Apparatus and methods for improving film uniformity in a physical vapor deposition (PVD) process are provided herein. In some embodiments, a PVD chamber includes a pedestal disposed within a processing region of the PVD chamber, the pedestal having an upper surface configured to support a substrate thereon, a first motor coupled to the pedestal, a lid assembly comprising a first target, a first magnetron disposed over a portion of the first target, and in a region of the lid assembly that is maintained at atmospheric pressure, a first actuator configured to translate the first magnetron in a first direction, a second actuator configured to translate the first magnetron in a second direction, and a system controller that is configured to cause the first magnetron to translate along at least a portion of a first path by causing the first actuator and second actuator to simultaneously translate the first magnetron.

A rotary cathode assembly includes a cathode having a tube shape and defining a hollow center, a shield surrounding the cathode, the shield defining an access opening that exposes a portion of the cathode, and a rotary magnet subassembly disposed within the hollow center of the cathode. The rotary magnet subassembly includes a first magnetic component having a first magnetic field strength and a second magnetic component having a second magnetic field strength. The first magnetic field strength is greater than the second magnetic field strength. Characteristically, the first magnet component and the second magnetic component are rotatable between a first position in which the first magnetic component faces the access opening and a second position in which the second magnetic component faces the access opening. A coating system including the rotary cathode assembly is also provided.

Disclosed herein are systems, methods, and devices related to a magnet system for a sputtering device. The magnet system includes a bearing frame and a magnet holder having a first mounting area and a second mounting area. The magnet system has a first support device mounted to the magnet holder by the first mounting area and a second support device mounted to the magnet holder by the second mounting area. At least one of the first mounting area and the second mounting area are configured such that a position in which the first support device and the second support device are mounted to the magnet holder relative to each other may be adjusted. The first support device and the second support device are configured to engage with the bearing frame to form a bearing device for supporting the magnet holder.

Disclosed herein are systems, methods, devices for a magnet system that includes a housing with a housing interior. The magnet system also includes a magnet holder disposed in the housing interior and supported by the housing, preferably stationary with respect thereto. The magnet system also includes a housing cover forming a fluid-tight chamber when mated with the housing, wherein the housing cover includes a gear stage, a generator, and a rotary coupling that couples the gear stage to the generator.

Disclosed herein are devices, methods, and systems related to a magnetron-target coupling that includes a target coupling flange, a shaft fixedly coupled to the target coupling flange on a face opposite the target coupling flange, and having a first linear bearing component on a face opposite the target coupling flange. The magnetron-target coupling also includes a communication interface having a first communication electrode and a second communication electrode that are electrically coupled to each other wherein the second communication electrode is fixedly attached to the target coupling flange on a side opposite the shaft, the target coupling flange being disposed between the first communication electrode and the second communication electrode. The first communication electrode is supported such that it may be moved toward and/or away from the second communication electrode.

Disclosed herein are systems, devices, and methods for a magnet system for a sputtering device. The disclosed magnet system may include a housing having a housing interior. The magnet system may also include a magnet holder disposed in the housing interior and supported by the housing in a preferably stationary manner. The magnet system may also include a dehumidifying device adjacent to or disposed in the housing interior for drying the housing interior.

A treatment method performed by a film processing apparatus including: a first discharge electrode unit and a second discharge electrode unit respectively including magnets that form a magnetic field; and an AC power source capable of alternately switching polarities of the first discharge electrode unit and the second discharge electrode unit. In the treatment method, a predetermined surface treatment of a film F is performed by generating a plasma P while alternately switching polarities of the first discharge electrode unit and the second discharge electrode unit by using high-frequency power supplied from the AC power source.

A magnetron sputtering system includes a substrate mounted within a vacuum chamber. A plurality of cathode assemblies includes a first set of cathode assemblies and a second set of cathode assemblies, and is configured for reactive sputtering. Each cathode assembly includes a target comprising sputterable material and has an at least partially exposed planar sputtering surface. A target support is configured to support the target in the vacuum chamber and rotate the target relative to the vacuum chamber about a target axis. A magnetic field source includes a magnet array. A cathode assemblies controller assembly is operative to actuate the first set of cathode assemblies without actuating the second set of cathode assemblies, and to actuate the second set of cathode assemblies without actuating the first set of cathode assemblies.

The invention provides a sputter deposition assembly that includes a sputtering chamber, a sputtering target, and a magnet assembly. The magnet assembly includes a magnetic backing plate with a blind recess into which a moveable magnetic control body can be adjustably disposed.

The invention provides a sputter deposition assembly that includes a sputtering chamber, a sputtering target, and a magnet assembly. The magnet assembly includes a two-part magnetic backing plate that includes first and second plate segments, of which at least one is laterally adjustable. Also provided are methods of operating the sputter deposition assembly.