A preparation method for a metal matrix composite wire includes the following steps: 1) preparing a metal inner core; 2) preparing a glass-resin mixture; 3) dissolving self-adhesive resin in a solvent to prepare a self-adhesive resin solution; 4) uniformly coating the glass-resin mixture on a surface of the metal inner core, then coating the self-adhesive resin solution on a surface of the glass-resin mixture, and performing drying at a temperature of 80 C. to 150 C.; and 5) repeating the step 4) until a thickness of the glass-resin mixture plus the self-adhesive resin reaches 2 to 10 m. When an inductor is prepared by using the composite wire, the inductor may have relatively good weather resistance, a relatively good dielectric voltage-withstand capability, as well as relatively good high-temperature resistance and electrical performance.

An inductor includes a body, and outer electrodes that are formed on the body. The body includes a core that includes a base and a pillar-shaped portion that is disposed on an upper surface of the base, a coil that includes a winding portion formed by winding a conductive wire around the pillar-shaped portion and extended portions that extend from the winding portion and that are connected to the outer electrodes, and a magnetic portion that encloses the coil and at least a part of the core and that contains magnetic powder and a resin. The base has a lower surface opposite the upper surface, side surfaces, and a notch surface that is located between the side surfaces. The extended portions extend along the notch surface from positions near the upper surface of the base toward the lower surface. The notch surface is covered by the magnetic portion.

An inductor includes a body, and outer electrodes that are formed on the body. The body includes a core that includes a base and a pillar-shaped portion that is disposed on an upper surface of the base, a coil that includes a winding portion formed by winding a conductive wire around the pillar-shaped portion and extended portions that extend from the winding portion and that are connected to the outer electrodes, and a magnetic portion that encloses the coil and at least a part of the core and that contains magnetic powder and a resin. The base has a lower surface opposite the upper surface, side surfaces, and a notch surface that is located between the side surfaces. The extended portions extend along the notch surface from positions near the upper surface of the base toward the lower surface. The notch surface is covered by the magnetic portion.

A manufacturing method of a coil component comprising the steps of: preparing a coil assembly body in which a coil is attached on a magnetic core and a mold body which is formed with a cavity portion in the inside thereof and which includes at least one opening portion, putting a viscous admixture including magnetic powders and thermosetting resin and the coil assembly body in the cavity portion, pushing the put-in viscous admixture in the mold body, and thermally-curing the pushed-in viscous admixture and forming a magnetic exterior body which covers the coil assembly body.

A manufacturing method of a coil component comprising the steps of: preparing a coil assembly body in which a coil is attached on a magnetic core and a mold body which is formed with a cavity portion in the inside thereof and which includes at least one opening portion, putting a viscous admixture including magnetic powders and thermosetting resin and the coil assembly body in the cavity portion, pushing the put-in viscous admixture in the mold body, and thermally-curing the pushed-in viscous admixture and forming a magnetic exterior body which covers the coil assembly body.

A coating layer is formed on a coil made of an insulated conductive wire comprising a metal wire and an insulating layer encapsulating the metal layer, wherein the coating layer encapsulates at least one portion of the insulating layer of the insulated conductive wire so that a terminal part of the metal wire exposed from the insulating layer can be positioned firmly while going through an automatic soldering process for electrically connecting with an external circuit.

A coating layer is formed on a coil made of an insulated conductive wire comprising a metal wire and an insulating layer encapsulating the metal layer, wherein the coating layer encapsulates at least one portion of the insulating layer of the insulated conductive wire so that a terminal part of the metal wire exposed from the insulating layer can be positioned firmly while going through an automatic soldering process for electrically connecting with an external circuit.

An electronic device comprising: a body having a first portion and a second portion located below the first portion, wherein a bottom surface of the first portion and a side surface of the second portion forms an opening under the bottom surface of the first portion, wherein at least one portion of an electrode is disposed on the bottom surface of the first portion of the body, and at least one portion of the second portion of the body is disposed in an opening of a circuit board with the electrode being disposed on and electrically connected with the circuit board.

An electrical filter includes a dielectric substrate with inner and outer coils about a first region and inner and outer coils about a second region, a portion of cladding removed from wires that form the coils and coupled to electrically conductive traces on the dielectric substrate via a solder joint in a switching region. An apparatus to thermally couple a superconductive device to a metal carrier with a through-hole includes a first clamp and a vacuum pump. A composite magnetic shield for use at superconductive temperatures includes an inner layer with magnetic permeability of at least 50,000; and an outer layer with magnetic saturation field greater than 1.2 T, separated from the inner layer by an intermediate layer of dielectric. An apparatus to dissipate heat from a superconducting processor includes a metal carrier with a recess, a post that extends upwards from a base of the recess and a layer of adhesive on top of the post. Various cryogenic refrigeration systems are described.

An electrical filter includes a dielectric substrate with inner and outer coils about a first region and inner and outer coils about a second region, a portion of cladding removed from wires that form the coils and coupled to electrically conductive traces on the dielectric substrate via a solder joint in a switching region. An apparatus to thermally couple a superconductive device to a metal carrier with a through-hole includes a first clamp and a vacuum pump. A composite magnetic shield for use at superconductive temperatures includes an inner layer with magnetic permeability of at least 50,000; and an outer layer with magnetic saturation field greater than 1.2 T, separated from the inner layer by an intermediate layer of dielectric. An apparatus to dissipate heat from a superconducting processor includes a metal carrier with a recess, a post that extends upwards from a base of the recess and a layer of adhesive on top of the post. Various cryogenic refrigeration systems are described.