A registration means for storing an image of a product as a registration image in association with information representing the passing sequence that the product passed through an upstream side process; a management means for managing the matching sequence in a downstream side process; and a matching means for performing matching between an image of a product carried into the downstream side process and the registration image according to the matching sequence, are included. Each time the matching means succeeds in matching, the management means updates the matching sequence to sequence in which registration images not having succeeded in matching with any matching image are put in order on the basis of the passing sequence that the products passed through the upstream side process.

A transfer printing method and a transfer printing apparatus. The transfer method includes: transferring a plurality of devices formed on an original substrate to a transfer substrate; obtaining first position information of positions of the plurality of devices on the transfer substrate; obtaining second position information of corresponding positions, on a target substrate, of devices to be transferred; comparing the first position information with the second position information to obtain first target position information recording a first transfer position; and aligning the transfer substrate with the target substrate and performing a site-designated laser irradiation on at least part of devices on the transfer substrate corresponding to the first transfer position, simultaneously, according to the first target position information, so as to transfer the at least part of the devices from the transfer substrate to the target substrate.

The present invention relates to a monitor wafer measuring method and measuring apparatus. The monitor wafer measuring method comprises the following steps: fixing a product wafer, the product wafer having several alignment marks and product measuring sites corresponding respectively to the alignment marks; determining the product measuring sites according to the alignment marks; and placing a monitor wafer, a projection of the monitor wafer in a vertical direction being aligned with and coinciding with the product wafer. The present application can reduce or even eliminate positional errors of the monitor wafer during a measurement process, such that product-level measuring position accuracy can be achieved for the monitor wafer and further, the measuring machine itself and process changes can be monitored in a better way.

A transport vehicle includes: a traveler; a transferer that is mounted on the traveler and receives or delivers an article from or to a transfer destination; and an antenna that is provided so that at least the position or the posture thereof can be changed to follow the action of the transferer, and that performs wireless communication with another device.

The application relates to the technical field of semiconductor manufacturing, and in particular relates to a front opening unified pod, a wafer transfer system and a wafer transfer method. The front opening unified pod includes a body, a wafer scanning device and a cover. The body is provided with an opening communicating with an interior of the body. The wafer scanning device includes a first wafer scanning device, is arranged on an inner wall of the body, and is configured to scan a storage condition of wafers in the body. The cover is fastened at the opening. The wafer scanning device is arranged on the inner wall of the body of the front opening unified pod, and the wafer scanning device scans and confirms the storage condition of the wafers in the front opening unified pod in real time.

A system for monitoring alignment of a second component relative to a first component includes a camera, and a controller including a processor and a nontransitory memory. The controller is configured to receive a first captured image from the camera when the second component is in a predetermined position relative to the first component, receive a selection of a region of interest (ROI) in the first captured image, identify a visible feature of the second component within the ROI of the first captured image, receive captured images from the camera during a subsequent operation, identify a second captured image when the second component is expected to be in the predetermined position relative to the first component, and determine if the second component is in the predetermined position relative to the first component based on the second captured image and the identified visible feature of the first captured image.

A module for operating a carrier of one or more substrates to be treated in a vacuum deposition method includes a frame provided with a plate receiving, on a first side, an electronic assembly comprising radio transmitter/receiver electronics, a processor card, motor controller electronics and a battery for supplying power to the module. The processor card has a program memory with a program for controlling the motor controller electronics according to data received from a remote apparatus provided with a radio transmitting/receiving device for communicating with the module's radio transmitter/receiver electronics and, on a second side, a device for operating the carrier, which device is provided with a first motor for rotating the carrier about a first axis parallel to the plate and with a second motor for rotating the carrier about a second axis perpendicular to the plate.

The instant disclosure discloses a reticle retaining system comprising an inner pod and an outer pod. The inner pod is configured to receive a reticle that includes a first identification feature. The inner pod comprises an inner base having a reticle accommodating region generally at a geometric center thereof and surrounded by a periphery region, and an inner cover configured to establish sealing engagement with the inner base. The inner base has a first observable zone defined in the reticle accommodating region correspondingly arranged to allow observation of the first identification feature. The outer pod is configured to receive the inner base. The outer pod comprises an outer base having a second observable zone defined thereon observably aligned to the first observable zone of the inner pod upon receiving the inner pod, and an outer cover configured to engage the outer base and cover the inner pod.

An apparatus includes a substrate; circuit components disposed on the substrate; and a location identifier layer over the circuit, wherein the location identifier layer includes one or more section labels for representing physical locations of the circuit components within the apparatus.

The disclosure provides a method for monitoring abnormal sensors during fabrication of a semiconductor structure, an electronic device and storage medium. The method includes: measurement data of a wafer passing through different measurement sites are acquired; a plurality of measurement data included in each measurement site are input to a first classifier to select a first plurality of measurement sites; a plurality of measurement data corresponding to the first plurality of selected measurement sites are input to second and third classifiers to select a second plurality of measurement sites; the measurement data corresponding to the plurality of measurement sites are input to the first, second and third classifiers respectively, to select a plurality of target sensors; and the score of each target sensor group is obtained, and a plurality of target sensors in the target sensor group with the highest score are defined as abnormal sensors.