A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).

Disclosed herein are techniques for transferring particles in a pattern. In one implementation, a particle-transferring system includes a first substrate comprising a first surface configured to support a plurality of particles in a non-uniform pattern, and a particle transfer unit configured to remove the plurality of particles from the first surface in response to the plurality of particles being within a first gap. The system also includes a second substrate configured to remove the plurality of particles from the particle transfer unit and secure the plurality of particles to the second surface in response to the plurality of particles being within a second gap. The particle transfer unit is configured to transfer the plurality of particles and maintain the non-uniform pattern regardless of the positions of the plurality of particles, which are not predefined to fit features of the particle transfer unit.

A method for securing and verifying semiconductor wafers during fabrication includes receiving a semiconductor wafer after a layer of features has been patterned thereon. At least one security mark is formed at one or more locations embedded within a backside of the semiconductor wafer by implanting an inert species at the one or more locations. At a subsequent point in fabrication and/or after fabrication of the semiconductor wafer has completed the backside of the wafer is inspected for detection of the at least one security mark. If the at least one security mark is not detected at an expected location within the backside of the semiconductor wafer a determination is made that the semiconductor wafer has been compromised.

A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).

A method for printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, positioning a substrate within the support structure, printing one or more anchors on the substrate and the support structure by printing and curing the liquid precursor material to secure the substrate to the support structure, and printing one or more device structures on the substrate while anchored by printing and curing the liquid precursor material.

Printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, printing one or more alignment markers by printing the liquid precursor material outside the support structure and curing the liquid precursor material, positioning a substrate within the support structure, performing a registration of the substrate using the one or more alignment markers, and printing one or more device structures on the substrate while registered by printing and curing the liquid precursor material.

According to the embodiment, the template includes: a first substrate; a pattern projected from a principal surface of the first substrate; a first mark projected from the principal surface of the first substrate, the first mark surrounding a recessed portion disposed in an inside region of the first mark; and a second mark recessed from the principal surface of the first substrate; wherein the first mark is provided with, in a planar view, an inner portion having a pair of first sides opposed to each other and a pair of second sides opposed to each other, the first sides extending in a first direction along the first substrate, the second sides extending in a second direction intersecting with the first direction along the first substrate, the inner portion surrounding the recessed portion of the first mark, and an outer portion having a pair of third sides opposed to each other and a pair of fourth sides opposed to each other, the third sides extending in the first direction, the fourth sides extending in the second direction, the outer portion being an outer edge portion of the first mark.

A method for printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, printing one or more alignment markers by printing the liquid precursor material outside the support structure and curing the liquid precursor material, positioning a substrate within the support structure, performing a registration of the substrate using the one or more alignment markers, and printing one or more device structures on the substrate while registered by printing and curing the liquid precursor material.

A method for fabricating a wafer includes providing a wafer table, wherein the wafer table includes support pins that are movable with respect to each other; identifying features of a layer to be formed on a wafer, wherein the features have a tolerance for overlay errors below a threshold; moving one or more support pins based on the features; after the moving of the one or more support pins, mounting the wafer on the wafer table; and after the mounting of the wafer on the wafer table, forming the layer on the wafer.

According to one embodiment, there is provided a substrate bonding apparatus including a first suction stage, a second suction stage, and a pressing member. The first suction stage sucks a first substrate. The second suction stage is arranged so as to face the first substrate. The second suction stage sucks the second substrate. The pressing member is capable of deforming the first substrate sucked on the first suction stage so as to be convex toward the second suction stage side. The pressing member has a marking structure on a distal end side.