H01L21/67294

Load lock for a substrate container and device having such a load lock
11195735 · 2021-12-07 ·

A load lock for a substrate container for receiving flat substrates, wherein the load lock has a load chamber for receiving the substrate container that has a bottom, a ceiling, a rear wall, a front wall, a first side wall and a second side wall that connect the rear wall to the front wall, and wherein a carrier unit for receiving the substrate container is arranged in the load chamber. Here, it is provided that the load chamber can be divided into a first part and a second part along a dividing plane to open the load chamber, wherein the dividing plane extends toward the rear wall offset from the front wall through the first side wall, the second side wall, the bottom and the ceiling of the load chamber.

Apparatus for storing and transporting semiconductor elements, and method of making the same

An apparatus for storing and transporting semiconductor elements includes a first portion and a second portion. The first portion includes a first front side wall, a first rear side wall, a top wall, and at least one pin holder integrally extending from the first rear side wall. The second portion includes a second front side wall, a second rear side wall, a bottom wall, and at least one pivotal pin structure integrally coupled with and extending from the second rear side wall. The at least one pivotal pin structure comprises a shaft, and a head connected with the shaft. The at least one pin holder defines a cavity sized and shaped to accept the head of the at least one pivotal pin structure. The first portion and the second portion are pivotally movable between an open configuration and a closed container configuration.

TRANSPORT SYSTEM, INSPECTION SYSTEM, AND INSPECTION METHOD
20220206058 · 2022-06-30 ·

According to one aspect of the present disclosure, a transport system includes a mobile cassette unit capable of storing a plurality of structures and supplying the structures to an inspection unit, wherein each of the structures includes a substrate on which a plurality of devices are formed, and an interconnect member including a contact section that electrically contacts an electrode of the plurality of devices.

MULTIPLE SEMICONDUCTOR DIE CONTAINER LOAD PORT

A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.

Substrate processing apparatus and purging method

A substrate processing apparatus includes: a carrier storage rack configured to place and store a carrier that accommodates a substrate; a gas supply configured to supply an inert gas into the carrier placed on the carrier storage rack; and a controller configured to control whether to supply the inert gas into the carrier based on at least one of carrier information and substrate information.

Coating apparatus

A coating apparatus includes a process chamber, a rotation device, and a rotation holder. The rotation device is disposed in the process chamber. The rotation holder is connected to the rotation device. The rotation holder includes two extension elements, two retaining elements, and two pins. The two extension elements are disposed around a center axis and separated from each other, wherein each of the two extension elements has a side surface. Each of the two retaining elements has a bottom surface, one of the two retaining elements is connected to one of the side surfaces, and the other of the two retaining elements is connected to the other of the side surfaces. One of the two pins is connected to one of the bottom surfaces, and the other of the two pins is connected to the other of the bottom surfaces.

TEST DEVICE, CHANGE KIT, AND METHOD OF EXCHANGING CHANGE KIT

Techniques for testing both a rectangular substrate and a circular substrate are provided. One aspect of the present disclosure pertains to a test device comprising an exchangeable change kit, wherein the change kit comprises a first holding device and a second holding device which are exchangeably mounted in the test device, wherein the first holding device is configured to adsorb and hold a rectangular substrate, wherein the second holding device is configured to adsorb and hold a circular substrate, and wherein the first holding device and the second holding device are exchanged according to a substrate to be tested.

Transfer abnormality detection system and transfer abnormality detection method

There is provided a transfer abnormality detection system capable of receiving information from a container transfer device configured to transfer a transfer container and a mounting device configured to load the transfer container that is transferred by the container transfer device, the system including: a determination part configured to: record which container transfer device is transferring the transfer container based on a container identification ID assigned to each transfer container and a transfer device identification ID assigned to each transfer device; and determine an abnormality in either or both of the container transfer device and the transfer container by combining vibration detection information of the container transfer device obtained by a vibration detection part provided in the container transfer device and state detection information of the transfer container obtained by a container state detection part provided in the mounting device.

METHOD OF CONTROLLING THE PLACEMENT OF MICRO-OBJECTS ON A MICRO-ASSEMBLER

Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.

Reticle container

The present invention discloses a reticle container which comprises an upper cover and a lower cover. A plurality of identification modules is disposed on the edge of the reticle container. Therefore, the user can quickly identify the usage of the reticle container or number per se. On the other hand, the reticle container of the present invention further comprises supporters, sustainers and connecting modules. Therefore, the reticle container of the present invention is able to satisfy various structural requirements and conditions for carrying the reticle in a sealed environment.