A substrate transfer assembly that transfers a substrate includes a robot arm configured to transfer the substrate, a laser disposed at the robot arm and emitting one or more rays of light, an image sensor disposed at the robot arm and generating a photographed picture or video including an image of a front object by the one or more emitted rays of light, and a control circuit configured to control transfer of the substrate based on the image present in the photographed picture or video.

A method of detecting a deviation amount of a substrate transport position includes: setting a temperature of a substrate support surface to the same temperature over an entire substrate support surface; etching a first etching target film formed on a substrate; acquiring a first etching rate that is an etching rate of the first etching target film; setting the temperature of the substrate support surface to be concentrically and gradually increased from a central portion to a peripheral edge portion; etching a second etching target film formed on the substrate, the second etching target film being same kind as the first etching target film; acquiring a second etching rate that is an etching rate of the second etching target film; calculating a difference between the acquired first etching rate and second etching rate; and calculating the deviation amount of the substrate transport position based on the calculated difference.

According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.

The instant disclosure includes an alignment system. The alignment system includes a first set of alignment marks, a second set of alignment marks, and a third set of alignment marks. The first, second and third alignment marks correspondingly includes a plurality of segments separated into groups. Each of the group being symmetric to a respective other group. The third set of alignment marks are diagonal to the first set of alignment marks and the second set of alignment marks.

A method of inspection and an inspection system for the film deposition process for substrates that includes glass and wafer are disclosed. The inspection system includes multiple camera modules positioned in a load lock unit of a process chamber, such as the camera modules that can capture images of the substrate in the load lock. The images are analyzed by a controller of the inspection system to determine the accuracy of robots in handling the substrate, calibration of the robots based on the analysis, and defects in the substrate caused during the handling and deposition process.

A linear electrical machine comprising a frame with a level reference plane and an array of electromagnets, connected to the frame to form a drive plane at a predetermined height relative to the reference plane. The array of electromagnets being arranged so that a series of electromagnets of the array of electromagnets define at least one drive line within the drive plane, and each of the electromagnets being coupled to an alternating current power source energizing each electromagnet. At least one reaction platen of paramagnetic, diamagnetic, or non-magnetic conductive material disposed to cooperate with the electromagnets of the array of electromagnets so that excitation of the electromagnets with alternating current generates levitation and propulsion forces against the reaction platen that controllably levitate and propel the reaction platen along at least one drive line, in a controlled attitude relative to the drive plane.

This disclosure describes systems, methods, and apparatus for non-invasive wafer chuck monitoring using a low voltage AC signal injected into a high voltage DC chucking voltage provided to a wafer chuck. Monitoring the injected signal can provide insight into the wafer chucking state and remedial actions, such as realignment of the wafer with the wafer chuck, can be carried out. Because of the low voltage nature of the AC signal, wafer chuck monitoring can be performed without influencing chucking performed by the higher voltage DC chucking voltage.

An apparatus for treating a substrate includes a plurality of heat treatment chambers and a plurality of sensors that determine whether the plurality of heat treatment chambers are mounted. The number of the plurality of sensors corresponds to the number of the plurality of heat treatment chambers. The plurality of sensors are B contact sensors.

A diagnostic system of a substrate transfer hand including a base part coupled to a hand tip portion of a robot arm and a substrate holding part coupled to the base part to hold a substrate, includes a camera which is secured to the base part and takes an image of the substrate holding part; and a diagnostic device which obtains image information of the image taken by the camera and diagnoses normality of the substrate holding part based on the image information.

A method and system for monitoring and controlling a semiconductor process are provided. The method includes: forming at least one active region on a substrate; forming a first patterned photoresist layer for defining at least two word lines on the active region after forming the active region; detecting and measuring positions and dimensions of the active region and the first patterned photoresist layer and calculating estimated areas of at least two estimated contact windows in the active region according to a predefined position of at least one bit line; adjusting the predefined position of the at least one bit line according to the estimated areas of the at least two estimated contact windows in the active region; and forming a second patterned photoresist layer on the substrate. The second patterned photoresist layer corresponds to the adjusted predefined position of the at least one bit line.