A delivery roll (1) for thermal interface components, the roll comprising a carrier tape (10), an adhesive layer (10a), and a plurality of thermal interface components (20), wherein the adhesive layer (10a) is arranged on a surface of the carrier tape (10); each thermal interface component (20) comprises a top liner (22), a bottom liner (26) and a thermal interface pad (24) arranged therebetween; the carrier tape (10) supports the plurality of thermal interface components (20) by the adhesive adhering to the bottom liner (26) of each thermal interface component (20); and the plurality of thermal interface components (20) is arranged in a spaced apart manner along the carrier tape (10). The invention also relates to a manufacturing method for a delivery roll.

A stack boat tool includes a boat including a stack hole configured to accommodate first and second semiconductor packages; and a weight bar configured to be placed on the second semiconductor package during a reflow process for combining the first and second semiconductor packages, wherein the weight bar includes: a base configured to contact an upper surface of the second semiconductor package; a sidewall on the base; and a balance weight arranged on the base configured to lower a weight center of the weight bar.

A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units and a corresponding device for alignment and contact.

The present invention provides an apparatus for packing wafer cassettes, the apparatus including: a loading part to which a wafer cassette is loaded; an accessory inspecting part configured to check a recipe attached to the wafer cassette and inspect accessories of the wafer cassette; a first label attaching part configured to attach a first label to the wafer cassette on which the accessory inspection has been completed; a primary film packing part configured to receive a primary film according to the recipe and pack the wafer cassette using the primary film; a secondary film packing part configured to receive a secondary film according to the recipe and secondarily pack the wafer cassette using the secondary film; a second label attaching part configured to attach a second label to the secondary film with which the wafer cassette has been packed; and an unloading part configured to discharge the wafer cassette which has been completely packaged.

A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units, and a corresponding device for alignment and contact.

A chip packaging device is provided, which includes a main body unit, packaging unit and an aligning unit. The main body unit includes a mounting base, holder and a rotational platform. The packaging unit includes upper and lower bonding elements, upper and lower chips and a mask; a vertical axis is at the middle of the upper and the lower bonding elements, and a horizontal axis is above the lower bonding element. The aligning unit includes an aligning detector and a first focusing detector. When the lower chip and the mask are disposed on the lower bonding element, place the liquid sample in the mask and spread a packaging adhesive over the surface thereof; then, remove the mask and use the aligning detector and the first focusing detector to detect the position of the lower chip respectively, such that the chips can be aligned and bonded with each other.

Apparatus for forming a protective member on a wafer includes a stage for mounting a sheet, the stage having a frame and a chuck table supported to and surrounded by the frame, the frame having a plurality of air supply holes opening to the upper surface of the frame. A holding unit is adapted to be moved to a position opposed to the stage for holding the wafer, and a resin supply unit supplies a liquid resin to the upper surface of the sheet placed on the stage. The liquid resin is formed into the protective member. A sheet pressing pad vertically movably supported so as to be opposed to the sheet is placed on the stage. The sheet pressing pad comes into contact with a part of the sheet placed on the stage in an area inside the air supply holes, thereby pressing the sheet.

A composite structure is a stack of thinned substrates each having a plurality of active devices of the same or different technologies. An assembled carrier substrate includes die assembled into cavities formed on the carrier substrate such that when the die rest within the cavity, a gap is formed between a bottom surface of the die and a bottom surface of the cavity. This gap removes contact stress applied to the bottom of the die. Another gap can also be formed above the die. Either gap can be filled with a low-stress material. A yield improvement process functionally and physically partitions a conceptual large area die into an array of separate die modules of smaller area. The separate die modules are assembled into an array of cavities formed in a carrier substrate and interconnected to achieve a combined functionality equivalent to the functionality of the conceptual large area die.

A polyimide composition for a package structure is provided. The polyimide composition includes a polyimide precursor, a cross-linker, a photosensitizer, a first additive, a second additive and a solvent. The first additive comprises a polyether based compound, and the second additive comprises a siloxane based compound. The polyimide composition has more than 98% cyclization of the polyimide precursor when the polyimide composition is cured at a temperature range of 160 C. to 200 C.

A chip packaging device is provided, which includes a main body unit, packaging unit and an aligning unit. The main body unit includes a mounting base, holder and a rotational platform. The packaging unit includes upper and lower bonding elements, upper and lower chips and a mask; a vertical axis is at the middle of the upper and the lower bonding elements, and a horizontal axis is above the lower bonding element. The aligning unit includes an aligning detector and a first focusing detector. When the lower chip and the mask are disposed on the lower bonding element, place the liquid sample in the mask and spread a packaging adhesive over the surface thereof; then, remove the mask and use the aligning detector and the first focusing detector to detect the position of the lower chip respectively, such that the chips can be aligned and bonded with each other.