A photolithography method includes dispensing a first liquid toward a target layer through a nozzle at a first distance from the target layer; moving the nozzle such that the nozzle is at a second distance from the target layer, wherein the second distance is different from the first distance; dispensing a second liquid toward the target layer through the nozzle at the second distance from the target layer; and patterning the target layer after dispensing the first liquid and the second liquid.

A state monitoring method, a state monitoring apparatus and a state monitoring system for a developing device are provided. After image information is obtained through the acquired video information of the developing device, it is determined by an analysis unit whether the image information includes nozzle anomaly information, and alarm information is issued after the nozzle anomaly information is determined. Moreover, similarity between the image information that does not include the nozzle anomaly information and second preset nozzle anomaly information is compared, and the nozzle information is stored in the analysis unit in a case that the similarity between the image information and the second preset nozzle anomaly information is greater than a first threshold.

A method of processing a wafer having a first surface and a second surface opposite the first surface is provided. The method includes the steps of: holding the second surface of the wafer such that the first surface thereof is exposed; processing an exposed first surface side of an outer circumferential edge portion of the wafer with a processing tool including a grinding stone made of abrasive grains bound together by a bonding material, thereby forming on the outer circumferential edge portion a slanted surface that is inclined to the first surface so as to be progressively closer to the second surface in a direction from a central area of the wafer toward an outer circumferential edge thereof; and coating the first surface of the wafer with a liquid material according to a spin coating process, thereby forming a resist film on the first surface of the wafer.

According to one embodiment, provided is a supply tank a supply device, and a supply system that stabilizes the liquid temperature of a process liquid to be supplied to a substrate processing device. A supply tank that supplies a process liquid to a substrate processing device includes a container that stores the process liquid, a first dividing plate that divides the container into a first region where the process liquid is introduced, and a second region that supplies the process liquid to the substrate processing device, first piping that feeds, to the second region, the process liquid introduced in the first region, and a first heater which is provided on a path through the first piping, and which heats the process liquid.

A resist material dispensing system includes a resist supply and a resist filter connected to the resist supply downstream from the resist supply. The resist material dispensing system includes a resist tank structure connected to the resist filter downstream from the resist filter and a resist pump device connected to the resist tank structure downstream from the resist tank structure. The resist tank structure is vertically arranged so that a resist material flows in a continuous downward flow from where the resist material enters the resist tank structure until the resist material exits the resist tank structure.

A substrate processing method includes: forming a coating film on a substrate by supplying a resist liquid which is photosensitive to extreme ultraviolet (EUV) light to a surface of the substrate; forming a semi-solidified film by volatilizing a solvent contained in the coating film without heating the solvent; irradiating the semi-solidified film with EUV light thereby exposing the semi-solidified film with EUV light; and supplying a developer to the substrate after the exposure of the semi-solidified film.

The inventive concept relates to an apparatus for treating a substrate. The apparatus includes a liquid supply unit that supplies a liquid to a substrate, a cover that is formed of a light transmitting material and installed on a component provided in the liquid supply unit and that provides an inspection area, and an inspection unit that inspects bubbles contained in the liquid flowing in the component provided in the inspection area. The inspection unit includes a light source that applies light toward the inspection area from outside the cover, a light receiving part that is located outside the cover and that receives the light passing through the inspection area, and an inspection part that inspects the bubbles from the light received by the light receiving part.

Provided is a heating unit including: a heating plate for heating a substrate; a heater installed in the heating plate; and a control unit for controlling the heater, in which wherein the heater includes: a first heater; and a second heater installed at a position different from a position of the first heater, and the control unit includes: a power source for transferring power to at least one of the first heater and the second heater; and a switching module for connecting the first heater and the second heater in series or connecting the first heater and the second heater in parallel.

Provided is a liquid supplying apparatus including: a trap tank for receiving a liquid from a storage bottle in which the liquid is stored and accommodating the received liquid; a pipe for connecting the storage bottle and the trap tank; and a valve installed on the pipe and for opening and closing a flow path of the pipe, in which the valve is installed closer to the storage bottle than the trap tank.

Provided is an apparatus for treating a substrate, the apparatus including: a liquid treating chamber for liquid-treating a substrate by supplying a treatment liquid to the substrate; and a liquid supply unit for supplying the treatment liquid to the liquid treating chamber, in which the liquid supply unit includes: a cabinet configured to be mounted with a bottle containing the treatment liquid; and a rotation generating part configured to rotate the bottle so that a direction in which an inlet of the bottle mounted on the cabinet faces is changed.