In some embodiments, the present disclosure relates to a method for bonding a first wafer to a second wafer. The method includes aligning a first wafer with a second wafer, so the first and second wafers are vertically stacked and have substantially planar profiles extending laterally in parallel. The method further includes bringing the first and second wafers into direct contact with each other at an inter-wafer interface. The bringing of the first and second wafers into direct contact includes deforming the first wafer so that the first wafer has a curved profile and that the inter-wafer interface is localized to a center of the first wafer. The second wafer maintains its substantially planar profile throughout the deforming of the first wafer. The method further includes deforming the first wafer and/or the second wafer to gradually expand the inter-wafer interface from the center to an edge of the first wafer.

A processing apparatus includes a chuck table including a plate-shaped holding component having a predetermined region transparent from one surface to the other surface, a processing unit that processes a workpiece, a first imaging unit disposed over the chuck table to acquire a normal image of the back surface side, and a second imaging unit disposed under the chuck table to acquire a normal image of the front surface side, a display device, and a control part that executes image processing of the normal image of either the back or front surface side to cause the normal image subjected to the image processing to be displayed on the display device in the state of being inverted in a predetermined direction in order to allow the orientation of the normal image of the back surface side to correspond with the orientation of the normal image of the front surface side.

A processing method for a workpiece includes a cutting step of cutting the workpiece along streets by a cutting blade having a V-shaped tip end, to form V grooves of which shallower parts are wider than deeper parts, and a cleaning step of cleaning a back surface of the workpiece with cleaning water, after the cutting step is carried out.

There is provided a method for executing processing for a workpiece. The method includes a table imaging step of imaging a foreign object of a transparent part of a holding table having the transparent part composed of a transparent member at least in part of a holding surface and forming a foreign object taken image, a holding step of holding the workpiece by the holding table after executing the table imaging step, a workpiece imaging step of imaging the workpiece held by the holding table through the transparent part and forming a workpiece taken image, and a processing step of executing cutting for the workpiece held by the holding table by a cutting unit.

A frame jig for manufacturing a semiconductor package includes a frame body of a rectangular shape attached to a package structure of a panel shape, wherein the frame body comprises polyphenylene sulfide.

A cutting apparatus includes a holding table that has at at least a part of a holding surface a transparent section including a transparent member and that holds a workpiece, a cutting unit including a cutting blade that cuts the workpiece held by the holding table, and a cutting water nozzle that supplies cutting water during cutting of the workpiece by the cutting blade, an imaging camera that images the workpiece through the transparent section, and a removing unit that removes a liquid adhered to the transparent section. The removing unit includes a contact member positioned at a contact position for making contact with the transparent section and a retracted position, and an X-axis moving unit that relatively moves on the transparent section the contact member making contact with the transparent section.

A substrate positioning apparatus includes a holder and a rotating device. The holder is configured to hold a substrate. The rotating device is configured to rotate the holder. The rotating device includes a rotation shaft, a bearing member, a base member, a driving unit and a damping device. The rotation shaft is fixed to the holder. The bearing member is configured to support the rotation shaft in a non-contact state. The bearing member is fixed on the base member. The driving unit is configured to rotate the rotation shaft. The damping device includes a rail connected to the base member and a slider connected to the rotation shaft, and is configured to produce a damping force against a relative operation between the rotation shaft and the base member by a resistance generated between the rail and the slider.

A semiconductor manufacturing apparatus includes a supporting stage for mounting a semiconductor wafer with a protective member attached thereto, a pressing device for pressing the semiconductor wafer with a protective member attached thereto, an ultraviolet irradiation device, and a chamber for housing the supporting stage, the pressing device, and the ultraviolet irradiation device. The pressing device includes an ultraviolet transmitting plate. The pressing device drives the ultraviolet transmitting plate to generate a pressing force for pressing the semiconductor wafer with a protective member attached thereto on a supporting stage. The pressing device is moved relatively to the supporting stage such that the semiconductor wafer and the protective member are sandwiched between the ultraviolet transmitting plate and the supporting stage. The ultraviolet rays emitted from the ultraviolet irradiation device pass through the ultraviolet transmitting plate and are irradiated to the protective member.

A superstrate for planarizing a substrate. The superstrate includes a body having a first side having a contact surface and a second side having a central portion and a peripheral portion surrounding the central portion. The peripheral portion includes a recessed region.

An apparatus and method for debonding a pair of bonded wafers are disclosed herein. In some embodiments, the debonding apparatus, comprises: a wafer chuck having a preset maximum lateral dimension and configured to rotate the pair of bonded wafers attached to a top surface of the wafer chuck, a pair of circular plate separating blades including a first separating blade and a second separating blade arranged diametrically opposite to each other at edges of the pair of bonded wafers, wherein the first and the second separating blades are inserted between a first and a second wafers of the pair of bonded wafers, and at least two pulling heads configured to pull the second wafer upwardly so as to debond the second wafer from the first wafer.