An electrostatic chuck device includes: an electrostatic chuck part having, as a main surface, a mounting surface on which a plate-shaped sample is mounted, an electrostatic attraction electrode; a base part configured to cool the electrostatic chuck part; a heater disposed in a layered manner between the electrostatic chuck part and the base part; and an adhesion layer which bonds and integrates the electrostatic chuck part and the base part together, in which the electrostatic chuck part is provided with a first through-hole, the base part is provided with a second through-hole communicating with the first through-hole, the adhesion layer is provided with a third through-hole communicating with the first through-hole and the second through-hole, a tubular insulator is fixed in the second through-hole, and an end of the insulator located on the electrostatic chuck part side is separated from the electrostatic chuck part with a space interposed therebetween.

A substrate protrusion is described. The substrate protrusion includes a top portion that extends in a first direction toward a gap between the first die and the second die and in a second direction parallel to the gap between the first die and the second die. The substrate protrusion also includes a base portion that is coupled to a substrate that extends underneath the first die and the second die.

An apparatus and method for reducing moisture within a wafer handling chamber is disclosed. The moisture reduction results in reduced oxidation of a wafer. The moisture reduction is made possible through use of valves and purging gas. Operation of the valves may result in improved localized purging.

According to one aspect of the technique of the present disclosure, there is provided a seal structure capable of sealing a space between a first structure heated by a heater and a second structure arranged so as to face the first structure, the seal structure including: a metal plate arranged in contact with the first structure; and a sealing material made of a resin material and arranged in contact with the metal plate and the second structure, wherein the space between the first structure and the second structure is sealed by the metal plate and the sealing material.

Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber includes a slit door having an arcuate profile and including a first plate slidably coupled to a second plate, wherein the first plate is configured to be coupled to an actuator, wherein the second plate has an inner surface that includes silicon, and wherein the inner surface includes a plurality of grooves.

A substrate case includes a shaft portion around which a sheet-shaped substrate having a circuit area in which a circuit manufacturing process is performed is wound; and a cover portion that accommodates the substrate in the state of being wound around the shaft portion, the shaft portion having a holding portion that holds an area different from the circuit area at a winding start portion of the substrate.

A method for manufacturing a plurality of, in particular hermetically, sealed functional elements, comprising the following steps: providing a first wafer comprising the plurality of functional elements, providing a second wafer, applying a sealing material in the form of a plurality of frame structures on a first surface of the second wafer, placing the second wafer on the first wafer or vice versa, joining the first wafer with the second wafer.

A resin supply apparatus includes a calculation unit for calculating a resin supply pattern based on the shape of a cavity of a resin sealing mold, and a supply unit for supplying a resin to an object to be coated along the resin supply pattern. The resin supply pattern has a plurality of linear paths, and one of mutually adjacent linear paths is inclined with respect to an axis of symmetry that divides a cavity in line symmetry, the other one of the mutually adjacent linear paths is inclined with respect to the one linear path, and a region between the mutually adjacent linear paths is opened to the outside of the object to be coated, at least on a side on which the other linear path is separated from the one linear path.

An irradiation assembly is provided, which is configured to heat and cure a package piece having a first region and a second region, the first region having a first adhesive material therein and the second region having a second adhesive material therein different from the first adhesive material, the irradiation assembly comprising: a light source assembly, configured to emit a first light heating the first adhesive material and to emit a second light curing the second adhesive material; and the package piece is an assembly configured to encapsulate electronic components accommodated therein, the first region is provided with the electronic components and is filled up with the first adhesive material encapsulating the electronic components, and the second region is arranged at periphery of the first region and is filled with the second adhesive material surrounding the first adhesive material.

Provided is a gas exhaust apparatus for expelling a gas in a treatment space of a wafer treatment apparatus to outside, the gas exhaust apparatus including a main exhaust line connected to the treatment space, and an auxiliary exhaust line having an end connected to the main exhaust line to supply an external air current to the main exhaust line, wherein an automatic closer is disposed at another end of the auxiliary exhaust line to close the other end of the auxiliary exhaust line in a specific situation.