An apparatus includes a substrate; circuit components disposed on the substrate; and a location identifier layer over the circuit, wherein the location identifier layer includes one or more section labels for representing physical locations of the circuit components within the apparatus.

Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.

A material processing system includes a particle beam column for directing a particle beam at a first processing region and a laser scanner for directing a laser beam at a second processing region. A method for operating the material processing system includes: scanning a first mark placed on an object with the particle beam; scanning the first mark with the laser beam for a first time and producing a second mark on the object with the laser beam; scanning the second mark with the particle beam; and scanning the first mark with the laser beam for a second time and removing material of the object with the laser beam based on the scanning of the second mark with the particle beam.

A tape roll includes a cylindrical core, a strip-shaped tape wound on the core, and a marking portion that represents type information of the strip-shaped tape and that is applied to an inner peripheral surface of the core. Preferably, the type information of the strip-shaped tape includes at least one piece of type information selected from a group consisting of a width, a length, a material, an adhesive force, and a shelf life of the tape, and the marking portion has slots or an identification code representing the at least one piece of type information. A tape mounter for bonding, to a workpiece, the tape which is wound on the core of the tape roll is also disclosed.

A laser processing apparatus includes a laser oscillator configured to emit a laser beam, a slit configured to narrow a width of the laser beam emitted from the laser oscillator to a width corresponding to a dividing groove to form the dividing groove of a predetermined width, a slit moving mechanism configured to move the slit in a direction corresponding to a width direction of the dividing groove, and an adjusting unit configured to make the center of the slit and the cross-sectional center of the laser beam entering the slit coincide with each other in a direction in which the slit moving mechanism moves the slit.

Disclosed herein are techniques for transferring particles in a pattern. In one implementation, a particle-transferring system includes a first substrate comprising a first surface configured to support a plurality of particles in a non-uniform pattern, and a particle transfer unit configured to remove the plurality of particles from the first surface in response to the plurality of particles being within a first gap. The system also includes a second substrate configured to remove the plurality of particles from the particle transfer unit and secure the plurality of particles to the second surface in response to the plurality of particles being within a second gap. The particle transfer unit is configured to transfer the plurality of particles and maintain the non-uniform pattern regardless of the positions of the plurality of particles, which are not predefined to fit features of the particle transfer unit.

A laser processing apparatus includes a laser beam applying unit for applying a laser beam to a workpiece, an image capturing unit for producing a captured image of the workpiece that includes a captured image of light emitted from the workpiece when the laser beam is applied to the workpiece by the laser beam applying unit, and a control unit. The laser beam applying unit includes a laser oscillator for emitting a laser beam and a condensing lens for converging the laser beam onto the workpiece. The control unit includes a determining section for determining a state of the laser beam applied to the workpiece, on the basis of the shape of the captured image of the light that is included in the captured image of the workpiece.

An apparatus includes a substrate; circuit components disposed on the substrate; and a location identifier layer over the circuit, wherein the location identifier layer includes one or more section labels for representing physical locations of the circuit components within the apparatus.

Systems, devices, and methods for providing unique die patterning are provided herein. A wafer substrate can include a plurality of individual semiconductor dies and a plurality of incomplete dies arranged along an edge of the wafer substrate. Each of the individual semiconductor dies and each of the incomplete dies can include a bond pad array. Each of a subset of the incomplete dies can also include a marking that may be identical or generally similar to the bond pad array. The subset of the incomplete dies, each of which includes both the bond pad array and the marking, can serve as target sites for a die attach machine during an auto-referencing process. In some embodiments, the bond pad arrays and the markings on the subset of the incomplete dies are formed via a photolithography patterning process using the same reticle.

A wafer sample segmentation apparatus is disclosed and the wafer sample segmentation apparatus according to some embodiments comprises a supporting part supporting one region of a sample of a wafer while facing one surface of the sample; a pressing part facing the other surface facing one surface of the sample and capable of pressing a pair of pressing regions positioned on both sides of one region in the sample by being moved toward the sample; an indentation part facing the other surface of the sample and capable of moving toward the sample to indent a segmentation region positioned between the pair of pressing regions in the sample; and a measuring part capable of measuring a pressing force acting on the sample along the pressing direction of the pressing part.