Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

An electronic component includes an element body and outer electrodes on the element body. The element body includes top and bottom opposed surfaces, and side surfaces connecting the top and bottom surfaces. An outer electrode includes a lower layer electrode on the top surface and the bottom surface, and an upper layer electrode overlying the lower layer electrode and extending from an upper side of the lower electrode onto the side surface. When viewed from a direction orthogonal to the top and bottom surfaces, an edge of the lower layer electrode is disposed at a position farther from the side surface at which the upper layer electrode is provided than a position of an edge of the upper layer electrode, and a radius of curvature of the edge of the lower electrode is larger than a radius of curvature of the edge of the upper layer electrode.

An electronic component includes an element body and outer electrodes on the element body. The element body includes top and bottom opposed surfaces, and side surfaces connecting the top and bottom surfaces. An outer electrode includes a lower layer electrode on the top surface and the bottom surface, and an upper layer electrode overlying the lower layer electrode and extending from an upper side of the lower electrode onto the side surface. When viewed from a direction orthogonal to the top and bottom surfaces, an edge of the lower layer electrode is disposed at a position farther from the side surface at which the upper layer electrode is provided than a position of an edge of the upper layer electrode, and a radius of curvature of the edge of the lower electrode is larger than a radius of curvature of the edge of the upper layer electrode.

A coil is produced by winding a wire that is clad with an electrical insulation so as to form a coil bundle of successive windings. The coil bundle has at least one first winding formed by a first end section of the wire and at least one second winding formed by a second end section of the wire. A portion of the electrical insulation of the at least one first winding is removed to expose a portion of the first end section of the wire for forming a first electrical contact of the coil, and a portion of the electrical insulation of the at least one second winding is removed to expose a portion of the second end section of the wire for forming said second electrical contact of the coil. There is also described a coil.

A coil is produced by winding a wire that is clad with an electrical insulation so as to form a coil bundle of successive windings. The coil bundle has at least one first winding formed by a first end section of the wire and at least one second winding formed by a second end section of the wire. A portion of the electrical insulation of the at least one first winding is removed to expose a portion of the first end section of the wire for forming a first electrical contact of the coil, and a portion of the electrical insulation of the at least one second winding is removed to expose a portion of the second end section of the wire for forming said second electrical contact of the coil. There is also described a coil.

A coil component, adopted to be mounted on an electronic device, includes: an element body part; a coil fixed to the element body part and constituted by a wound conductive wire; lead wires that are each extended from the conductive wire and led out from the coil, and whose tip parts are each disposed a bottom face, which is a mounting face, of the element body part; and terminal parts that are each constituted by the tip part and a metal member that is joined to the tip part on the bottom face, and also has an opening at a position overlapping the tip part in a direction intersecting the bottom face.

A coil component, adopted to be mounted on an electronic device, includes: an element body part; a coil fixed to the element body part and constituted by a wound conductive wire; lead wires that are each extended from the conductive wire and led out from the coil, and whose tip parts are each disposed a bottom face, which is a mounting face, of the element body part; and terminal parts that are each constituted by the tip part and a metal member that is joined to the tip part on the bottom face, and also has an opening at a position overlapping the tip part in a direction intersecting the bottom face.

A manufacturing method of a coil component comprising the steps of: preparing a coil assembly body in which a coil is attached on a magnetic core and a mold body which is formed with a cavity portion in the inside thereof and which includes at least one opening portion, putting a viscous admixture including magnetic powders and thermosetting resin and the coil assembly body in the cavity portion, pushing the put-in viscous admixture in the mold body, and thermally-curing the pushed-in viscous admixture and forming a magnetic exterior body which covers the coil assembly body.

A manufacturing method of a coil component comprising the steps of: preparing a coil assembly body in which a coil is attached on a magnetic core and a mold body which is formed with a cavity portion in the inside thereof and which includes at least one opening portion, putting a viscous admixture including magnetic powders and thermosetting resin and the coil assembly body in the cavity portion, pushing the put-in viscous admixture in the mold body, and thermally-curing the pushed-in viscous admixture and forming a magnetic exterior body which covers the coil assembly body.

A method to form an electrical component, comprising: overlaying a conductive and adhesive layer on a body and covering a first portion of a terminal part of a conductive element, wherein a second portion of the terminal part of the conductive element is not covered by the conductive and adhesive layer; and overlaying at least one metal layer on the conductive and adhesive layer and covering the second portion of the terminal part of the conductive element, wherein the at least one metal layer is electrically connected to the second portion of the terminal part of the conductive element for electrically connecting with an external circuit.