A power fuse for protecting an electrical load subject to transient load current cycling events in a direct current electrical power system is provided. The power fuse includes at least one fuse element assembly that includes one or more substrates, one or more sets of weak spots, and a conductor. The weak spots are formed on the substrates, and the substrates are longitudinally spaced apart from one another along the conductor. The conductor is separately provided from the substrate and the weak spots. The conductor includes one or more strips of metal having no stamped weak spot openings therein and therefore avoiding thermal-mechanical fatigue strain in the conductor when subjected to the transient load current cycling events. The conductor includes connector sections that are attached to respective ones of the sets of weak spots, and extending sections coupling the connector sections.

A high breaking capacity chip fuse including a bottom insulative layer, a first intermediate insulative layer, a second intermediate insulative layer, and a top insulative layer disposed in a stacked arrangement in the aforementioned order, a fusible element disposed between the first and second intermediate insulative layers and extending between electrically conductive first and second terminals at opposing longitudinal ends of the bottom insulative layer, the first intermediate insulative layer, the second intermediate insulative layer, and the top insulative layer, wherein the first and second intermediate insulative layers are formed of porous ceramic.

A protection device comprises a first substrate, a second substrate, a fusible element and a heating element. The first substrate comprises a first surface, and the second substrate comprises a second surface facing the first surface. The fusible element is disposed on the first surface of the first substrate, and the heating element is disposed on the second surface of the second substrate and is disposed above the fusible element. When over-voltage or over-temperature occurs, the heating element heats up to blow the fusible element and thereby providing over-voltage and over-temperature protection.

A protection device comprises a first substrate, a second substrate, a fusible element and a heating element. The first substrate comprises a first surface, and the second substrate comprises a second surface facing the first surface. The fusible element is disposed on the first surface of the first substrate, and the heating element is disposed on the second surface of the second substrate and is disposed above the fusible element. When over-voltage or over-temperature occurs, the heating element heats up to blow the fusible element and thereby providing over-voltage and over-temperature protection.

A printed fuse fabrication is provided. The printed fuse includes a low thermal conductivity ceramic substrate and a fusible element printed on the substrate. The fusible element printed on the substrate includes a series of portions of reduced printed thickness, defining weak spots for fusible operation of the fusible element, respectively separated by portions of increased printed thickness.

A printed fuse fabrication is provided. The printed fuse includes a low thermal conductivity ceramic substrate and a fusible element printed on the substrate. The fusible element printed on the substrate includes a series of portions of reduced printed thickness, defining weak spots for fusible operation of the fusible element, respectively separated by portions of increased printed thickness.

A chip type fuse excellent in resistance to climate conditions, where the fuse is able to operate stably under high temperature and high humidity environments. The fuse includes an insulative substrate; an under-glass layer formed on the insulative substrate; a fuse element formed on the under-glass layer; a pair of electrodes formed at both end sides of the fuse element; and an over-glass layer covering at least a fusing section of the fuse element; wherein the fuse element includes a layer where a first metal layer and a second metal layer are piled up, and a barrier layer consisting of a third metal layer, which covers the first metal layer and the second metal layer with a width that is wider than the width of the first metal layer and the second metal layer. The third metal layer overwraps the second metal layer and the first metal layer.

A chip type fuse excellent in resistance to climate conditions, where the fuse is able to operate stably under high temperature and high humidity environments. The fuse includes an insulative substrate; an under-glass layer formed on the insulative substrate; a fuse element formed on the under-glass layer; a pair of electrodes formed at both end sides of the fuse element; and an over-glass layer covering at least a fusing section of the fuse element; wherein the fuse element includes a layer where a first metal layer and a second metal layer are piled up, and a barrier layer consisting of a third metal layer, which covers the first metal layer and the second metal layer with a width that is wider than the width of the first metal layer and the second metal layer. The third metal layer overwraps the second metal layer and the first metal layer.

A method for manufacturing a chip fuse, comprises: a liquid film forming step for forming a liquid film of dispersion liquid having metal nanoparticles dispersed therein on a principal surface of a substrate; a fuse film forming step for forming a fuse film on the principal surface by irradiating the liquid film with laser light; and a first terminal forming step for forming first terminals that each connects to the fuse film on each of both end sides in a longitudinal direction of the fuse film on the principal surface.

A method for manufacturing a chip fuse, comprises: a liquid film forming step for forming a liquid film of dispersion liquid having metal nanoparticles dispersed therein on a principal surface of a substrate; a fuse film forming step for forming a fuse film on the principal surface by irradiating the liquid film with laser light; and a first terminal forming step for forming first terminals that each connects to the fuse film on each of both end sides in a longitudinal direction of the fuse film on the principal surface.