An electronic power module, including at least one semiconductor component, which is arranged on a support, as well as a cooling element, which is in thermal contact with the semiconductor component, wherein the support includes a semiconductor material and, at the same time, serves as a cooling element.

In some examples, a device includes a substrate and a conductive pad extending through the substrate, wherein the substrate is coupled to the conductive pad at an interface and the substrate extends laterally from the interface to define a substrate extension. In some examples, the device also includes a semiconductor die mounted on the first side of the substrate. In some examples, the device includes a breakpoint that defines a torque tolerance that is less than a torque tolerance of the device at other points. In some examples, the device is configured to break at the breakpoint in response to force being applied to the substrate extension on the first side of the substrate.

A method of manufacturing micro pins includes forming a release layer over a substrate. A pattern layer is formed over the release layer, in which the pattern layer has a plurality of openings spaced apart to each other and through the pattern layer. A plurality of micro pins are respectively formed in the openings. The pattern layer and the release layer are removed to obtain the micro pins. An isolated conductive micro pin for connecting one or more components is also provided.

A display panel including a routable substrate is manufactured by depositing a first metallic layer for forming routable conductive traces. A second metallic layer for forming conductive interconnects is then deposited, the second metallic layer having a pattern which is different from the first metallic layer. The first metallic layer and the second metallic layer are encapsulated with a dielectric material to form the routable substrate comprising the routable conductive traces on a first side thereof. The conductive interconnects have first and second ends which are in electrical communication with the routable conductive traces and with a second side of the routable substrate which is opposite to the first side respectively. Thereafter, a plurality of LED dice is mounted on the routable conductive traces on the first side of the routable substrate for LED illumination of the display panel.

A method of manufacturing an electrode includes, printing a metal precursor ink onto a contact pad on a substrate; drying the metal precursor ink; printing a nanoparticle ink on the metal precursor ink; and consolidating the metal precursor ink and the nanoparticle ink such that metal from the precursor ink and metal from the nanoparticle ink fuse together. An electrode includes a metal precursor ink electrically contacting a contact pad; and a nanoparticle ink electrically contacting the metal precursor ink on the contact pad. An array substrate can include the electrode.

A technique for marking semiconductor devices with an identifiable mark or alphanumeric text yields a high-contrast, easily distinguishable mark on an electrical terminal of the device without impacting the device's breakdown voltage capability and without compromising the solderability and wire bondability of the terminal. This approach deposits the mark on the terminal as a patterned layer of palladium, which offers good contrast with the base metal of the terminal and maintains the solderability and bondability of the terminal.

An apparatus is provided, comprising a substrate with a frontside and a backside opposite the frontside; control circuitry disposed over the frontside of the substrate; a memory array disposed over and electrically coupled to the control circuitry; a through-silicon via (TSV) disposed under the memory array, the TSV extending through the substrate from the control circuitry to the backside of the substrate; and a bond pad disposed on the backside of the substrate and electrically coupled to the control circuitry via the TSV.

An integrated circuit (IC) package comprising a die having a front side and a back side. A solder thermal interface material (STIM) comprising a first metal is over the backside. The TIM has a thermal conductivity of not less than 40 W/mK; and a die backside material (DBM) comprising a second metal over the STIM, wherein the DBM has a CTE of not less than 18?10.sup.?6 m/mK, wherein an interface between the STIM and the DBM comprises at least one intermetallic compound (IMC) of the first metal and the second metal.

An apparatus includes a first substrate including one or more electrical connection features; and an assembly including: a second substrate; conductive features formed on the second substrate, one or more of which are electrically connected to corresponding electrical connection features of the first substrate; and an electronic component between the second substrate and the first substrate and electrically connected to one or more of the conductive features.

A bus bar includes a laminated body formed by directly laminating a flat plate-shaped first conductive plate, flat plate-shaped insulating sheet, and flat plate-shaped second conductive plate. The laminated body has main terminal connection parts into which end portions of external connection terminals are inserted, and is sealed in a sealing body, except the main terminal connection parts. The first conductive plate, insulating sheet, and second conductive plate are pressurized toward the insulating sheet in the lamination direction of the laminated body so that volumes of air spaces inside the insulating sheet (and air spaces between the first conductive plate and the insulating sheet and between the second conductive plate and the insulating sheet) are compressed.