There is provided a cooling plate comprising: lift pins configured to support a substrate; a placing surface capable of having the substrate placed thereon; and a nozzle disposed in the placing surface and configured to blow an inert gas in a combination of a straight flow and a swirling flow toward the substrate lifted from the placing surface by the lift pins.

A sample holder for electron microscopy of air-sensitive samples for use in electron microscopy incorporates a housing and a closure assembly. The closure assembly comprises a lid comprising at least one closure arm receiving portions recessed within a flat, planar upper surface thereof. The housing comprises one or more closure arm(s) corresponding to one or more closure arm receiving portion(s). In a fully closed position, the closure arm(s) share contact with the closure arm receiving portion(s). The lid is flexibly coupled to a motor cover plate which can be actuated by a motor assembly configured to open and close the lid. The sample holder also includes an elevator assembly with a vertically adjustable sample stage which sits below the lid. The sample stage is vertically adjusted by actuation of a bellows assembly which sits beneath the sample stage.

A plasma etching chamber including within a vacuum recipient: an etching compartment with a central axis and a surrounding wall enclosing the etching compartment; a pumping compartment with a metal surrounding wall having a feed through opening; a metal partition wall traverse to the axis separating the etching compartment from the pumping compartment; a pumping slit in or along the partition wall; a workpiece support; a metal tubular arrangement through the opening, including a first part coupled to the workpiece support and a second part coupled to the metal surrounding wall, the second part being electrically conductively joint to the metal surrounding wall; an Rf feed line through the tubular arrangement connected to the workpiece support; a system ground connector at an end of the second part; distributed metal connectors establishing electric contact from the metal surrounding wall, across the pumping slit via the partition wall to the first part.

The problem addressed by the present disclosure is to provide a stage device, a charged particle beam device, and a vacuum device, with which it is possible to increase the speed and the acceleration of positioning and to suppress the leakage of a magnetic field. As a means to resolve this problem, a stage device 100 comprises a support stage 10, a floating mechanism 20, and a movement stage 30. The movement stage 30 has a propulsion-applying unit 36, and the support stage 10 has a propulsion-receiving unit 11. The stage device 100 is configured so that when the movement stage 30 moves and the propulsion-applying unit 36 contacts or approaches the propulsion-receiving unit 11, the propulsion-applying unit 36 applies propulsion in the movement direction to the propulsion-receiving unit 11.

Since wires connected to a linear motor are routed in a vacuum sample chamber, outgassing is generated from wire coating and efficiency of assembly operations is reduced. Further, there is a problem that thrust generation efficiency of the linear motor is reduced when a gap between a coil and a permanent magnet of the linear motor cannot be small. In order to solve the above problems, a linear motor for vacuum is provided, the linear motor for vacuum including: a mover having a permanent magnet; and a stator having a support member to which a coil is fixed, in which the support member includes a vacuum sealing portion that vacuum seals with a wall surface of a vacuum sample chamber, and a feed-through for supplying a current to the coil provided in the vacuum sample chamber.

Apparatus for a multi-source ion beam etching (IBE) system are provided herein. In some embodiments, a multi-source IBE system includes a multi-source lid comprising a multi-source adaptor and a lower chamber adaptor, a plurality of IBE sources coupled to the multi-source adaptor, a rotary shield assembly coupled to a shield motor mechanism configured to rotate the rotary shield, wherein the shield motor mechanism is coupled to a top portion of the multi-source lid, and wherein the rotary shield includes a body that has one IBE source opening formed through the body, and at least one beam conduit that engages the one IBE source opening in the rotary shield on one end, and engages the bottom portion of the IBE sources on the opposite end of the beam conduit.

The present disclosure provides a wafer-holding device and a deposition equipment using the same, wherein the wafer-holding device includes a carrier, a first-lid ring and a second-lid ring. The carrier has a carrying surface for carrying a wafer thereon, and includes a first aligner disposed to enclose the carrying surface. The second-lid ring is connected to the first-lid ring, and includes a second aligner. The first-lid ring has a circumference larger than that of the second-lid ring, for carrying the second-lid ring thereon. The carrier is movable, and when the carrier carries the wafer thereon toward the lid rings, the first aligner thereon contacts, engages with the second aligner of the second-lid ring, thereby the second aligner is positioned to contact a specific area of the wafer and hold the wafer on the carrier, for the deposition equipment to perform a thin-film-deposition process to the wafer.

An electron beam apparatus includes an electron optics system to generate an electron beam, an object table to hold the specimen at a target position so that a target portion of the specimen is irradiated by the electron beam, and a positioning device to displace the object table relative to the electron beam. The positioning device includes a stage actuator and a balance mass. The stage actuator exerts a force onto the object table to cause an acceleration of the object table. The force onto the object table results in a reaction force onto the balance mass. The balance mass moves in response to the reaction force. The positioning device enables the balance mass to move in a first direction in response to a component of the reaction force in the first direction.

An inspection apparatus for adjusting a working height for a substrate for multiple target heights is disclosed. The inspection apparatus includes a radiation source configured to provide a radiation beam and a beam splitter configured to split the radiation beam into multiple beamlets that each reflect off a substrate. Each beamlet contains light of multiple wavelengths. The inspection apparatus includes multiple light reflecting components, wherein each light reflecting component is associated with one of the beamlets reflecting off the substrate and is configured to support a different target height for the substrate by detecting a height or a levelness of the substrate based on the beamlet reflecting off the substrate.

An inside of a processing vessel is set to be in a vacuum atmosphere when a substrate processing is performed. A sealing member is provided with a pipe-shaped cavity formed between a low-temperature region having a relatively low temperature and a high-temperature region having a relatively high temperature when the substrate processing is performed. The sealing member is configured to seal the processing vessel.