Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.

A method and system are provided for optimizing operational throughput for a semiconductor device handler having multiple stages. The method includes receiving semiconductor devices for testing at an input carrier buffer, and operating the handler in the testing of semiconductor devices. The method also includes recording operational throughput characteristics for each operational stage of the handler, and analyzing recorded operational throughput characteristics for each operational stage of the handler. Additionally, the method includes determining which operational stage of the handler has the most limiting constraint causing a lowest operational drumbeat, and adjusting operational parameters of the operational stage of the handler that has the lowest operational drumbeat to increase the operational drumbeat. The method further includes repeating the method until an operational state is achieved such that further adjustments to operational parameters result in a decrease in the operational throughput for the semiconductor device handler.

A substrate loading station including a frame forming a chamber configured to hold a controlled environment, a transfer robot connected to the frame and one or more substrate cassette holding locations each capable of having a substrate cassette holder disposed within the frame. Each of the one or more substrate cassette holding locations being configured to removably support a respective substrate cassette in a predetermined position for communication with the transfer robot to effect substrate transfer between a respective cassette and the transfer robot where the one or more substrate cassette holding locations are configured to effect the interchangeability of one or more substrate cassette holders with other substrate cassette holders for changing a substrate cassette holding capacity of the substrate loading station.

The substrate processing apparatus includes: a plurality of processing modules; a transfer mechanism; a controller; and a setting unit. The processing module processes with respect to the substrate. The transfer mechanism transfers the substrate ejected from the transfer container. The controller outputs control signals for transferring the substrate to the plurality of processing modules along a previously set transfer path through the transfer mechanism sequentially, and for processing with respect to the substrate in the processing module of a transfer destination based on a processing recipe in which a processing order and a processing condition are set. The setting unit sets a content of a non-recipe operation except for operations set in the processing recipe and a performing timing for performing the non-recipe operation by a control operation of the controller every processing module. The non-recipe operation is performed with respect to the processing modules.

According to one embodiment, there is provided a substrate processing apparatus including a processing unit and a manipulator. The processing unit processes a substrate. The manipulator is for maintenance. The manipulator is placed near the processing unit.

A manufacturing line for a semiconductor device according to the invention is a manufacturing line for manufacturing a semiconductor device by circulating a workpiece along a conveyance route on which a plurality of treatment devices are arranged. The conveyance route includes a first route on which the treatment devices with a large number of times of treatment are arranged, and a second route on which the treatment devices with a small number of times of treatment are arranged. Besides, the conveyance route makes a changeover between the conveyance of the workpiece that has moved along the first route to the first route in a continuous manner, and the conveyance of the workpiece that has moved along the first route to the second route.

The article transport vehicles are equipped with wireless tags that transmit tag information, and an article transport facility includes: a transport control apparatus that controls the entrance of the vehicles into the control area such that the number of vehicles that are present in one control area is no greater than a control number; a plurality of access points; and a position detection apparatus that detects the respective positions of the vehicles with an accuracy with which a plurality of positions in the control area are distinguishable, based on the same tag information that has been received by the access points. The transport control apparatus permits a number of vehicles, the number being greater than the control number, to enter the control area if a predetermined permission condition is satisfied, based on the positional information that indicates the position of each vehicle.

A method is provided for self-aligned multi-patterning on a semiconductor workpiece using an integrated sequence of processing steps executed on a common manufacturing platform hosting one or more film-forming modules, one or more etching modules, and one or more transfer modules. A workpiece having a mandrel pattern formed thereon is received into the common manufacturing platform. A sidewall spacer pattern is formed based, at least in part, on the mandrel pattern, the sidewall spacer pattern having a plurality of second features separated by a second pitch distance with the first pitch distance being greater than the second pitch distance. The integrated sequence of processing steps is executed within the common manufacturing platform without leaving the controlled environment and the transfer modules are used to transfer the workpiece between the processing modules while maintaining the workpiece within the controlled environment. Broadly, forming a sidewall spacer pattern based on the mandrel pattern.

A traveling vehicle system includes a determiner to determine, upon receiving from a traveling vehicle an entry permission request for an area under control, whether or not a remaining number of vehicles to a maximum number of vehicles allowed to enter the area is equal to or less than a threshold value, and an entry permitter to temporarily hold the entry permission request from the traveling vehicle if the determiner determines the threshold value has not been exceeded and upon arrival of the traveling vehicle at an entry region for the area, grant the traveling vehicle permission to enter the area if a sum of a number of traveling vehicles within the area and a number of traveling vehicles already permitted to enter the area is less than a maximum number of vehicles, but does not grant entry permission if the sum has reached the maximum number of vehicles.

A method includes receiving a plurality of operations in a sequence recipe. The plurality of operations are associated with processing a plurality of substrates in a substrate processing system. The method further includes identifying a plurality of completion times corresponding to the plurality of operations. Each completion time of the plurality of completion times corresponds to completion of a respective operation of the plurality of operations. The method further includes simulating the plurality of operations by setting a virtual time axis to each of the plurality of completion times to generate a schedule for the sequence recipe. The method further includes causing, based on the schedule, the plurality of substrates to be processed or performance of a corrective action.