The present invention provides a wafer notch leveling device, which comprises a body, a first rotating portion, a positioning portion, a power portion, and a control unit. The body has a support portion and a pivot portion is provided at each terminal of the body, the pivot portion pivotally connects a plurality of supporting arms. The first rotating portion and the positioning portion are electrically connected with the power portion. The power portion is electrically connected with the control unit. Especially, when a plurality of wafers are placed on the support portion and fixed, the first rotating portion is electrically connected with the power portion through the control unit to drive the plurality of wafers to rotate the wafers, a notch on the wafer is leveled through the positioning portion.

A glass substrate is laminated with a substrate containing silicon to thereby form a laminated substrate. The glass substrate has a concave surface and a convex surface and has one or more marks that distinguish between the concave surface and the convex surface.

A workpiece management method includes a frame unit forming step of forming a frame unit with a workpiece supported in an opening of an annular frame via a resin sheet, a printing step of, after performing the frame unit forming step, printing identification information of the workpiece on the resin sheet in an area between an outer periphery of the workpiece and an inner periphery of the annular frame, a processing step of processing the workpiece by a processing machine, a separation step of separating the processed workpiece from the resin sheet, and a storage step of storing the resin sheet from which the workpiece has been separated. A sheet cutting machine suitable for use in the workpiece management method is also disclosed.

A laser processing apparatus has a control unit including an inspection modified layer former detecting a provisional orientation flat of a bare wafer and applying a laser beam of a predetermined output power level to the bare wafer depending on the direction of the provisional orientation flat thereby to form a modified layer for detecting the crystal orientation closely to an outer edge of the bare wafer, and a crack detector detecting a crack extending from the modified layer toward a Y-axis and an exposed surface of the bare wafer, providing the modified layer extends along an X-axis in an image captured of the modified layer. If the crack detector detects no crack, the control unit determines the modified layer with no crack extending therefrom as extending parallel to the crystal orientation of the bare wafer.

A method for marking a semiconductor substrate at the die level for providing unique authentication and serialization includes projecting a first pattern of actinic radiation onto a layer of photoresist on the substrate using mask-based photolithography, the first pattern defining semiconductor device structures and projecting a second pattern of actinic radiation onto the layer of photoresist using direct-write projection, the second pattern defining a unique wiring structure having a unique electrical signature.

A system includes a substrate support on which to receive a transparent substrate, a non-contact sensor adapted to detect and image a dot pattern etched on a front surface of the transparent substrate, and a processing device attached to the non-contact sensor. The processing device may determine, using imaging data from the non-contact sensor, an orientation of a right-angled edge of the dot pattern. The processing device may determine, based on the orientation of the right-angled edge, whether a front surface of the transparent substrate is facing up or facing down. The processing device may also direct a robot to transfer the transparent substrate to a processing chamber dependent on whether the front surface of the transparent substrate is facing up or facing down.

A method for semiconductor fabrication includes mounting a wafer onto a first wafer table. The first wafer table includes a first set of pins that support the wafer, the first set of pins having a first pitch between adjacent pins. The method further includes forming a first set of overlay marks on the wafer; and transferring the wafer onto a second wafer table. The second wafer table includes a second set of pins having a second pitch between adjacent pins. The second set of pins are individually and vertically movable, and the second pitch is smaller than the first pitch. The method further includes moving a portion of the second set of pins such that a remaining portion of the second set of pins supports the wafer and the remaining portion has the first pitch between adjacent pins.

A wafer processing method includes preparing a holding table having a blade clearance portion formed therein so as to correspond to a notch of a wafer, holding the wafer by the holding table so as to make the notch of the wafer correspond to the blade clearance portion of the holding table, reducing the diameter of the wafer by cutting the wafer by a cutting blade along an outer peripheral edge of the wafer in a state in which an end of the cutting blade is positioned below the holding surface of the holding table and therefore removing at least a part of the notch portion, and forming a second notch in the wafer by cutting the wafer in a thickness direction by the cutting blade along the blade clearance portion of the holding table.

A mark printing device includes a driving unit driving along a driving rail of an overhead hoist transport, a printing unit being configured to print on the driving rail a mark for guiding a motion of a vehicle, a data processing unit receiving design data including design information of the driving rail and first information on a position and type of the mark from a server, an encoder unit being configured to calculate a rotation amount of a servo motor provided in the driving unit to detect a current position of the driving unit and a driving distance of the driving unit, and a control unit being configured to control the driving unit and the printing unit to print the mark on the driving rail by using the design data and second information on the current position and the driving distance of the driving unit.

A semiconductor failure analysis device includes an analysis part that analyzes a failure place in a semiconductor device; a marking part that irradiates the semiconductor device with laser light; a device arrangement part in which a wafer chuck, which holds the semiconductor device and on which an alignment target is provided, moves relative to the analysis part and the marking part; and a control part that outputs commands. The control part moves the wafer chuck to a position at which the analysis part is capable of taking an image of the alignment target, then outputs an alignment command that causes the marking part to be aligned with the analysis part with the alignment target as a reference, and irradiates the semiconductor device with laser light in a state in which a positional relationship between the marking part and the analysis part is maintained.