A first filler resin is disposed to cover at least an outer peripheral side of a secondary spool and a secondary coil. The second filler resin is filled inside a case and seals a cover sealant which includes a primary coil, secondary spool, a secondary coil, a center core, an outer core and the first filler resin. The connector protrudes to an outside of the case. The case has a fixing portion. The second filler resin has a lower elasticity than the first filler resin. The ignition coil is manufactured by filling the first resin inside the case, and filling the second resin after the first resin is cured.

An electromagnetic coil that can withstand high temperatures and operate efficiently and methods of making the same are provided. In preferred embodiments the electromagnetic coil comprises: a bobbin made entirely of ceramic; a coiled conductor wrapped around the bobbin; a potting resin applied to the coiled conductor during winding wherein, the resin is a siloxane polymer mixed with a metal oxide or a cyanate ester; and an overwind made of glass fiber yarn.

A transformer and a transformer machining process, including two coil units arranged side-by-side, each unit including an inner coil and an outer coil sleeved on the outside of the inner coil, an outer coil semi-conductive layer being wrapped on the outside of the outer coil and an inner coil semi-conductive layer being wrapped on the outside of the inner coil, and an insulating layer being integrally cast with the coil unit. In the transformer provided by the present application, the arrangement of the outer coil semi-conductive layer and the inner coil semi-conductive layer can effectively improve the problem of excessive local field strength caused by an irregular coil structure and solve the issue of wire package cracking caused by steel material generating heat in a pouring body; thus, the transformer has improved safety.

According to an embodiment, a scanning coil includes a bobbin, a conducting wire, and a resin for fixing the conducting wire. The bobbin includes a main body having a truncated conical cylindrical outer shape in an integrated or assembled state and made of an electrically insulating material, a wire-laying path which is formed in the main body and in which a conducting wire is installed, and a plurality of holding parts formed along the wire-laying path on an inner peripheral surface side of the main body and with axial intervals therebetween.

A resin molded body includes: resin; and a conductive member having a coil shape with a center axis; with a flat surface in at least part of the resin molded body, in which an average angle between the flat surface and the center axis is 50° or greater.

Disclosed herein is a coil component that includes a coil pattern embedded in a resin body. The resin body includes a winding core area surrounded by the coil pattern and having a first surface and a substantially flat second surface different in the circumferential direction position from the first surface, and a first surrounding area covering the first surface of the winding core area. The coil pattern includes first sections extending along the first surface of the winding core area and second sections extending along the second surface of the winding core area. One ends of the first sections are connected respectively to their corresponding one ends of the second sections. The other ends of the first sections are connected respectively to their corresponding other ends of the second sections.

Disclosed herein is a coil component that includes a coil pattern embedded in an element body and helically wound in a plurality of turns. The element body includes a support body having a cavity formed therein and a first insulating layer stacked on the support body so as to cover the cavity, thereby forming a hollow space inside the element body. The coil pattern includes a plurality of first sections formed along an inner wall of the cavity and a plurality of second sections formed on the first insulating layer. One ends of the plurality of first sections are connected respectively to their corresponding one ends of the plurality of second sections. The other ends of the plurality of first sections are connected respectively to their corresponding other ends of the plurality of second sections.

A coil component is capable of suppressing occurrence of peeling at an interface between a coil conductor and resin in a magnetic portion due to heating during mounting. The coil component includes an element body that includes a coil conductor formed by winding a conductive wire coated with an insulating film, and a magnetic portion that contains metal magnetic particles and resin, and external electrodes that are electrically connected to exposed surfaces of extended portions of the coil conductor exposed on a surface of the element body, and are arranged on the surface of the element body. The metal magnetic particles are arranged in recesses formed in a surface of the conductive wire in the extended portions of the coil conductor.

A superconducting coil according to an embodiment includes: a winding frame; a superconducting wire wound around the winding frame and having a first region and a second region facing the first region in a coil radial direction; and a resin layer located between the first region and the second region and including particles, an epoxy resin surrounding the particles, and a region existing between the particle and the epoxy resin, the region including silane containing a phenylamino group. The average particle diameter of the particles is equal to or more than 1 μm and equal to or less than 5 μm, and the volume ratio of the particles in the resin layer is equal to or more than 50% and equal to or less than 66%.

The invention, which relates to the technical field of circuit boards, specifically discloses a method for manufacturing an embedded circuit board, an embedded circuit board, and an application thereof. The method includes: providing a substrate, wherein an electronic component is embedded in the substrate, a pad is arranged on a side surface of the electronic component, and an end surface of the pad is flush with a same side surface of the substrate; forming a metallic layer on a side surface of the substrate adjacent to the pad by sputtering, evaporation, electroplating or chemical vapor deposition; and patterning the metallic layer to obtain a circuit board covered with the metallic layer on the pad, wherein the metallic layer on the pad protrudes beyond the same side surface of the substrate.