Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause phototransistors or electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. A set of micro-object may be analyzed. Geometric properties of the set of micro-objects may be identified. The set of micro-objects may be divided into multiple sub-sets of micro-objects based on the one or more geometric properties and one or more control patterns.

Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.

There is provided a transfer abnormality detection system capable of receiving information from a container transfer device configured to transfer a transfer container and a mounting device configured to load the transfer container that is transferred by the container transfer device, the system including: a determination part configured to: record which container transfer device is transferring the transfer container based on a container identification ID assigned to each transfer container and a transfer device identification ID assigned to each transfer device; and determine an abnormality in either or both of the container transfer device and the transfer container by combining vibration detection information of the container transfer device obtained by a vibration detection part provided in the container transfer device and state detection information of the transfer container obtained by a container state detection part provided in the mounting device.

In a semiconductor fabrication apparatus composed of a plurality of components, such as fluid control devices, a manager is to be enabled to identify components by intuition. Information on the identified component is to be provided to the manager in an easy-to-understand manner. In a system in which a manager terminal 3 and an information processor 2 are communicably configured via networks NW1 and NW2, the manager terminal 3 receives component information on a semiconductor fabrication apparatus 1 from the information processor 2. Upon the identification of the position of a component constituting the semiconductor fabrication apparatus 1 on the captured image of the semiconductor fabrication apparatus 1 using an identification processing unit 32, a compositing processing unit 33 creates a composite image in which component information is composited with the captured image at the position of the component identified, and an image display unit 34 displays the composite image. On the other hand, the information processor 2 makes reference to the component information storage unit 2A to extract the component information using an extraction processing unit 21, and transmits the component information to the manager terminal 3.

The present invention discloses a reticle container which comprises an upper cover and a lower cover. A plurality of identification modules is disposed on the edge of the reticle container. Therefore, the user can quickly identify the usage of the reticle container or number per se. On the other hand, the reticle container of the present invention further comprises supporters, sustainers and connecting modules. Therefore, the reticle container of the present invention is able to satisfy various structural requirements and conditions for carrying the reticle in a sealed environment.

Disclosed herein are implementations of a particles-transferring system, particle transferring unit, and method of transferring particles in a pattern. In one implementation, a particles-transferring system includes a first substrate including a first surface to support particles in a pattern, particle transferring unit including an outer surface to be offset from the first surface by a first gap, and second substrate including a second surface to be offset from the outer surface by a second gap. The particle transferring unit removes the particles from the first surface in response to the particles being within the first gap, secures the particles in the pattern to the outer surface, and transports the particles in the pattern. The second substrate removes the particles in the pattern from the particle transferring unit in response to the particles being within the second gap. The particles are to be secured in the pattern to the second surface.

The present disclosure describes a method and apparatus for determining whether components in a semiconductor manufacturing system are authorized for use in that system. By embedding an identification feature in the component, it is possible for a controller to determine whether that component is qualified for use in the system. Upon detection of an unauthorized component, the system may alert the user or, in certain embodiments, stop operating of the system. This identification feature is embedded in a component by using an additive manufacturing process that allows the identification feature to be embedded in the component without subjecting the identification feature to extreme temperatures.

A micro LED transfer device is provided. The micro LED transfer device includes a transfer part configured to arrange a first substrate wherein a plurality of LEDs are disposed on a lower surface relative to an upper surface of a second substrate; a memory storing characteristic information of each of the plurality of LEDs; a laser light source configured to irradiate laser light; a mask comprising a plurality of shutters configured to selectively open and close a plurality of openings of the mask, the mask being interposed between the first substrate and the laser light source; and a processor configured to identify an LED from among the plurality of LEDs to be arranged on the second substrate based on the stored characteristic information, and control the mask such that a shutter from among the plurality of shutters that corresponds to the LED is opened.

In an embodiment, a system includes: a tool port of a semiconductor processing tool; a processing port with an internal processing port location and an external processing port location; a robot configured to move a die vessel between the internal processing port location and the tool port; and an actuator configured to move the die vessel between the internal processing port location and the external processing port location.

Apparatus and methods for handling semiconductor part carriers are disclosed. In one example, an apparatus for handling semiconductor part carriers is disclosed. The apparatus includes a mechanical arm and an imaging system coupled to the mechanical arm. The mechanical arm is configured for holding a semiconductor part carrier. The imaging system is configured for automatically locating a goal position on a surface onto which the semiconductor part carrier is to be placed.