A load port for loading wafers to and unloading wafers from a front opening unified pod (FOUP) includes a shield member that covers and provides a seal over an opening of the FOUP. The shield member includes a narrow wafer slot that is sized to allow a single wafer to be loaded to or unloaded from the FOUP but otherwise minimize loss of the purge environment within the FOUP. The shield member is movable so that the wafer slot may be moved vertically to provide a wafer transfer robot access to any desired wafer position within the FOUP. The shield member, for example, may be a flexible sheet that is held taut and is rolled onto and off of at least one roller to vertically position the wafer slot. The shield member may alternatively be one or more rigid members that slide on rails to vertically position the wafer slot.

A carrier includes a jig and a case. The jig is configured to hold at least one consumable to be loaded into or unloaded from a container. The case is configured to store the jig and the consumable held by the jig.

The present disclosure provides a cache device and a LCD screen production line. The cache device provided by the present disclosure includes an outer frame having an opening for picking and placing cached items on a first side wall thereof and a support bracket for horizontally supporting cached items therein; and first blowing means disposed on the second side wall of the outer frame for blowing air toward the opening; second blowing means disposed on the third side wall or the fourth side wall of the outer frame; an exhaust means disposed on a fourth side wall opposite to the third side wall of the frame.

A substrate case includes a shaft portion around which a sheet-shaped substrate having a circuit area in which a circuit manufacturing process is performed is wound; and a cover portion that accommodates the substrate in the state of being wound around the shaft portion, the shaft portion having a holding portion that holds an area different from the circuit area at a winding start portion of the substrate.

The present disclosure discloses a panel fixing device, including a box, a pressing member and an expansion agent. The inner wall of the frame of the box is provided with a limiting groove, the pressing member is movably disposed in the limiting groove, the frame has a receiving through hole connecting with the limiting groove, the expansion agent is received in the receiving through hole, and the expansion agent is used for pushing the pressing member after being expanded so that the pressing member compresses the panel accommodated in the box. An injection channel of the expansion agent is reserved on the box. After inflating the expansion agent, the pressing member is pushed by the expansion force, so that the pressing member compresses the panel in the box to limit the panel so as to prevent the box from causing a second impact during the dropping process.

Embodiments of multi-cassette carrying cases are provided herein. In some embodiments a multi-cassette carrying case includes: a body having an inner volume; a door coupled to the body to selectively seal off the inner volume; and a plurality of cassette holders disposed in the inner volume to hold one or more substrate cassettes. In some embodiments, a method of transferring substrates includes: placing a substrate in a substrate cassette, wherein an inner volume of the substrate cassette is sealed from an environment outside of the substrate cassette; and placing the substrate cassette in a multi-cassette carrying case.

A tray module capable of discharging static electricity to safely transfer display device members (e.g., components) includes: a tray configured to accommodate at least two members of a display device, at least two conductive protection films alternatingly stacked with the members of the display device, and a conductive pattern on the tray to provide a discharge path with the conductive protection films to ground.

A load port for loading wafers to and unloading wafers from a front opening unified pod (FOUP) includes a shield member that covers and provides a seal over an opening of the FOUP. The shield member includes a narrow wafer slot that is sized to allow a single wafer to be loaded to or unloaded from the FOUP but otherwise minimize loss of the purge environment within the FOUP. The shield member is movable so that the wafer slot may be moved vertically to provide a wafer transfer robot access to any desired wafer position within the FOUP. The shield member, for example, may be a flexible sheet that is held taut and is rolled onto and off of at least one roller to vertically position the wafer slot. The shield member may alternatively be one or more rigid members that slide on rails to vertically position the wafer slot.

A substrate case includes a shaft portion around which a sheet-shaped substrate having a circuit area in which a circuit manufacturing process is performed is wound; and a cover portion that accommodates the substrate in the state of being wound around the shaft portion, the shaft portion having a holding portion that holds an area different from the circuit area at a winding start portion of the substrate.

A module tray for a semiconductor device includes a base plate, first and second sidewalls extending in a vertical direction from opposite sides of the base plate to define an accommodation space, a dividing wall extending in the vertical direction from the base plate between the first and second sidewalls, first to fourth fastening guides with first to fourth fastening grooves, respectively, on inner surfaces of the first and second sidewalls and opposite side surfaces of the dividing wall, and first to fourth guide grooves on the inner surfaces of the first and second sidewalls and the opposite side surfaces of the dividing wall, respectively, the first to fourth guide grooves having curved concave shapes, and an upper end portion of each of the first to fourth fastening grooves gradually widening toward a top thereof.