A method for conditioning a plasma processing chamber including a chuck is provided. The method comprises a plurality of cycles, wherein each cycle comprises cleaning an interior of the plasma processing chamber and the chuck and forming a silicon oxide based coating on the interior of the plasma processing chamber and the chuck. The silicon oxide based coating has a first layer and a second layer.

An etching fault is suppressed by use of an etching gas containing iodine heptafluoride. Provided is an attached substance removing method of removing an attached substance containing an iodine oxide attached to a component included in a chamber or a surface of a pipe connected with the chamber by use of a cleaning gas containing a fluorine-containing gas. Also provided is a dry etching method, including the steps of supplying an etching gas containing an iodine-containing gas into a chamber to perform etching on a surface of a substrate; and after the etching is performed on the surface of the substrate, removing an attached substance containing an iodine oxide attached to a component included in the chamber or a surface of a pipe connected with the chamber by use of a cleaning gas containing a fluorine-containing gas.

Embodiments of the disclosure generally relate to a method for dry stripping a boron carbide layer deposited on a semiconductor substrate. In one embodiment, the method includes loading the substrate with the boron carbide layer into a pressure vessel, exposing the substrate to a processing gas comprising an oxidizer at a pressure between about 500 Torr and 60 bar, heating the pressure vessel to a temperature greater than a condensation point of the processing gas and removing one or more products of a reaction between the processing gas and the boron carbide layer from the pressure vessel.

Disclosed are sulfur-containing compounds for plasma etching channel holes, gate trenches, staircase contacts, capacitor holes, contact holes, etc., in Si-containing layers on a substrate and plasma etching methods of using the same. The plasma etching compounds may provide improved selectivity between the Si-containing layers and mask material, less damage to channel region, a straight vertical profile, and reduced bowing in pattern high aspect ratio structures.

A process chamber system adapted for both vacuum process steps and steps at pressures higher than atmospheric pressure. The chamber door may utilize a double door seal which allows for high vacuum in the gap between the seals such that the sealing force provided by the high vacuum in the seal gap is higher than the opposing forces due to the pressure inside the chamber and the weight of the components.

A substrate processing device includes substrate holder, a plurality of ultraviolet irradiators, and controller. The substrate holder holds a substrate. The ultraviolet irradiators irradiate gaps between a plurality of fine structures formed on the substrate held by the substrate holder with ultraviolet rays in spectra different from each other. The controller controls the plurality of ultraviolet irradiators.

A load port device includes an installation stand, an opening and closing part, a gas introduction part, and a gas discharge part. The installation stand installs a container whose side surface has a main opening for taking in and out a wafer. The opening and closing part opens and closes the main opening. The gas introduction part introduces a cleaning gas from the main opening into the container. The gas discharge part has a bottom nozzle capable of communicating with a bottom hole formed at a position distant from the main opening more than a bottom surface middle on a bottom surface of the container. The gas discharge part is capable of discharging a gas in the container to an outside of the container.

Embodiments of the disclosure generally relate to an improved batch processing load lock chamber, a cluster tool having the same and a method of using the improved load lock chamber to clean a plurality of substrates disposed within. In one embodiment, a load lock chamber includes a chamber body, a cassette disposed in the chamber body, a remote plasma source, a plurality of inlet nozzles and a plurality of outlet ports. The chamber body has a plurality of substrate transfer slots formed therein. The cassette has a plurality of substrate storage slots and is configured to move up and down within the chamber body. The plurality of inlet nozzles is coupled to the remote plasma source and faces a processing region defined within the chamber body. The plurality of outlet ports faces the plurality of inlet nozzles across the processing region.

The production method of a substrate with a patterned film according to the present disclosure includes: a cleaning step of performing UV/ozone cleaning or oxygen plasma cleaning on a substrate with a patterned film including a substrate and a patterned film on the substrate, to obtain a first substrate with a patterned film; and a heating step of heating the first substrate with a patterned film to obtain a second substrate with a patterned film, wherein the patterned film of the first substrate with a patterned film has a contact angle decreased in the cleaning step, and the patterned film of the second substrate with a patterned film has a contact angle recovered in the heating step.

The production method of a substrate with a patterned film according to the present disclosure includes: a cleaning step of performing UV/ozone cleaning or oxygen plasma cleaning on a substrate with a patterned film to obtain a first substrate with a patterned film, the substrate with a patterned film including a substrate and a patterned film on the substrate, the patterned film containing a fluorine-containing copolymer having a specific repeating unit; and a heating step of heating the first substrate with a patterned film to obtain a second substrate with a patterned film.