The present disclosure provides a method and an apparatus of handling a control wafer, a method of testing by using a control wafer, a computer-readable storage medium and an electronic device, and relates to the technical field of semiconductor equipment. The method of handling a control wafer includes: setting different identification numbers for multiple reaction chambers; determining slot numbers of control wafers according to the identification numbers of the reaction chambers; and distributing the control wafers according to the slot numbers of the control wafers and the identification numbers of the reaction chambers.

Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.

The present disclosure relates to a substrate transfer system, which includes a main body, a tray cassette base, a tray aligner, a tray robot, a substrate cassette base, a substrate aligner, a substrate robot and a Bernoulli robot. The tray can be transferred to the tray aligner by the tray robot. The substrate can be transferred to the substrate aligner by the substrate robot. By the Bernoulli robot, the substrate can be transferred from the substrate aligner to the tray on the tray aligner.

Disclosed is a pad structure for transferring a flat panel that includes a circular adhesive force adjustment pattern having a predetermined diameter in the center of the pad body, and a ring-shaped microciliated member having a circumferential surface surrounding the first adhesive force adjustment pattern and including a plurality of cilia spaced apart from one another, and thus provides advantages of improving the adhesive force per unit area due to the functions of the pad, without a separate vacuum device, of being easily and simply attached to and detached from the blade at a desired position thereon, and of maximizing productivity by easily and smoothly performing quality control, preventive maintenance, and inventory management of the pad for transferring a flat panel based on serial number standardization (product information standardization).

A wafer transfer unit includes at least one data processing unit, which is configured at least for a registration and/or processing of sensor data of at least one sensor, allocated to at least one sub-component of a wafer transfer system, of a sensor module, in particular includes at least one wafer processing module of the wafer transfer system, includes at least one wafer interface system of the wafer transfer system with a wafer transport container and a loading and/or unloading station for a loading and/or unloading of the wafer transport container and/or of the wafer processing module, includes at least one wafer transport container transport system of the wafer transfer system and/or includes at least one wafer handling robot of the wafer transfer system.

A system includes a plurality of masks and a scanner device. A pattern of a semiconductor device is defined by each of the plurality of masks in a photolithography process. A first mask of the plurality of masks includes a first identification code configured to distinguish the first mask from remaining masks of the plurality of masks. The scanner device is configured to read the first identification code to select the first mask from the plurality of mask, in order to form the pattern of the semiconductor device on a substrate according to the first mask.

When a carrier storing a plurality of dummy wafers therein is transported into a heat treatment apparatus, the carrier is registered as a dummy carrier exclusive to the dummy wafers. A dummy database in which a treatment history of each of the dummy wafers is associated with the carrier is held in a storage part. The treatment history of each of the dummy wafers registered in the dummy database is displayed on a display part of the heat treatment apparatus. An operator of the heat treatment apparatus views the displayed information to thereby appropriately grasp and manage the treatment history of each of the dummy wafers.

A semiconductor wafer transport apparatus having a transport arm and at least one end effector. An optical edge detection sensor is coupled to the transport arm and is configured so as to register and effect edge detection of a wafer supported by the end effector. An illumination source illuminates a surface of the wafer and is disposed with respect to the optical edge detection sensor so that the surface directs reflected surface illumination, from the illumination source, toward the optical edge detection sensor, and optically blanks, at the peripheral edge of the wafer, background reflection light of a background, viewed by the optical edge detection sensor coincident with linear traverse of the wafer supported by the at least one end effector. The peripheral edge of the wafer is defined in relief in image contrast to effect edge detection coincident with traverse of the wafer supported by the end effector.

The instant disclosure discloses a workpiece container system comprising a storage assembly. The storage assembly comprises a seat member and a seat cover. The seat member defines a workpiece receiving region that encompasses a geometric center region thereof, configured to receive a workpiece; wherein a lower diffuse inducing component is provided on the seat member within a planar projection of the workpiece yet offsets the geometric center region. The seat cover is configured to engage the seat member at a periphery region around the workpiece receiving region thereof, so as to cooperatively form an enclosure for housing the workpiece; wherein an upper diffuse inducing component is provided on the seat cover over the planar projection of the workpiece and protectively overlaps the geometric center region of the seat member.

There is provided a technique that includes: a boat including plural slots to hold at least one substrate; a process furnace that processes the at least one substrate held in the boat; a boat elevator that raises and lowers the boat; a transfer device that transfers the at least one substrate between plural carriers where the at least one substrate is stored and the boat; and a controller capable of controlling the boat elevator and the transfer device, wherein the controller sets plural positions where the transfer device transfers the at least one substrate to the boat elevator, and select the positions to minimize a number of shifts among the positions of the boat elevator or total time taken during the shifts.