An inductor component comprising a base body; a coil on the base body and wound helically along an axis; and first and second external electrodes disposed on the base body and connected electrically to the coil. The base body includes a substrate having first and second main surfaces that face each other; and an insulating layer on the first main surface. The coil includes first and second coil wires respectively disposed on the first and second main surfaces and covered with the insulating layer; and first and second through wires extending through the substrate from the first main surface to the second main surface and opposite to each other with respect to the axis. The first coil wire, the first through wire, the second coil wire, and the second through wire are connected in the mentioned order, to make up at least a part of the helical.

A component carrier includes a stack with at least one electrically insulating layer structure, a structured electrically conductive layer assembled to the stack, where a part of the structured electrically conductive layer is configured as an inductive element, and a magnetic matrix embedded in the stack. The magnetic matrix at least partially surrounds the inductive element. Further, a manufacturing method is described.

A laminated coil and manufacturing method therefor are disclosed. The laminated coil comprises multiple lamination units formed after a base body is folded. The lamination unit comprises an opening, a first common edge, and a second common edge; opening directions of two adjacent lamination units are opposite; the lamination unit is separately jointed with two adjacent lamination units by means of the first common edge and the second common edge, so that the base body in a laminated state forms a spiral power-on path. The base body is sequentially folded to form multiple lamination units, so that the base body in the laminated state forms the spiral power-on path to improve energy efficiency of a rectangular coil. In addition, on the basis of the laminated coil structure, the manufacturing method provided is adopted, and high precision of laminated coil can be highly efficiently manufactured.

A coil component includes a multilayer body in which a plurality of resin insulating layers are laminated in a lamination direction and coil conductive layers disposed inside the multilayer body. The plurality of resin insulating layers includes non-photosensitive first resin insulating layers and photosensitive second resin insulating layers. The multilayer body has a section where the first resin insulating layers and the second resin insulating layers are alternately laminated.

A coil component includes a body having one surface and the other surface facing each other, and having one end surface and the other end surface facing each other in one direction; a supporting substrate embedded in the body; a coil portion disposed on the supporting substrate; a first lead-out portion connected to one end of the coil portion and exposed from the body; and a second lead-out portion connected to the other end of the coil portion and exposed from the body. The coil portion has a first pattern region facing the one surface and a second pattern region facing the other surface, each of the first and second pattern regions extends in the one direction, and a distance of the first pattern region in the one direction is shorter than a distance of the second pattern region in the one direction.

A coil component includes a multilayer body including a plurality of insulating layers and a plurality of coil conductor layers which are stacked in a stacking direction, and a first via conductor and a second via conductor that electrically connect the coil conductor layers. The first via conductor is smaller than the second via conductor.

In a superconducting coil used in an MRI apparatus, it is necessary to arrange a superconducting wire at a desired position to obtain a desired coil shape in order to obtain a temporally stable static electromagnetic field with high strength and high uniformity. A superconducting coil includes a winding frame, a spacer disposed on an outer periphery of winding frame and including a winding groove having a spiral shape and a communication groove provided between winding grooves, and includes a coil group having a superconducting wire wound in winding groove. It is therefore possible to obtain superconducting coil having a desired coil shape.

A coil module includes a coil conductor including a plurality of coil elements and a plurality of wire electrodes disposed on a circuit board, each of the plurality of coil elements including a pair of leg portions and a bridge portion connecting one end portions of the pair of leg portions together, the plurality of coil elements being disposed to cross a winding axis. A method for manufacturing the coil module includes an assembly forming step of integrating the plurality of coil elements with resin to form a coil element assembly, and a conductor forming step of mounting the coil element assembly on the circuit board to complete the coil conductor wound about the winding axis. In the conductor forming step, the resin is introduced into a die set in which the plurality of coil elements are arranged to form a block, to thus form the coil element assembly.

Provided is a coil component that includes a coil part having a planar coil that includes a winding section and an insulating section covering the winding section, and a magnetic resin layer including a magnetic filler and configured to cover the coil part. The magnetic resin layer has a first magnetic resin layer that is in contact with the coil part and a second magnetic resin layer that is laminated on the first magnetic resin layer. The second magnetic resin layer constitutes a principal surface of the magnetic resin layer, and a maximum particle size of the magnetic filler contained in the second magnetic resin layer is larger than that of the magnetic filler contained in the first magnetic resin layer.

An electronic module comprising electrical components on a circuit board and a molding body disposed on the circuit board to encapsulate the electrical components, wherein a recess is formed in the molding body for exposing an electrode of the electronic module for connecting with an external component.