A substrate processing apparatus performs a drying process for drying a substrate with a liquid film formed on a pattern formation surface thereof, using a processing fluid in a supercritical state. The substrate processing apparatus includes a processing container, a holder, and a processing liquid supply. The processing container accommodates the substrate. The holder holds the substrate inside the processing container. The processing liquid supply supplies a processing fluid into the processing container. Further, the holder includes a base, a plurality of support members, and a lifting mechanism. The base is disposed below the substrate. The plurality of support members are provided on the base, and support the substrate from below. The lifting mechanism moves the plurality of support members up and down.

Provided is a transport control device for integrating and controlling different types of transport means and a logistics transport system including the same. The logistics transport system comprises a plurality of first transport devices disposed in a semiconductor manufacturing plant and for transporting a transported object; a plurality of second transport devices different in type from the plurality of first transport devices; and a transport control device for controlling the plurality of first transport devices and the plurality of second transport devices, wherein the transport control device integrates and operates different types of transport devices to transport the transported object.

A processing apparatus includes a chamber having a gas inlet and a gas outlet; a plasma generator; and a controller configured to cause: (a) etching a silicon-containing film to a first depth with a first plasma in the chamber, thereby forming a recess in the silicon-containing film; (b) forming a protection film on a side wall of the recess with a second plasma in the chamber, the protection film having a first thickness at an upper portion of the recess and a second thickness at a lower portion of the recess, the second thickness being smaller than the first thickness; and (c) etching the silicon-containing film to a second depth with the third plasma in the chamber, the second depth being greater than the first depth.

A method includes generating a queue of a plurality of operations in a sequence recipe, the plurality of operations being associated with substrate processing. The method further includes sorting the plurality of operations in the queue based on a plurality of completion times corresponding to the plurality of operations. The method further includes, for each operation of the plurality of operations in the queue, obtaining a next operation in the queue and setting a virtual time axis to time leap to a corresponding completion time of the next operation until each operation of the plurality of operations in the queue are completed to generate a schedule for the sequence recipe.

The present disclosure provides a host computer, and a control system and method of a machine. The host computer includes a control unit, a service configuration unit, and a functional flow unit. The control unit is configured to control a lower level computer to execute items of a functional flow of the machine. The service configuration unit is configured with action instruction information used to execute the functional flow of the machine and configured to interact with the control unit. The functional flow unit stores items of the functional flow of the machine edited by a user and is configured to interact with the control unit. A technical solution of the host computer and the control system and method of the machine may realize an editable function of the functional flow of the machine to improve flexibility, convenience, and a degree of automation of addition/modification of the functional flow. As such, manpower and time cost may be saved.

A substrate processing apparatus for processing a substrate includes a setting device that sets a plurality of recipe items including operation conditions of the substrate processing apparatus and a recipe generating device that acquires a plurality of recipe models obtained by changing values of the plurality of recipe items and experimenting or simulating a processing result of the substrate and analyzes the plurality of recipe models to generate a recipe, the recipe generating device combining a part or all of the plurality of recipe models to generate the recipe such that a calculation value of a processing result of the substrate by the recipe satisfies a predetermined condition.

A metrology method for use in determining one or more parameters of a patterned structure, the method including providing raw measured TEM image data, TEM.sub.meas, data indicative of a TEM measurement mode, and predetermined simulated TEM image data including data indicative of one or more simulated TEM images of a structure similar to the patterned structure under measurements and a simulated weight map including weights assigned to different regions in the simulated TEM image corresponding to different features of the patterned structure, performing a fitting procedure between the raw measured TEM image data and the predetermined simulated TEM image data and determining one or more parameters of the structure from the simulated TEM image data corresponding to a best fit condition.

Described herein are techniques related to a semiconductor fabrication process that facilitates the enhancement of systemic conformities of patterns of the fabricated semiconductor wafer. A semiconductor wafer with maximized systemic conformities of patterns will maximize the electrical properties and/or functionality of the electronic devices formed as part of the fabricated semiconductor wafer. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

An information management device for managing information in a mounting system that mounts a component after determining usability of the component when the component is picked up from a wafer divided into multiple components and is mounted on a base material, includes an information storage section that stores various types of information, an information acquisition section that acquires information on a pickup position of the component on the wafer and information on a determination result of usability of the component, and an information processing section that stores information obtained by associating the pickup position of the component with the determination result of the usability in the information storage section.

A method of the present disclosure includes: plating a plurality of substrates using a substrate holder; determining a total number of substrates that have been plated using the substrate holder until a failure occurs in the substrate holder; determining a first processable number and a second processable number; generating a first data set constituted by a combination of first condition data and the first processable number, the first condition data representing a state of a component of the substrate holder; generating a second data set constituted by a combination of second condition data and the second processable number, the second condition data representing a state of a component of the substrate holder; and optimizing a parameter of a prediction model constituted by a neural network using training data including the first data set and the second data set.