The present disclosure relates to a method of fabricating a semiconductor package. The method may include forming a cavity in a package substrate and providing the package substrate and a die on a carrier tape film. Here, the carrier tape film may include a tape substrate and an insulating layer on the tape substrate, and the die may be provided in the cavity of the package substrate. The method may further include subsequently forming an encapsulation layer to cover the insulating layer and the die in the cavity and cover the package substrate on the insulating layer and removing the tape substrate from the insulating layer.

Provided is a tool changing apparatus and method capable of easily and safely changing various tools usable for a table device or a pickup device of an equipment depending on materials such as semiconductor chips or semiconductor packages, the tool changing apparatus including a target tool detachably mountable on an equipment depending on a type or size of semiconductor chips or semiconductor packages, and a coupling device mounted between the equipment and the target tool to detachably fix the target tool to the equipment, wherein the coupling device includes a stud mounted on the target tool or the equipment, and a clamping module mounted in the equipment or the target tool to clamp the stud.

A vacuum packaging manufacturing method includes forming, on a silicon wafer, a lower layer including a first metal layer and a second metal layer formed on the first metal layer, forming anchor regions by etching parts of the second metal layer and depositing a dielectric layer on the second metal layer in which the anchor regions are formed, exposing a silicon oxide film by removing a partial region of the dielectric layer and removing silicon oxide inside the second metal layer covered by the dielectric layer through the removed partial region of the dielectric layer, and depositing an upper layer on the second metal layer and forming a third metal structure on the upper layer, wherein, as the upper layer is deposited on the second metal layer, a region from which the silicon oxide inside the second metal layer is removed is in a vacuum or subvacuum state.

The assembly apparatus comprises: a main frame; a magnet head arranged on the main frame so that a semiconductor light-emitting element is self-assembled on a panel; and a vibration isolator arranged on the main frame to offset vibration of the magnet head, wherein the magnet head comprises a magnet plate assembly, which includes a magnet applying an attractive force to the semiconductor light-emitting element, and the vibration isolator comprises a weight positioned on the magnet plate assembly and may minimize the transmission, to the main frame, of vibration generated by the magnet head.

Methods, apparatus, systems, and articles of manufacture to place balls for second level interconnects of integrated circuit packages are disclosed. An example apparatus includes a ball head including a first surface having an array of holes. The array of holes hold a corresponding array of solder balls to be placed on a package substrate of an integrated circuit package. The apparatus also includes a protrusion extending away from the surface of the ball head. The protrusion is positioned relative to the holes to contact a second surface of the package substrate when the solder balls are to be placed on the package substrate.

A pick-and-place system is provided. The pick-and-place system includes: a wafer holder; a gantry over the wafer holder and comprising a stabilizer extending downwardly; a primary drive mechanism connected to the gantry and configured to drive the gantry; a secondary drive mechanism located at the gantry; and a suction head, wherein the secondary drive mechanism is connected to the suction head and configured to drive the suction head.

A press for pre-sintering or sintering silicon wafers that has a lower block and an upper block is provided. The lower block has a lower base and a lower plate. The lower plate rests exclusively on a top surface of a body of at least three compression load cells. The load cell bodies are supported by the lower base so that the top surfaces are substantially coplanar with each other.

A method and device for bonding a first substrate to a second substrate at contact surfaces of the substrates. The method includes the following steps: mounting the first substrate on a first mounting surface of a first substrate holder and mounting the second substrate on a second mounting surface of a second substrate holder, wherein the substrate holders are arranged in a chamber; contacting the contact surfaces at a bond initiation surface; and bonding the first substrate to the second substrate from the bond initiation surface to the centre of the substrates.

A header for a semiconductor package includes an eyelet having a first surface, a second surface opposite to the first surface, and a through hole penetrating the eyelet from the first surface to the second surface, and a metal block having a pedestal, and a columnar part protruding from the pedestal. The pedestal is inserted into the through hole, so that a portion of the columnar part protrudes from the first surface. The columnar part includes a device mounting surface on which a semiconductor device is mounted. An outer periphery of the pedestal is exposed around the columnar part in a plan view.

A device for aligning and bringing a large-area substrate into contact with a carrier substrate comprising: a substrate holding means for attaching the substrate ; a carrier substrate holding means for attaching the carrier substrate; detection means for detection of a peripheral contour of the substrate attached to the substrate holding means and detection of a peripheral contour of the carrier substrate attached to the carrier substrate holding means relative to a contact plane of the substrate with the carrier substrate; aligning means for aligning the substrate relative to the carrier substrate; and contacting means for bringing the substrate into contact with the carrier substrate.