Disclosed is droplet ejecting apparatus that ejects droplets of a functional liquid onto a workpiece to draw a pattern. The droplet ejecting apparatus includes: a workpiece table; a droplet ejecting head configured to eject the droplets onto the workpiece placed on the workpiece table; a movement mechanism configured to relatively move the workpiece table and the droplet ejecting head in a main scanning direction and a sub-scanning direction; and a control unit configured to: detect a position of the workpiece or a position of the workpiece table while relatively moving the workpiece table and the droplet ejecting head along a plurality of scanning lines extending in the main scanning direction and set side by side in the sub-scanning direction; and create, based on a detection result, a correction table that indicates a correlation between a position of the movement mechanism and a positional correction amount of the workpiece table.

The current disclosure describes techniques for managing vertical alignment or overlay in semiconductor manufacturing using machine learning. Alignments of interconnection features in a fan-out WLP process are evaluated and managed through the disclosed techniques. Big data and neural networks system are used to correlate the overlay error source factors with overlay metrology categories. The overlay error source factors include tool related overlay source factors, wafer or die related overlay source factors and processing context related overlay error source factors.

The present invention relates to defects inspection on a silicon carbide wafer or an epitaxial layer thereon to determine the location, and adjustment of the location of the scribe line, which is a separation line forming a gap between adjacent dies. The present invention can obtain high efficiency and economy in the semiconductor process using wafers containing various defects in the surface and thin film, by minimizing the effect of wafer defects on the final yield of the semiconductor chip or die, via adjustment of scribe line positions arranged on the wafer.

In a method executed in an exposure apparatus, a focus control effective region and a focus control exclusion region are set based on an exposure map and a chip area layout within an exposure area. Focus-leveling data are measured over a wafer. A photo resist layer on the wafer is exposed with an exposure light. When a chip area of a plurality of chip areas of the exposure area is located within an effective region of a wafer, the chip area is included in the focus control effective region, and when a part of or all of a chip area of the plurality of chip areas is located on or outside a periphery of the effective region of the wafer, the chip area is included in the focus control exclusion region In the exposing, a focus-leveling is controlled by using the focus-leveling data measured at the focus control effective region.

A substrate treating method includes measuring an alignment state of a substrate placed on a hand of a transfer unit that transfers the substrate, transferring the substrate to a substrate alignment unit by the transfer unit when the alignment state of the substrate is faulty, aligning a location of the substrate by the substrate alignment unit, and temporarily correcting the location of the substrate before the substrate is loaded on the substrate alignment unit when it is measured in the measuring of the alignment state that the alignment state of the substrate exceeds a sensor reading range.

An apparatus, system and method for providing an optical coupler. The optical coupler may be a miniature fiber optic coupler, which may include: a housing having dimensions of less than 4 mm×4 mm×4 mm; an input into the housing capable of receiving a fiber optic sending line; a sending line prism having dimensions of less than 2 mm×2 mm within the housing in optical communication with the sending line; a receiving line prism having dimensions of less than 2 mm×2 mm in optical communication with the sending line prism at a corresponded angle in a range of 30 to 60 degrees and capable of receiving a signal incoming on the sending line and redirecting the received signal; and a receiving line in optical communication with the receiving line prism and capable of receiving and outputting the redirected received signal.

A transfer system for transferring multiple microelements to a receiving substrate includes a main pick-up device, a testing device, and first and second carrier plates. The testing device includes a testing platform, a testing circuit, and multiple testing electrodes electrically connected to the testing circuit. The main pick-up device is operable to releasably pick up the microelements from the first carrier plate and position the microelements on the testing electrodes. The testing device is operable to test the microelements to distinguish unqualified ones of the microelements from qualified ones. The main pick-up device is operable to release the qualified ones of the microelements to the receiving substrate.

A manufacturing apparatus of a semiconductor device includes a stage, a bonding head, a copying mechanism mounted on the bonding head, and a controller executing adjustment processing. In the adjustment processing, the controller causes a facing surface of the bonding head to abut against a reference surface of the stage after setting the copying mechanism to a locked state, then presses the facing surface against the reference surface after switching the copying mechanism to a free state, and after that, switches the copying mechanism to the locked state.

An arrangement apparatus includes a stage, an arrangement part, and a control part. The stage supports a substrate. The arrangement part holds a die and arranges multiple dies on the substrate supported by the stage. The control part has a map data indicating arrangement positions of the dies and generated based on a positional relationship among patterns formed by an exposure apparatus, and controls, based on the map data, relative positions between the stage and the arrangement part when arranging the dies on the substrate.

An information acquisition system configured to acquire information upon a substrate processing apparatus configured to process a substrate held by a substrate holder includes a base body, instead of the substrate, held by the substrate holder; and multiple position sensors provided at the base body such that detection directions thereof are different from each other, and each configured to detect a position of a common detection target object located outside the base body.