A wafer placement table includes: a ceramic plate having a wafer placement surface, a cooling plate having a refrigerant flow path and being provided on a lower surface-side of the ceramic plate; a first ceramic plate penetration section that reaches the wafer placement surface; a second ceramic plate penetration section that reaches the wafer placement surface; a first gas passage that communicates with the first ceramic plate penetration section; and a second gas passage that communicates with the second ceramic plate penetration section. The first gas passage has a first gas intermediate passage, the second gas passage has a second gas intermediate passage, the second gas intermediate passage is provided above the first gas intermediate passage, and the refrigerant flow path has a first flow path section provided above the first gas intermediate passage, and a second flow path section provided below the second gas intermediate passage.

A substrate processing apparatus includes a base member having an opening, a substrate holding member fixedly provided on the base member and configured to hold a plurality of substrates in multiple stages in a vertical direction, a plurality of shower plates provided to respectively face the substrates held by the substrate holding member and configured to supply a processing gas to the substrates existing thereunder in a shower shape, at least one gas introduction member configured to introduce the processing gas into the shower plates, a processing container provided to be able to make close contact with the base member and brought into close contact with the base member to define an arrangement space of the substrate holding member as a processing chamber, a heating device configured to heat the substrates in the processing chamber, and an exhaust mechanism configured to evacuate the processing chamber through the opening.

A film forming apparatus includes: a substrate holding member for vertically holding target substrates at predetermined intervals in multiple stages; a process vessel for accommodating the substrate holding member; a processing gas introduction member each having gas discharge holes which discharge a processing gas for film formation in a direction parallel to each target substrate and introduce the processing gas into the process vessel; an exhaust mechanism for exhausting the interior of the process vessel; and a plurality of gas flow adjustment members installed to face the target substrates, respectively. Each of the gas flow adjustment members adjusts a gas flow of the processing gas discharged horizontally above each of the target substrates from the gas discharge holes of the processing gas introduction member, to be directed from above the respective target substrate located below the respective gas flow adjustment member toward the surface of the respective target substrate.

A wafer boat is provided for holding a plurality of wafers in a vertically stacked and spaced relationship. The wafer boat comprises a top member; a bottom member facing the top member; and at least three vertical members extending between the top member and the bottom member. The vertical members are provided with a plurality of protrusions, the protrusions configured to form a plurality of wafer accommodations at different vertical heights, the protrusions configured to be arranged in groups of at least two protrusions. A pitch of protrusions within a group has a first value and a pitch of two adjacent protrusions that belong to different groups has a second value larger than the first value.

A vertical wafer boat includes a top plate, a bottom plate, three support posts, and wafer support parts. The support posts include a first and a second support posts arranged in right and left sides of a starting end side of a wafer inserting direction, and a third support post arranged in a center of a terminal end side of the wafer inserting direction. The wafer support parts include a first, second and third wafer support parts protruding in the horizontal direction from side surfaces of the first, second and third support posts, respectively. A total of horizontal sectional areas of the first wafer support part and the first support post, or the second wafer support part and the second support post, and a total of horizontal sectional areas of the third wafer support part and the third support post have a specific relationship.

A substrate liquid processing apparatus includes a placing unit which places thereon a substrate; a liquid processing unit which processes the substrate by immersing the substrate in a processing liquid with a posture in which a plate surface of the substrate is perpendicular to a horizontal direction; a transfer unit which transfers the substrate between the placing unit and the liquid processing unit; and a rotating unit which rotates the substrate, after being subjected to a first processing by the liquid processing unit, around an axis perpendicular to the plate surface, and in a direction different from that when the first processing is performed. Further, the transfer unit transfers the substrate, after being subjected to the first processing, to the rotating unit and transfers the rotated substrate to the liquid processing unit. The liquid processing unit performs a second processing by immersing the rotated substrate in the processing liquid.

A wafer susceptor includes a main plate, a plurality of minor plates, and a plurality of plugs. The main plate has a plurality of first notches. The minor plates are respectively disposed in the first notches, and each of the minor plates has a second notch carrying a wafer and an engaging surface of inclination engaged with a side surface of the first notch. A first angle of 20 degrees to 45 degrees is included between the engaging surface of inclination and a horizontal plane. The second notch has a flat side corresponding to a flat of the wafer. An eave portion is disposed on the flat side. The plugs are respectively located between the main plate and the minor plates and are configured to fix the minor plates.

A substrate processing apparatus includes a reaction tube defining a substrate processing chamber; a gas inlet provided at a lower portion of the reaction tube to supply a process gas; a first buffer unit for temporarily retaining the process gas, the first buffer unit at a first side of an inner surface of the reaction tube and includes a plurality of gas supply holes; and a gas outlet provided at a second side of the inner surface of the reaction tube opposite to the first side, to exhaust the process gas from the process chamber. The gas supply holes are provided from an upper end portion of the first buffer unit to a lower end portion of the first buffer unit, and the process gas is supplied through the plurality of gas supply holes into the process chamber, passes through the process chamber, and exhausted through the gas outlet.

A quartz boat transmission mechanism used in a diffusion furnace includes a vertically-upward stand column and a boat pushing mechanism fixed on opposite sides in the diffusion furnace and a side boat leaving mechanism fixed at the bottom of the diffusion furnace. Separated temporary storage sections are fixed on the stand column from top to bottom, an SIC oar horizontally stretches from the boat pushing mechanism, a lift channel section is arranged between the SIC oar and the temporary storage sections, the stand column has a manipulator moving up and down along the stand column, and the side boat leaving mechanism is fixed at the bottom of the diffusion furnace and located below the temporary storage sections.

A storage device and a photoresist coating and developing machine having a storage device are disclosed. The storage device includes a frame and a plurality of layers of support plates disposed in sequence in the frame in a height direction of the frame, being used for receiving substrates to be exposed. The frame is provided with a plurality of layers of support members respectively associated with the plurality of layers of support plates, and each layer of the support plates is slidably mounted on the support member.