The integrated circuit assembly can include: a semiconductor and a substrate (e.g., PCB). The integrated circuit assembly can optionally include: a compliant connector, a thermal management, and a securing element. The semiconductor 210 can include a first alignment feature. (e.g., orifice). The substrate can include a second alignment feature (e.g., alignment target) and conductive pads. The substrate can optionally include a cavity.

A glass substrate is laminated with a substrate containing silicon to thereby form a laminated substrate. The glass substrate has a concave surface and a convex surface and has one or more marks that distinguish between the concave surface and the convex surface.

A semiconductor device is provided. The semiconductor device includes: a plurality of alignment dies, each including a diced first base substrate and at least one alignment mark on the diced first base substrate; a second base substrate; and a bonding film on the second base substrate. An alignment die of the plurality of alignment dies are attached on the bonding film on an alignment region of the second base substrate for aligning the second base substrate.

Methods and systems for positioning a specimen and characterizing an x-ray beam incident onto the specimen in a Transmission, Small-Angle X-ray Scatterometry (T-SAXS) metrology system are described herein. A specimen positioning system locates a wafer vertically and actively positions the wafer in six degrees of freedom with respect to the x-ray illumination beam without attenuating the transmitted radiation. In some embodiments, a cylindrically shaped occlusion element is scanned across the illumination beam while the detected intensity of the transmitted flux is measured to precisely locate the beam center. In some other embodiments, a periodic calibration target is employed to precisely locate the beam center. The periodic calibration target includes one or more spatially defined zones having different periodic structures that diffract X-ray illumination light into distinct, measurable diffraction patterns.

A method for marking a semiconductor substrate at the die level for providing unique authentication and serialization includes projecting a first pattern of actinic radiation onto a layer of photoresist on the substrate using mask-based photolithography, the first pattern defining semiconductor device structures and projecting a second pattern of actinic radiation onto the layer of photoresist using direct-write projection, the second pattern defining a unique wiring structure having a unique electrical signature.

Embodiments of the present disclosure generally relate to an optically transparent substrate, comprising a major surface having a peripheral edge region with an orientation feature formed therein, and a texture formed on the peripheral edge region, the texture having an opacity that is greater than an opacity of the major surface.

An alignment mark, a semiconductor device, and fabrication methods of the alignment mark and the semiconductor device are provided. The method includes providing a first base substrate, and forming a plurality of alignment marks on the first base substrate. The method also includes dicing the first base substrate to form a plurality of alignment dies. Each alignment die includes a diced first base substrate and at least one alignment mark diced from the plurality of alignment marks on the diced first base substrate. In addition, the method includes providing a second base substrate for aligning, and forming a bonding film on the second base substrate. Further, the method includes attaching an alignment die of the plurality of alignment dies to the bonding film on an alignment region of the second base substrate using a die attach process.

A method and system for marking a workpiece at a marking location by infusing colorant into targeted surface material within a region of the workpiece via laser-induced chemical etching are disclosed. The system includes a laser subsystem for generating a pulsed laser output and a transport subsystem including a medium containing the colorant mounted immediately adjacent the marking location to transfer the colorant to the targeted surface material upon impact by the pulsed laser output. The system also includes a delivery subsystem for irradiating the medium and the targeted surface material with the pulsed laser output to melt the targeted surface material to obtain molten material and to transfer the colorant from the medium to the molten material. The molten material allows the transferred colorant to thermally diffuse into and chemically bond to the molten material. Each laser pulse creates a microtextured colorized spot of material on the workpiece.

A mark printing device includes a driving unit driving along a driving rail of an overhead hoist transport, a printing unit being configured to print on the driving rail a mark for guiding a motion of a vehicle, a data processing unit receiving design data including design information of the driving rail and first information on a position and type of the mark from a server, an encoder unit being configured to calculate a rotation amount of a servo motor provided in the driving unit to detect a current position of the driving unit and a driving distance of the driving unit, and a control unit being configured to control the driving unit and the printing unit to print the mark on the driving rail by using the design data and second information on the current position and the driving distance of the driving unit.

The integrated circuit assembly can include: a semiconductor and a substrate (e.g., PCB). The integrated circuit assembly can optionally include: a compliant connector, a thermal management, and a securing element. The semiconductor 210 can include a first alignment feature. (e.g., orifice). The substrate can include a second alignment feature (e.g., alignment target) and conductive pads. The substrate can optionally include a cavity.