In certain embodiments, a system includes: an inspection station configured to receive a die vessel, wherein the inspection station is configured to inspect the die vessel for defects; a desiccant station configured to receive the die vessel from the inspection station, wherein the desiccant station is configured to add a desiccant to the die vessel; a bundle station configured to receive the die vessel from the desiccant station, wherein the bundle station is configured to combine the die vessel with another die vessel as a die bundle; and a bagging station configured to receive the die bundle from the bundle station, wherein the bagging station is configured to dispose the die bundle in a die bag and to heat seal the die bag with the die bundle inside.

The present disclosure provides a wafer-measuring apparatus and a wafer-transferring method of the wafer-measuring apparatus. The wafer-measuring apparatus includes a body, a wafer-measuring unit, a wafer storage and a robot. The robot is disposed on the body and configured to: move a wafer from a first wafer container to the wafer-measuring unit, wherein the first wafer container is disposed on a load port area; and move the wafer from the wafer-measuring unit to the wafer storage after the wafer-measuring unit measures the wafer.

A chip matching system and a corresponding method are provided. The method defines a plurality of first electronic components in a first wafer as various grades of chips and defines a plurality of second electronic components in a second wafer as various grades of chips, and then grades of the first electronic components and the second electronic components are matched to generate target information, and finally the first and second electronic components are integrated in the same position according to the target information. Therefore, the highest-grade chips can be arranged in a multi-chip module to optimize the quality of the multi-chip module.

The present invention reveals an alignment platform for aligning electronic component precisely to the operation position during testing or hot pressing processes. The alignment platform makes a rotor to rotate by a driving apparatus. The rotor has an eccentric axle to where a connecting member is disposed. The connecting member is moved by the eccentric axle, driving an active plate to move. The eccentric axle, the driving apparatus, the connecting member, and the active plate are configured to move under control in a micro or nano meter scale. Thus, precisely alignment of electronic component can be achieved. Floating mechanism of electronic component transmission apparatus or electronic component handler may be dismissed for lowering cost and prolonging lifetime.

A dynamic routing method and apparatus for an Overhead Hoist Transport (OHT) system are disclosed. The present disclosure in some embodiments provides a dynamic routing method for an OHT system, including generating a Q table of records of at least one Q value which is a time for a vehicle to move through an edge between two adjacent nodes to a node other than the two adjacent nodes, measuring a transit time of the vehicle when assigned a destination node and passing a transit edge between a current node and next node, extracting target edges to be updated according to the transit time from a plurality of edges, and differentially updating Q values for the target edges according to distances to the transit edge partially based on the transit time, the Q values for the target edges being time values for the vehicle to move through the target edges to the destination node.

An electronic device is disclosed. The electronic device comprises: a transfer device capable of moving, to a target substrate, a plurality of LEDs arranged in a transfer substrate, and arranging same; a storage unit in which feature information of each of the plurality of LEDs is stored; and a processor for controlling the transfer device such that each of a plurality of LEDs is arranged in an arrangement location on the target substrate of each of a plurality of LEDs on the basis of the stored feature information.

An end effector for transferring a tray is described. The end effector includes an end effector base attached to a vertical drive column of a tray engine. The end effector further includes a slide having multiple arms that are attached to the end effector base to support the tray, when present. The arms of the slide enable the tray to slide along a length of the end effector base. The arms face each other and extend along the length of the end effector base.

A Czochralski-type method for sorting wafers obtained by cutting a single-crystal silicon ingot, the method being implemented when the wafers are in an as-cut state or in a shaped-surface state. The method includes a) measuring the majority free charge carrier concentration in an area of each wafer; calculating the thermal donor concentration in the area of each wafer, on the basis of the majority free charge carrier concentration; calculating the charge carrier lifetime limited by the thermal donors in the area of each wafer, on the basis of the thermal donor concentration; determining a bulk lifetime value for the charge carriers in each wafer on the basis of the lifetime limited by the thermal donors; comparing the bulk lifetime value or a normalised bulk lifetime value with a threshold value; and discarding the wafer when the bulk lifetime value or the normalised bulk lifetime value is lower than the threshold value.

One or more processors determine a predicted sorting bin of a semiconductor device, based on measurement and test data performed on the semiconductor device subsequent to a current metallization layer. A current predicted sorting bin and a target sorting bin are determined by a machine learning model for the semiconductor device; the target bin include higher performance semiconductor devices than the predicted sorting bin. The model determines a performance level improvement attainable by adjustments made to process parameters of subsequent metallization layers of the semiconductor device. Adjustments to process parameters are generated, based on measurement and test data of the current metallization layer of semiconductor device, and the adjustment outputs for the process parameters of the subsequent metallization layers of the semiconductor device are made available to the one or more subsequent metallization layer processes by a feed-forward mechanism.

A method of manufacturing a stacked substrate by bonding a first substrate and a second substrate, including a step of determining, based on information about curving of each of the first substrate and the second substrate, whether or not the first substrate and the second substrate satisfy a predetermined condition, and, a step of bonding the first substrate and the second substrate if the predetermined condition is satisfied. The stacked substrate manufacturing method described above includes a step of estimating, based on the information, an amount of misalignment which occurs after the first substrate is bonded to the second substrate and the predetermined condition may include that the amount of misalignment is equal to or less than a threshold.