An apparatus includes a substrate; circuit components disposed on the substrate; and a location identifier layer over the circuit, wherein the location identifier layer includes one or more section labels for representing physical locations of the circuit components within the apparatus.

A method for positioning a mobile device relative to a stationary device in a semiconductor manufacturing environment is disclosed. The method includes detecting a target affixed to the stationary device at a target location, wherein the target location corresponds to a location of the target relative to a reference point on the stationary device, determining a first position coordinate offset value based upon detecting the target, and moving the mobile device, using the first position coordinate offset value, relative to train the mobile device to move relative to the stationary device for the stationary device to performing a semiconductor manufacturing operation.

The present disclosure is directed to a system and method to identify and track parts of a semiconductor processing chamber, as well as the status of the parts, and store status information in a centralized location as status changes over time.

In an embodiment a system includes: a wafer store comprising a wafer configured for processing by a semiconductor processing tool; a cart configured to transport the wafer from the wafer store along a predetermined path; a robotic arm, the robotic arm configured to: read wafer data from the wafer store, transport the wafer from the wafer store to the cart, send the wafer data to the cart, wherein the cart is configured to transport the wafer to a location in response to the wafer data.

A method of diagnosing a load port includes identifying a plurality of entities for a plurality of substrate storage containers by a plurality of load ports capable of transferring a substrate into and out of the plurality of substrate storage containers; detecting directly or indirectly a plurality of states of the plurality of substrate storage containers by a plurality of sensors provided at the plurality of load ports; associating the plurality of load ports, the plurality of entities and a plurality of sensor values, with each other; accumulating, in a database, data associated in the act of associating the plurality of load ports, the plurality of entities, and the plurality of sensor values; and analyzing the data in the database and determining a state of each of the plurality of load ports.

An adjusting system is controlled such that an arrangement of the substrate is adjusted based on detection by a first sensor, and a second sensor is controlled to detect a characteristic point formed in advance on a plate surface of the substrate, wherein the arrangement of the substrate has been adjusted based on the detection by the first sensor. Moreover, it is checked whether a position of the characteristic point detected by the second sensor is within an allowable range, and the adjusting system is controlled to adjust the arrangement of the substrate based on the detection by the second sensor when the position of the characteristic point detected by the second sensor is within the allowable range, and the attaching/detaching system is controlled to attach the substrate to the substrate holder after the arrangement of the substrate is adjusted based on the detection by the second sensor.

A multiple-tool parameter set configuration and misregistration measurement system and method useful in the manufacture of semiconductor devices including using a first misregistration metrology tool using a first set of measurement parameters to measure misregistration between at least two layers at multiple sites on a wafer, including a plurality of semiconductor devices, the wafer being selected from a batch of wafers including a plurality of semiconductor devices intended to be identical to corresponding semiconductor devices on all other wafers in the batch of wafers, thereby generating a plurality of first misregistration data sets, using a second misregistration metrology tool using a second set of measurement parameters to measure misregistration between the at least two layers at multiple sites on a wafer selected from the batch of wafers, thereby generating a plurality of second misregistration data sets, selecting an adjusted first set of modeled measurement parameters associated with the first misregistration data sets and an adjusted second set of modeled measurement parameters associated with the second misregistration data sets, thereby generating a matched misregistration data set and thereafter measuring misregistration between at least two layers of at least one additional wafer, selected from the batch of wafers, using at least one of the first misregistration metrology tool using the adjusted first set of modeled measurement parameters and the second misregistration metrology tool using the adjusted second set of modeled measurement parameters.

A processing apparatus includes a chuck table, a processing unit configured to process a workpiece held on the chuck table, a height measuring unit fitted to the processing unit, the height measuring unit measuring, as height data, heights at a plurality of coordinates of the holding surface measured while a moving unit is moved, a reading unit capable of reading an information medium, and a control unit. The chuck table includes an information medium on which identifying information distinguishing the chuck table is recorded. The control unit includes a height data recording section configured to record the height data and the identifying information in association with each other, and a processing control section configured to control a height of the processing unit during processing on the basis of the height data associated with the identifying information read by the reading unit.

A coating apparatus includes a process chamber, a rotation device, and a rotation holder. The rotation device is disposed in the process chamber. The rotation holder is connected to the rotation device. The rotation holder includes two extension elements, two retaining elements, and two pins. The two extension elements are disposed around a center axis and separated from each other, wherein each of the two extension elements has a side surface. Each of the two retaining elements has a bottom surface, one of the two retaining elements is connected to one of the side surfaces, and the other of the two retaining elements is connected to the other of the side surfaces. One of the two pins is connected to one of the bottom surfaces, and the other of the two pins is connected to the other of the bottom surfaces.

This method includes: a step of imaging, by an imaging apparatus in a substrate treatment system, a reference substrate which is a reference for condition setting and acquiring a captured image of the reference substrate; a step of imaging, by the imaging apparatus, a treated substrate on which the predetermined treatment has been performed under a current treatment condition and acquiring a captured image of the treated substrate; a step of calculating a deviation amount in color information between the captured image of the treated substrate and the captured image of the reference substrate; a step of calculating a correction amount of the treatment condition based on a correlation model acquired in advance and on the deviation amount in the color information; and a step of setting the treatment condition based on the correction amount, wherein steps other than the step of acquiring a captured image of the reference substrate are performed for each of the treatment apparatuses.