A method of manufacturing a fuse includes stacking a base plate, an at least partially conductive fabric over the base plate and a cover layer over the fabric, each with an intervening bonding layer. At least one cavity is provided on both sides of the fabric, adjoining the fabric, between the respective edge regions. In addition, the fabric includes at least one first fiber which is electrically conductive and second fibers which are non-conductive and which have a lower melting temperature than the first fiber. The method further includes heating the stacked elements to a temperature below the melting temperature of the first fiber and above the melting temperature of the second fibers.

A surface-mountable thin-film fuse component is disclosed that may include a substrate having a top surface, a first end, and a second end that is spaced apart from the first end in a longitudinal direction. The thin-film component may include a fuse layer formed over the top surface of the substrate. The fuse layer may include a thin-film fuse track. An external terminal may be disposed along the first end of the substrate and electrically connected with the thin-film fuse track. The external terminal may include a compliant layer comprising a conductive polymeric composition.

A surface mount device chip fuse including a dielectric substrate, electrically conductive first and second upper terminals disposed on a top surface of the dielectric substrate and defining a gap therebetween, a fusible element formed of solder disposed on the top surface of the dielectric substrate, within the gap, bridging the first and second upper terminals, and electrically conductive first and second lower terminals disposed on a bottom surface of the dielectric substrate and electrically connected to the first and second upper terminals, respectively, wherein a material of the dielectric substrate exhibits a de-wetting characteristic relative to the solder from which the fusible element is formed.

A surface mount fuse has a housing, a conductive fuse and a cover. The housing has an opening and a non-airtight interior space. The conductive fuse is disposed inside the non-airtight interior space. The cover covers the opening. Because the interior space of the housing is a non-airtight interior space and the conductive fuse is disposed inside the non-airtight interior space. The conductive fuse is not encapsulated by the materials with low thermal conductivity to avoid heat accumulation, so the conductive fuse may avoid the aging. Further, the internal atmospheric pressure and the external atmospheric pressure of the housing may be balanced. Therefore, the conductive fuse is not suffered from the pressure caused by the pressure difference between internal and external of the housing so that the reliability of the surface mount fuse is enhanced.

A method of manufacturing a fuse includes stacking a base plate, an at least partially conductive fabric over the base plate and a cover layer over the fabric, each with an intervening bonding layer. At least one cavity is provided on both sides of the fabric, adjoining the fabric, between the respective edge regions. In addition, the fabric includes at least one first fiber which is electrically conductive and second fibers which are non-conductive and which have a lower melting temperature than the first fiber. The method further includes heating the stacked elements to a temperature below the melting temperature of the first fiber and above the melting temperature of the second fibers.

A fuse module including a mounting block formed of an electrically insulating material, the mounting block having a rear wall extending from a base, a fuse plate including an electrically conductive bus bar disposed adjacent a rear surface of the rear wall, a fusible element electrically connected to the bus bar and disposed adjacent a front surface of the rear wall, and a fuse terminal electrically connected to the fusible element and extending onto a top of the base. The fuse module may further include an electrically conductive terminal post extending from the top of the base through the fuse terminal for facilitating connection to an electrical component.

A surface-mountable thin-film fuse component is disclosed that may include a substrate having a top surface, a first end, and a second end that is spaced apart from the first end in a longitudinal direction. The thin-film component may include a fuse layer formed over the top surface of the substrate. The fuse layer may include a thin-film fuse track. An external terminal may be disposed along the first end of the substrate and electrically connected with the thin-film fuse track. The external terminal may include a compliant layer comprising a conductive polymeric composition.

A high breaking capacity chip fuse including a bottom insulative layer, a first intermediate insulative layer, a second intermediate insulative layer, and a top insulative layer disposed in a stacked arrangement in the aforementioned order, a fusible element disposed between the first and second intermediate insulative layers and extending between electrically conductive first and second terminals at opposing longitudinal ends of the bottom insulative layer, the first intermediate insulative layer, the second intermediate insulative layer, and the top insulative layer, wherein the first and second intermediate insulative layers are formed of porous ceramic.

Provided is a fuse device used for high rating and high current applications excellent in impact resistance at the time of current interruption, and capable of preventing falling off of the case. The fuse device includes: a base member; a cover member fitted to the base member and covering a surface of the base member; and a fuse element mounted on the surface of the base member; wherein one of the base member and the cover member is provided with a side wall intersecting with the plane of the surface of the base member and including an opening formed therein, and the other of the base member and the cover member is provided with a fitting projection projecting outward from a plane intersecting with the plane of the surface of the base member and fitted into the opening of the side wall.

The present disclosure discloses a miniature super surface mount fuse, comprising: a fuse element provided with a low overload fusing point and at least two high breaking capacity fusing points connected in series with the low overload fusing point and respectively arranged on two sides of the low overload fusing point, at least two cavity plates provided with cavities, the low overload fusing point and the high breaking capacity fusing points being located at corresponding positions of the cavities; the present disclosure further provides a manufacturing method for a surface mount fuse; the miniature super surface mount fuse of the present disclosure can provide the protection for the civil consumer electronic circuit under various overload conditions without the occurrence of safety hazards such as smoking or cracking of the housing or explosion.