A system and method include receiving, by a processing device of a manufacturing execution system (MES), a target profile associated with products, wherein the target profile comprises an identifier of a block of steps in a process to make the products and a target work-in-progress (WIP) value representing a target number of parts waiting to be processed by a group of machines used in the block of steps to make the products, identifying a move list or an assignment list that, when issued, causes the group of machines to operate to maintain a number of parts waiting for processing to match the target WIP value of the target profile.

A transport vehicle includes: a traveler; a transferer that is mounted on the traveler and receives or delivers an article from or to a transfer destination; and an antenna that is provided so that at least the position or the posture thereof can be changed to follow the action of the transferer, and that performs wireless communication with another device.

Examples of a substrate treatment apparatus includes a chamber, a substrate support stage located inside the chamber, an elevation device that moves the substrate support stage up and down, a gate valve provided between the chamber and an adjacent chamber that is adjacent to the chamber, and a chamber state controller including a processor and a memory configured to cause the processor to execute a program stored in the memory, or including a dedicated circuitry, to move the elevation device and the gate valve before a next substrate treatment is performed in the chamber, in a state in which no substrate is present in the chamber.

A method of detecting failure causes in semiconductor processing systems may include receiving an indication of a failure in a semiconductor processing system and providing the indication of the failure as a query to a network representing the semiconductor processing system. The network may include nodes representing on-wafer effects and component functions, and relationships between the nodes that represent causal dependencies between the component functions and the on-wafer effects. The method may also include calculating a change in probabilities assigned to nodes representing the component functions resulting from the query, and generating an output indicating a probability of at least one of the component functions as a cause of the failure.

The inventive concept provides a sensor station. The sensor station includes a body providing an inner space for storing a substrate-type sensor; a power source unit installed at the body and configured to transmit a power to the substrate-type sensor; a processing unit installed at the body and configured to process a data measured by the substrate-type sensor; and a communication unit installed at the body and configured to exchange a data with the substrate-type sensor and a server of a substrate treating system.

Systems and methods of optimizing wafer transport and metrology measurements in a fab are provided. Methods comprise deriving and updating dynamic sampling plans that provide wafer-specific measurement sites and conditions, deriving optimized wafer measurement paths for metrology measurements of the wafers that correspond to the dynamic sampling plan, managing FOUP (Front Opening Unified Pod) transport through the fab, transporting wafers to measurement tools while providing the dynamic sampling plans and the wafer measurement paths to the respective measurement tools before or as the FOUPs with the respective wafers are transported thereto, and carrying out metrology and/or inspection measurements of the respective wafers by the respective measurement tools according to the derived wafer measurement paths. Quantum computing resources may be used to solve the corresponding specific optimization problems, to reduce the required time, improve the calculated solutions and improve the fab yield and accuracy of the produced wafers.

A method includes estimating a replacement time of a consumable part of a processing device, specifying a timing after substrate processing of the processing device is completed in a period before the replacement time as a replaceable timing of the consumable part, estimating a movement time period required for the part transporting device to move to a position of the processing device requiring the replacement, and estimating a preparation time period required for preparation until the part transporting device moved to the position of the processing device requiring the replacement becomes a state in which the consumable part is replaceable. The method further includes transmitting a replacement instruction to the part transporting device at a timing before a timing that is earlier than the replaceable timing by a total time of the movement time period and the preparation time period, and instructing the replacement of the consumable part.

The subject of this invention is a method for testing the data and control interface of individual machines intended for interconnection in an inline system for solar cell production. Furthermore, an Interface-Tester suitable for executing the testing method is disclosed. The method for testing comprises the steps of feeding a dummy workpiece to the tested machine and connecting the interface tester to the standard interface of the machine. Consecutively the interface tester sends controlling signals to the machine and receives the signals from the tested machine. The received signals are compared to reference signals and evaluated. The interface tester comprises a standard interface for coupling the machines in an inline system for solar cell production. Furthermore, the interface tester is equipped with at least one CPU, a volatile and/or non-volatile memory, communication modules, couplers and connectors and at least one human-machine interface.

There is provided a technique capable of improving the throughput by suppressing stagnation of a substrate in a transfer chamber and by reducing unused time. According to one aspect thereof, a substrate processing apparatus includes: a plurality of process chambers in which a substrate among a plurality of substrates is capable of being processed; a transfer chamber provided with a transfer structure capable of transferring the substrate; and a controller configured to be capable of: (a) calculating a substrate transferable time during which the substrate is capable of being transferred to each of the plurality of process chambers; (b) selecting a substrate transfer path to a process chamber among the plurality of process chambers such that the substrate transferable time is the shortest among those calculated in (a); and (c) performing a control of the transfer structure based on the substrate transfer path selected in (b).

A traveling vehicle system includes a traveling track, a working track, a mover to move a traveling vehicle between a first position on the traveling track and the working track, and a transportation controller configured or programmed to control at least the traveling vehicle and the mover. The transportation controller is configured or programmed to transmit to the traveling vehicle a first command to travel to the first position and transmit to the mover a third command to move the traveling vehicle stopped at the first position to the working track after or simultaneously when transmitting to the traveling vehicle stopped at the first position a second command to lead a state in which the traveling vehicle is movable by the mover.