H01F41/076

SURFACE MOUNTED INDUCTOR AND MANUFACTURING METHOD THEREFOR

A formed body incorporating a coil by using: a coil formed by winding a conductive wire, and a formed body incorporating the coil, the formed body being formed with a sealing material containing a resin and a magnetic material. The coil is formed by winding the conductive wire so that lead-out ends are positioned at an outer periphery of a wound portion. The formed body is formed so that surfaces of the coil are partially exposed on four side surfaces of the formed body which are parallel to a winding axis of the coil, and the area of a portion of the formed body outside the outer periphery of the wound portion is almost equal to or smaller than the area of a portion of the formed body inside an inner periphery of the wound portion of the coil.

SYSTEMS, METHODS AND APPARATUS FOR USE WITH SUPERCONDUCTING BASED COMPUTING SYSTEMS
20210019646 · 2021-01-21 ·

An electrical filter includes a dielectric substrate with inner and outer coils about a first region and inner and outer coils about a second region, a portion of cladding removed from wires that form the coils and coupled to electrically conductive traces on the dielectric substrate via a solder joint in a switching region. An apparatus to thermally couple a superconductive device to a metal carrier with a through-hole includes a first clamp and a vacuum pump. A composite magnetic shield for use at superconductive temperatures includes an inner layer with magnetic permeability of at least 50,000; and an outer layer with magnetic saturation field greater than 1.2 T, separated from the inner layer by an intermediate layer of dielectric. An apparatus to dissipate heat from a superconducting processor includes a metal carrier with a recess, a post that extends upwards from a base of the recess and a layer of adhesive on top of the post. Various cryogenic refrigeration systems are described.

SYSTEMS, METHODS AND APPARATUS FOR USE WITH SUPERCONDUCTING BASED COMPUTING SYSTEMS
20210019646 · 2021-01-21 ·

An electrical filter includes a dielectric substrate with inner and outer coils about a first region and inner and outer coils about a second region, a portion of cladding removed from wires that form the coils and coupled to electrically conductive traces on the dielectric substrate via a solder joint in a switching region. An apparatus to thermally couple a superconductive device to a metal carrier with a through-hole includes a first clamp and a vacuum pump. A composite magnetic shield for use at superconductive temperatures includes an inner layer with magnetic permeability of at least 50,000; and an outer layer with magnetic saturation field greater than 1.2 T, separated from the inner layer by an intermediate layer of dielectric. An apparatus to dissipate heat from a superconducting processor includes a metal carrier with a recess, a post that extends upwards from a base of the recess and a layer of adhesive on top of the post. Various cryogenic refrigeration systems are described.

Method of manufacturing a coil electronic component

A coil electronic component includes a body and external terminals. The body includes a winding coil part and a pillar-shaped core part inserted inside of the winding coil part and formed of a magnetic metal. The external terminals are connected to the winding coil part and disposed on an external surface of the body. The body contains the magnetic metal and a resin, and the pillar-shaped core part has magnetic permeability higher than that of a portion of the body disposed outside of the winding coil part.

Method of manufacturing a coil electronic component

A coil electronic component includes a body and external terminals. The body includes a winding coil part and a pillar-shaped core part inserted inside of the winding coil part and formed of a magnetic metal. The external terminals are connected to the winding coil part and disposed on an external surface of the body. The body contains the magnetic metal and a resin, and the pillar-shaped core part has magnetic permeability higher than that of a portion of the body disposed outside of the winding coil part.

MANUFACTURING METHOD OF COIL COMPONENT AND COIL COMPONENT

A manufacturing method of a coil component comprising the steps of: preparing a coil assembly body in which a coil is attached on a magnetic core and a mold body which is formed with a cavity portion in the inside thereof and which includes at least one opening portion, putting a viscous admixture including magnetic powders and thermosetting resin and the coil assembly body in the cavity portion, pushing the put-in viscous admixture in the mold body, and thermally-curing the pushed-in viscous admixture and forming a magnetic exterior body which covers the coil assembly body.

MANUFACTURING METHOD OF COIL COMPONENT AND COIL COMPONENT

A manufacturing method of a coil component comprising the steps of: preparing a coil assembly body in which a coil is attached on a magnetic core and a mold body which is formed with a cavity portion in the inside thereof and which includes at least one opening portion, putting a viscous admixture including magnetic powders and thermosetting resin and the coil assembly body in the cavity portion, pushing the put-in viscous admixture in the mold body, and thermally-curing the pushed-in viscous admixture and forming a magnetic exterior body which covers the coil assembly body.

Surface mounted inductor and manufacturing method therefor

A formed body incorporating a coil by using: a coil formed by winding a conductive wire, and a formed body incorporating the coil, the formed body being formed with a sealing material containing a resin and a magnetic material. The coil is formed by winding the conductive wire so that lead-out ends are positioned at an outer periphery of a wound portion. The formed body is formed so that surfaces of the coil are partially exposed on four side surfaces of the formed body which are parallel to a winding axis of the coil, and the area of a portion of the formed body outside the outer periphery of the wound portion is almost equal to or smaller than the area of a portion of the formed body inside an inner periphery of the wound portion of the coil.

Surface mounted inductor and manufacturing method therefor

A formed body incorporating a coil by using: a coil formed by winding a conductive wire, and a formed body incorporating the coil, the formed body being formed with a sealing material containing a resin and a magnetic material. The coil is formed by winding the conductive wire so that lead-out ends are positioned at an outer periphery of a wound portion. The formed body is formed so that surfaces of the coil are partially exposed on four side surfaces of the formed body which are parallel to a winding axis of the coil, and the area of a portion of the formed body outside the outer periphery of the wound portion is almost equal to or smaller than the area of a portion of the formed body inside an inner periphery of the wound portion of the coil.

Metal matrix composite wire, power inductor, and preparation methods for same

A preparation method for a metal matrix composite wire includes the following steps: 1) preparing a metal inner core; 2) preparing a glass-resin mixture; 3) dissolving self-adhesive resin in a solvent to prepare a self-adhesive resin solution; 4) uniformly coating the glass-resin mixture on a surface of the metal inner core, then coating the self-adhesive resin solution on a surface of the glass-resin mixture, and performing drying at a temperature of 80 C. to 150 C.; and 5) repeating the step 4) until a thickness of the glass-resin mixture plus the self-adhesive resin reaches 2 to 10 m. When an inductor is prepared by using the composite wire, the inductor may have relatively good weather resistance, a relatively good dielectric voltage-withstand capability, as well as relatively good high-temperature resistance and electrical performance.