Patent classifications
H01J2237/2804
Method of examining a sample using a charged particle microscope
The disclosure relates to a method of examining a sample using a charged particle microscope. The method comprises the steps of detecting using a first detector emissions of a first type from the sample in response to the beam scanned over the area of the sample. Then, using spectral information of detected emissions of the first type, at least a part of the scanned area of the sample is divided into multiple segments. According to the disclosure, emissions of the first type at different positions along the scan in at least one of said multiple segments may be combined to produce a combined spectrum of the sample in said one of said multiple segments. In an embodiment, a second detector is used to detect emissions of a second type, and this is used to divide the area of the sample into multiple regions. The first detector may be an EDS, and the second detector may be based on EM. This way, EDS data and EM data can be effectively combined for producing colored images.
Method of image acquisition and electron microscope
There is provided a method of image acquisition capable of reducing the effects of diffraction contrast. This method of image acquisition is implemented in an electron microscope for generating electron microscope images with electrons transmitted through a sample. The method starts with obtaining the plural electron microscope images while causing relative variations in the direction of incidence of an electron beam with respect to the sample. An image is generated by accumulating the plural electron microscope images.
Imaging device, imaging method, and imaging system
The present invention discloses an imaging device, an imaging method, and an imaging system, belonging to the field of sample image data acquisition and imaging technology. The imaging device includes: a charged particle source, a convergence system, a scanning control system, a detection module, and a spectral analysis module disposed below the detection module, where the detection module includes a plurality of pixelated detector units; and the detection module is provided with a hole thereon. The diffraction pattern is obtained by using the detection module, and the spectral analysis module performs spectral analysis on a charged particle beam passing through the hole, so as to obtain the diffraction pattern and spectral signal simultaneously by one scanning. The imaging method of the present invention is based on a hollow ptychography method, which enables toper form imaging on the diffraction pattern obtained through the detection module, with good imaging effects.
Method for detecting voids and an inspection system
A method for detecting voids in a metal line of a semiconductor device die includes: scanning an electron beam upon a selected location on the die containing the metal line; determine gray levels in an image produced by collected electrons of the electron beam backscattered from the selected location on the die; and identifying one or more voids in the metal line based on differences between the gray levels in the image.
Electron microscope and image processing method
An electron microscope includes: an electron detector which detects electrons emitted from a specimen upon irradiation of the specimen with an electron beam; an X-ray detector which detects X-rays emitted from the specimen upon irradiation of the specimen with the electron beam; and a processor which generates a three-dimensional element map based on output signals from the electron detector and the X-ray detector. The processor performs processing for generating a electron microscopic image based on the output signal from the electron detector, processing for generating a three-dimensional image of the specimen based on the electron microscopic image, processing for generating a two-dimensional element map based on the output signal from the X-ray detector, and processing for generating the three-dimensional element map by projecting the two-dimensional element map on the three-dimensional image.
HIGH FRAMERATE AND HIGH DYNAMIC RANGE ELECTRON MICROSCOPY
Methods and systems for acquiring transmission electron microscope video data on a rolling-shutter detector at an enhanced frame rate and without temporal distortions are described. Also described are methods to enhance the dynamic range of image and diffraction data acquired using a transmission electron microscope. The disclosed methods and systems may also be applicable to photon detection and imaging systems.
SCANNING ELECTRON MICROSCOPE
A scanning electron microscope is provided that is capable of displaying an image highly visible for a user when an image is displayed by visualization by combining morphological image information with component image information. A scanning electron microscope 1 for observing a sample S by irradiating the sample S with an electron ray, the scanning electron microscope 1 includes: a morphological calculation unit 24 configured to calculate intensity data of at least one of secondary electrons and reflected electrons obtained from the sample S to obtain morphological image information of the sample S; a component calculation unit 34 configured to calculate spectrum data of X-ray energy obtained from the sample S to obtain component image information of the sample S; and a display unit 50 configured to display an image visualized by combining the morphological image information with the component image information, wherein the morphological calculation unit 24 is configured to change the morphological image information in accordance with one or more morphological image parameters input by a user, and the component calculation unit 34 is configured to change the component image information in accordance with one or more component image parameters input by a user.
Hyperdimensional scanning transmission electron microscopy and examinations and related systems, methods, and devices
A material identification system includes one or more data interfaces configured to receive first sensor data generated by a first sensor responsive to a material sample, and receive second sensor data generated by a second sensor responsive to the material sample. The material identification system also includes one or more processors configured to generate a set of predictions of an identification of the material sample and a corresponding set of certainty information.
CHARGED PARTICLE ASSESSMENT TOOL, INSPECTION METHOD
A charged particle assessment tool includes: an objective lens configured to project a plurality of charged particle beams onto a sample, the objective lens having a sample-facing surface defining a plurality of beam apertures through which respective ones of the charged particle beams are emitted toward the sample; and a plurality of capture electrodes adjacent respective ones of the beam apertures and configured to capture charged particles emitted from the sample.
SCANNING ELECTRON MICROSCOPY SYSTEM AND PATTERN DEPTH MEASUREMENT METHOD
A scanning electron microscopy system that includes a primary electron beam radiation unit configured to irradiate a first pattern of a substrate having a second pattern formed in a peripheral region of the first pattern, a detection unit configured to detect back scattered electrons emitted from the substrate, an image generation unit configured to generate an electron beam image corresponding to a strength of the back scattered electrons, a designating unit configured to designate a depth measurement region in which the first pattern exists on the electron beam image, and a processing unit configured to obtain an image signal of the depth measurement region and a pattern density in the peripheral region where the second pattern exists, and to estimate a depth of the first pattern based on the obtained image signal of the depth measurement region and the pattern density in the peripheral region.