A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.

A coil component includes a body having a first surface and a first end surface and a second end surface each connected to the first surface and opposing each other, a support substrate disposed in the body, a coil unit including a first coil pattern, a first lead pattern and a second lead pattern respectively disposed on a first surface of the support substrate opposing the first surface of the body, first and second slit portions respectively disposed in edge portions between the first end surface and the second end surface of the body and exposing the first and second lead patterns, and first and second external electrodes arranged in the first and second slit portions and connected to the coil unit, wherein a ratio of a line width of any one of the first and second lead patterns to a line width of any one turn of the first coil pattern satisfies 1 to 1.5.

An electronic component includes a ceramic element body including glass, and outer electrodes provided on the ceramic element body. Each of the outer electrodes includes a base electrode layer on the ceramic element body and a buffer portion to buffer an impact. The base electrode layer includes a first region that is disposed on the ceramic element body and includes the buffer portion of equal to or more than about 15 vol % and equal to or less than about 50 vol %, and a second region that covers the first region and includes the buffer portion of equal to or more than about 1 vol % and equal to or less than about 10 vol %.

A coil component includes a body including one surface, one end surface, the other end surface, one side surface, and the other side surface, a support substrate disposed in the body, a coil unit disposed on the support substrate and including first and second lead patterns, first and second slit portions respectively disposed in edge portions between each of the one end surface and the other end surface and the one surface , third and fourth slit portions respectively disposed in edge portions between each of the one side surface and the other side surface and the one surface, first and second external electrodes extending to the first and second slit portions to contact the first and second lead patterns, respectively. At least one of depths of the third and fourth slit portions is shallower than at least one of depths of the first and second slit portions.

A laminated inductor component includes a multilayer body which includes a first side surface, a second side surface and a bottom surface, and in which a plurality of insulator layers is laminated in a lamination direction; a coil conductor in helical form including a plurality of coil conductor layers wound on the insulator layers, and having a coil length parallel to the lamination direction; a first outer conductor electrically connected to a first end of the coil conductor and exposed from the first side surface and the bottom surface in the multilayer body; and a second outer conductor electrically connected to a second end of the coil conductor and exposed from the second side surface and the bottom surface in the multilayer body. A width along the lamination direction of each of the first outer conductor and the second outer conductor is shorter than the coil length.

A multilayer coil component includes a multilayer body that is formed by laminating a plurality of insulation layers and that includes a coil inside thereof and outer electrodes provided on an outer surface of the multilayer body and electrically connected to the coil. The coil is formed by connecting a plurality of coil conductors, laminated together with insulation layers, via a connection conductor. At a connection portion at which the first coil conductor and the second coil conductor, being coil conductors adjacent to each other, are connected via the connection conductor, a conductor width of the connection conductor is smaller than a conductor width of the first coil conductor and a conductor width of the second coil conductor is smaller than the conductor width of the first coil conductor.

A multilayer resin substrate includes a stacked body, and a coil including a first coil conductor pattern and a second coil conductor pattern. The second coil conductor pattern includes a wide portion with a line width larger than a line width of the first coil conductor pattern. The wide portion includes overlapping portions that overlap with the first coil conductor pattern, and non-overlapping portions that do not overlap with the first coil conductor pattern, when viewed in a Z-axis direction. Adjacent non-overlapping portions in the Z-axis direction, when viewed in the Z-axis direction, protrude in opposite directions to each other in a radial direction, with respect to the first coil conductor pattern.

A coil component according to one embodiment of the present invention includes: a first insulator body containing first magnetic metal particles; a second insulator body containing second magnetic metal particles; a first coil conductor provided in the first insulator body and wound around a coil axis for N1 turns such that intervals between adjacent turns are g1; and a second coil conductor provided in the second insulator body and wound around the coil axis for N2 turns such that intervals between adjacent turns are g2. In the embodiment, a first coil surface of the first coil conductor faces a second coil surface of the second coil conductor, and a distance T between the first coil surface and the second coil surface satisfies a relationship T≥g1×N1+g2×N2.

An insulated wire having at least one layer of coating of the wire, comprising a thermosetting resin layer, at the outer periphery of a conductor, wherein the thermosetting resin layer is comprised of thermosetting resin layers having a laminated structure formed by coating and baking a thermosetting resin varnish; and wherein, in said laminated structure, an innermost layer having contact with the conductor comprises a thermosetting resin having an imide bond and is a layer having an average thickness of more than 5 μm and 10 μm or less; a method of producing the insulated wire; a coil; a rotating electrical machine; and an electrical or electronic equipment.

A method for producing a helical, electrically conducting body. The method including: producing a helical pattern as a lost mold made of a pattern material that can be at least one of liquefied and evaporated under the action of heat; covering the helical pattern with an insulating layer; embedding the helical pattern in foundry sand; pouring a metallic casting material into the lost mold, displacing the pattern material, and bonding with the insulating layer to form a cast body; and removing the cast body, together with the insulating layer adhering thereto, from the foundry sand.