive and comprises a first via through the substrate, a second via through the substrate, and a trace over a surface of the substrate, where the trace electrically couples the first via to the second via.

Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a substrate, where the substrate comprises glass. In an embodiment, a via opening is formed through a thickness of the substrate, and a first layer is over sidewalls of the via opening. In an embodiment, the first layer comprises a magnetic material. In an embodiment, a second layer is over the first layer, where the second layer is an insulator. In an embodiment, a third layer fills the via opening, where the third layer is a conductor.

The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: a core substrate having a conductive pattern on the surface and a magnetic layer for covering the core substrate not to expose the conductive pattern, wherein the magnetic layer is made of a metal-polymer composite and has a multilayer structure.