A computer-implemented method executed on a processor for detecting whether a wafer has been tampered during a semiconductor fabrication process, the method including, at a plurality of patterning steps where lithographic patterns are defined and etched or at a plurality of fabrication processing steps, marking, via an identification tool, each die with an unclonable identification in a memory array, inspecting, via an inspection tool, each of the dies, and removing compromised wafers from a wafer pool during the semiconductor fabrication process.

An apparatus, system and method for storing die carriers and transferring a semiconductor die between the die carriers. A die stocker includes a rack enclosure with an integrated sorting system. The rack enclosure includes storage cells configured to receive and store die carriers having different physical configurations. A transport system transports first and second die carriers between a first plurality of storage cells and a first sorter load port, where the transport system introduces the first and second die carriers to a first sorter. The transport system transports third and fourth die carriers between a second plurality of storage cells and a second sorter load port, where the transport system introduces the third and fourth die carriers to a second sorter. The first and second die carriers have a first physical configuration, and the third and fourth die carriers have a second physical configuration, different than the first physical configuration.

An apparatus for aligning and orienting a semiconductor die (“die”) to be transferred to a substrate. The apparatus includes an alignment mechanism to align the die to be queued among a plurality of die; and an orientation mechanism to orient the die using magnetism to be positioned in a predetermined position prior to transfer to the substrate. The alignment mechanism further transports the die to be positioned at a feeding position for supply to a die transfer system.

A wafer supply device configured to supply a wafer divided into multiple dies to a supply position, the wafer supply device includes a die information storage section configured to store the number of dies for each rank allocated to each of the dies, a block information acquisition section configured to acquire a condition of dies to be mounted on a block provided on a board to be conveyed, a required block number acquisition section configured to acquire a required number of dies to be mounted on the block, and a producible number calculation section configured to calculate a number of blocks that can be produced based on a content stored in the die information storage section and a content acquired by the block information acquisition section and the required block number acquisition section.

A substrate etching system includes a support to hold a wafer in a face-up orientation, a dispenser arm movable laterally across the wafer on the support, the dispenser arm supporting a delivery port to selectively dispense a liquid etchant onto a portion of a top face of the wafer, and a monitoring system comprising a probe movable laterally across the wafer on the support.

An apparatus for the manufacture of at least two arrangements of solar cell pieces is provided. The apparatus includes at least one positioning device configured for positioning two or more solar cell pieces on a support device for forming the at least two arrangements, wherein the apparatus is configured to allocate the two or more solar cell pieces to a respective arrangement of the at least two arrangements based on one or more properties of the two or more solar cell pieces.

A wafer sorting and stoking system provides automated storage and retrieval of wafer frames carrying semiconductor wafers. A wafer frame cassette is received at a transfer port from a transfer system. A robot arm retrieves the wafer frames from the cassette and stores each wafer frame in a respective storage slot in one of a plurality of storage towers. The storage location of each wafer frame is recorded. Each wafer frame can be selectively retrieved and loaded into a wafer frame cassette by the robot arm for further processing.

Disclosed is a method for manufacturing a semiconductor light emitting device, the method including: providing a mask having a plurality of openings on a base; placing semiconductor light emitting chips on exposed portions of the base through the openings, respectively, by a device carrier which recognizes a shape of the mask and calibrates position for a semiconductor light emitting chip to be seated; and supplying an encapsulant to each of the openings, with the mask serving as a dam.

A device may detect a semiconductor wafer to be transferred from a source wafer carrier to a target wafer carrier, and may cause a light source to illuminate the semiconductor wafer. The device may cause a camera to capture images of the semiconductor wafer after the light source illuminates the semiconductor wafer, and may perform image recognition of the images of the semiconductor wafer to determine whether an edge of the semiconductor wafer is damaged. The device may cause the semiconductor wafer to be provided to the source wafer carrier when the edge of the semiconductor wafer is determined to be damaged, and may cause the semiconductor wafer to be provided to the target wafer carrier when the edge of the semiconductor wafer is determined to be undamaged.

Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause phototransistors or electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. A set of micro-object may be analyzed. Geometric properties of the set of micro-objects may be identified. The set of micro-objects may be divided into multiple sub-sets of micro-objects based on the one or more geometric properties and one or more control patterns.