A substrate processing apparatus including a frame defining a chamber with a substrate transport opening and a substrate transfer plane defined therein, a valve mounted to the frame and being configured to seal an atmosphere of the chamber when closed, the valve having a door movably disposed to open and close the substrate transport opening, and at least one substrate sensor element disposed on a side of the door and oriented to sense substrates located on the substrate transfer plane.

A substrate processing method capable of improving thin film uniformity on a substrate by controlling the position of a substrate supporting apparatus includes: a first operation of moving the substrate supporting apparatus in a first direction by a first predetermined distance; a second operation of moving the substrate supporting apparatus in a second direction by a second predetermined distance; a third operation of moving the substrate supporting apparatus in the second direction by the first predetermined distance; and a fourth operation of moving the substrate supporting apparatus in the first direction by the second predetermined distance, wherein the second direction may be opposite to the first direction.

A substrate processing apparatus includes: a spin chuck, on which a substrate is mounted, the spin chuck rotating the substrate; At least one of a chemical liquid nozzle configured to provide a chemical liquid to a surface of the substrate and a deionzed water nozzle configured to provide a deionized water to a surface of the substrate; and a laser device configured to emit a pulse waver laser beam having a period of 10.sup.−9 seconds or less for etching an edge of the substrate.

In one embodiment, a semiconductor manufacturing apparatus includes a housing configured to house a substrate, and a plasma supplier configured to supply plasma on an upper face of the substrate. The apparatus further includes a support configured to support the substrate and a ring surrounding an end portion of the substrate, the ring including a member having a lower face on which a mark to be photographed is provided. The apparatus further includes equipment configured to photograph the mark or receive an image of the mark through a wiring that includes a first end portion able to be disposed in a vicinity of the mark and a second end portion different from the first end portion.

A substrate support assembly arranged in a chamber includes: a support plate including a first surface on which a substrate is seated; a driver configured to tilt the support plate such that the first surface is inclined with respect to a reference surface by a lower inclination angle; and a controller configured to control the driver such that the lower inclination angle is adjusted based on an upper inclination angle formed by the inclination of the gas supplier coupled to the upper surface of the chamber with respect to the reference surface.

A high-precision air floating motion platform and method for wafer test, wherein the air floating motion platform includes: a base; a beam installed on the base; a sliding table configured to carry a wafer; a linear motor configured to drive the sliding table to slide along the beam; at least three sensors configured to detect a vertical straightness of the wafer; air bearings including a first air bearing, a second air bearing and a third air bearing; the air bearings being configured for suspension of the sliding table; and a compensation device configured to compensate the vertical straightness of the wafer based on a real-time data detected by the sensors.

A system for assembling fields from a source substrate onto a second substrate. The source substrate includes fields. The system further includes a transfer chuck that is used to pick at least four of the fields from the source substrate in parallel to be transferred to the second substrate, where the relative positions of the at least four of the fields is predetermined.

A processing apparatus includes a chuck table for sucking and holding a workpiece and a camera unit imaging the workpiece. The chuck table includes a light passing portion that passes light. The light passing portion includes a first region that overlaps with the workpiece and has a first mirror face that reflects light that advances from the first region into the light passing portion. The camera unit can image the workpiece by detecting light reflected by the first mirror face after having been reflected by the workpiece held by the chuck table and advanced into the light passing portion.

The present disclosure provides a substrate treating apparatus having improved efficiency and productivity. The substrate treating apparatus of the present disclosure comprises a process chamber having a treating space therein, a transfer robot comprising a robot hand for loading and unloading a substrate into and out of the treating space and gripping the substrate, and a teaching buffer for aligning the robot hand, wherein the teaching buffer comprises a teaching plate for providing a reference point, and at least one camera looking at the teaching plate, wherein the camera captures the reference point of the teaching plate, wherein the transfer robot aligns the robot hand with the reference point using the camera.

Provided is a substrate treating facility, including: an index module on which a substrate is loaded or unloaded; a treating module for performing a substrate treatment on the substrate loaded into the index module; a buffer chamber disposed between the index module and the treating module; and a differential pressure measuring device for measuring a differential pressure between a pressure at a specific position inside the substrate treating facility and a pressure at a reference position serving as a reference, in which the differential pressure measuring device is provided outside the substrate treating facility.