A single plasma nozzle of a plasma treatment station is used to treat the card surface prior to performing drop-on-demand printing on the card surface. The single plasma nozzle has a plasma discharge width that is less than the width of the card. The card and the plasma nozzle are moved relative to one another using a two direction control scheme during plasma treatment in order to be able to plasma treat a desired area of the card surface. The card and the plasma nozzle may also be moveable toward or away from one another to change the distance therebetween.

A single plasma nozzle of a plasma treatment station is used to treat the card surface prior to performing drop-on-demand printing on the card surface. The single plasma nozzle has a plasma discharge width that is less than the width of the card. The card and the plasma nozzle are moved relative to one another using a two direction control scheme during plasma treatment in order to be able to plasma treat a desired area of the card surface. The card and the plasma nozzle may also be moveable toward or away from one another to change the distance therebetween.

In one aspect, a method is described. The method may include exposing a printing surface to a first plasma in order to increase a hydrophilicity of the printing surface. The method may further include, after increasing the hydrophilicity of the printing surface, depositing a printing material on the printing surface. Additionally, the method may include, after depositing the printing material on the printing surface, exposing the printing surface to a second plasma in order to increase a hydrophobicity of the printing surface.

A plasma processing apparatus includes: a processing chamber that is capable of processing a substrate; a stage that is provided in the processing chamber and on which the substrate is placeable; a plasma generator that is provided at an upper portion of the processing chamber and supplies plasma to the processing chamber; a first shielding plate that is provided at an upper side of the processing chamber, faces the substrate placed on the stage, has an opening in at least a part of a position overlapping an outer peripheral portion of the substrate in an up-down direction, and shields the substrate from the plasma at the upper portion of the processing chamber; and an adjustment mechanism that is capable of rotating at least one of the substrate and the first shielding plate and relatively moves a position of the opening of the first shielding plate with respect to a peripheral direction of the substrate.

Various embodiments herein relate to methods and apparatus for performing anisotropic ion beam etching to form arrays of channels. The channels may be formed in semiconductor material, and may be used in a gate-all-around device. Generally speaking, a patterned mask layer is provided over a layer of semiconductor material. Ions are directed toward the substrate while the substrate is positioned in two particular orientations with respect to the ion trajectory. The substrate switches between these orientations such that ions impinge upon the substrate from two opposite angles. The patterned mask layer shadows/protects the underlying semiconductor material such that the channels are formed in intersecting shadowed regions.

Provided are a thin film formation apparatus, a sputtering cathode, and a method of forming thin film, capable of forming a multilayer optical film at a high film deposition rate on a large-sized substrate. The thin film formation apparatus forms a thin film of a metal compound on a substrate in a vacuum chamber by sputtering. The vacuum chamber is provided in its inside with targets composed of metal or a conductive metal compound, and an active species source for generating an active species of a reactive gas. The active species source is provided with gas sources for supplying the reactive gas, and an energy source for supplying energy into the vacuum chamber to excite the reactive gas to a plasma state. The energy source is provided between itself and the vacuum chamber with a dielectric window for supplying the energy into the vacuum chamber.

Methods and apparatus for physical vapor deposition are provided herein. In some embodiments, an apparatus for physical vapor deposition (PVD) includes: a linear PVD source to provide a stream of material flux comprising material to be deposited on a substrate; and a substrate support having a support surface to support the substrate at a non-perpendicular angle to the linear PVD source, wherein the substrate support and linear PVD source are movable with respect to each other along an axis that is perpendicular to a plane of the support surface of the substrate support sufficiently to cause the stream of material flux to move over a working surface of the substrate disposed on the substrate support during operation.

A system for combinatorial deposition of a thin layer on a substrate is described. The system comprises at least one deposition material source holder and a substrate holder. The system also comprises a rotatable positioning system for subsequently positioning the at least one substrate in parallel and in non-parallel configuration with at least one deposition material source. The system comprises at least one mask holder arranged for positioning a mask between at least one of the target holder and the positioning system, for allowing variation of the material flux across the at least one substrate when the combinatorial deposition is performed. The mask holder is in a fixed arrangement with respect to the at least one deposition material source holder during the combinatorial depositing.

A method for coating substrates with multiple coating layers can comprise: establishing a sub-atmospheric pressure within a coating system; transferring each substrate from outside the coating system to inside the coating system though a transfer lock; heating each substrate in a heating zone before entering a coating zone; traversing the coating zone in a first direction of movement and applying a first coating layer to each substrate in the coating zone using expanding thermal plasma type of plasma enhanced chemical vapor deposition; traversing the coating zone a second time and applying a second coating layer to each substrate in the coating zone using expanding thermal plasma type of plasma enhanced chemical vapor deposition; determining if the coating zone is occupied or vacant; if the coating zone is vacant, purging a heater zone module with inert gas; and pumping the inert gas out of the coating zone through ports located in the coating zone.

This sputtering cathode has a sputtering target having a tubular shape in which the cross-sectional shape thereof has a pair of long side sections facing each other, and an erosion surface facing inward. Using the sputtering target, while moving a body to be film-formed, which has a film formation region having a narrower width than the long side sections of the sputtering target, parallel to one end face of the sputtering target and at a constant speed in a direction perpendicular to the long side sections above a space surrounded by the sputtering target, discharge is performed such that a plasma circulating along the inner surface of the sputtering target is generated, and the inner surface of the long side sections of the sputtering target is sputtered by ions in the plasma generated by a sputtering gas to perform film formation in the film formation region of the body to be film-formed.