The present application discloses a method of fabricating a plurality of electrodes. The method includes forming a hydrophobic pattern containing a hydrophobic material on a base substrate, the hydrophobic pattern has a first ridge on a first edge of the hydrophobic pattern, the hydrophobic pattern has a thickness at the first ridge greater than that in a region outside a region corresponding to the first ridge; removing a portion of the hydrophobic pattern outside the region corresponding to the first ridge; and forming a first electrode on a first side of the first ridge and a second electrode on a second side of the first ridge.

A method for treating a compound semiconductor substrate, in which method in vacuum conditions a surface of an In-containing III-As, III-Sb or III-P substrate is cleaned from amorphous native oxides and after that the cleaned substrate is heated to a temperature of about 250-550? C. and oxidized by introducing oxygen gas onto the surface of the substrate. The invention relates also to a compound semiconductor substrate, and the use of the substrate in a structure of a transistor such as MOSFET.

A method for producing a semiconductor device includes the steps of: providing a substrate product including a substrate and a first stacked semiconductor layer disposed on the substrate, the first stacked semiconductor layer including a plurality of semiconductor layers having different compositions that are alternately and periodically stacked with a predetermined period; forming a mask on the substrate product; and etching the first stacked semiconductor layer using the mask. The step of etching the first stacked semiconductor layer includes the steps of: optically monitoring an optical signal including a light component reflected from an etched surface of the substrate product for detecting an endpoint of etching; converting the optical signal to an electric signal to generate a monitoring signal; performing Fourier transform on the monitoring signal to generate a spectrum signal; and determining the endpoint detection of the etching by using the spectrum signal provided by the Fourier transform.

Provided are nanograting structures and methods of fabrication thereof that allow for stable, robust gratings and nanostructure embedded gratings that enhance electromagnetic field, fluorescence, and photothermal coupling through surface plasmon or, photonic resonance. The gratings produced exhibit long term stability of the grating structure and improved shelf life without degradation of the properties such as fluorescence enhancement. Embodiments of the invention build nanograting structures layer-by-layer to optimize structural and optical properties and to enhance durability.

Forming a semiconductor structure by forming a plurality of trenches in a semiconductor material, forming a plurality of non-conductive structures in the plurality of trenches, and forming a doped region of the first conductivity type. The plurality of trenches are spaced apart from each other, have substantially equal depths, and include a first trench and a second trench. The plurality of non-conductive structures include a first non-conductive structure in the first trench and a second non-conductive structure in the second trench. The doped region is formed between the first non-conductive structure and the second non-conductive structure. No region of a second conductivity type lies horizontally in between the first non-conductive structure and the second non-conductive structure.

A semiconductor device includes first wiring line patterns on a support layer, second wiring line patterns on the first wiring line patterns, and a multiple insulation pattern. The first wiring line patterns extend in a first direction and are spaced apart from each other in a second direction. The support layer includes first contact hole patterns between the first wiring line patterns that are spaced apart from each other in the first and second directions. The second wiring line patterns extend in the second direction perpendicular and are spaced apart from each other in the first direction. The multiple insulation pattern is on an upper surface of the support layer where the first contact hole patterns are not formed, arranged in a third direction perpendicular to the first direction and the second direction, and between the first wiring line patterns and the second wiring line patterns.

Microelectronic systems having embedded heat dissipation structures are disclosed, as are methods for fabricating such microelectronic systems. In various embodiments, the method includes the steps or processes of obtaining a substrate having a tunnel formed therethrough, attaching a microelectronic component to a frontside of the substrate at a location covering the tunnel, and producing an embedded heat dissipation structure at least partially within the tunnel after attaching the microelectronic component to the substrate. The step of producing may include application of a bond layer precursor material into the tunnel and onto the microelectronic component from a backside of the substrate. The bond layer precursor material may then be subjected to sintering process or otherwise cured to form a thermally-conductive component bond layer in contact with the microelectronic component.

The present application discloses a method of fabricating a plurality of electrodes. The method includes forming a hydrophobic pattern containing a hydrophobic material on a base substrate, the hydrophobic pattern has a first ridge on a first edge of the hydrophobic pattern, the hydrophobic pattern has a thickness at the first ridge greater than that in a region outside a region corresponding to the first ridge; removing a portion of the hydrophobic pattern outside the region corresponding to the first ridge; and forming a first electrode on a first side of the first ridge and a second electrode on a second side of the first ridge.

Provided are nanograting structures and methods of fabrication thereof that allow for stable, robust gratings and nanostructure embedded gratings that enhance electromagnetic field, fluorescence, and photothermal coupling through surface plasmon or, photonic resonance. The gratings produced exhibit long term stability of the grating structure and improved shelf life without degradation of the properties such as fluorescence enhancement. Embodiments of the invention build nanograting structures layer-by-layer to optimize structural and optical properties and to enhance durability.

A QLED device and manufacturing method thereof, a QLED display panel and a QLED display device are disclosed which improve the surface and internal structure of the quantum dot layer in the QLED devices. The method for manufacturing a QLED device includes forming a first electrode layer; forming a quantum dot layer on the first electrode layer; infiltrating a mixed solvent containing a bifunctional molecule into the quantum dot layer so as to improve the structure of the quantum dot layer; and forming a second electrode layer on the quantum dot layer.