A substrate storage container includes a container main body having an opening at the front, a support portion for supporting a substrate in the interior thereof, and a substrate receiving portion positioned more toward a rear wall than the support portion, an a lid on which a substrate pressing portion for pressing the substrate is formed. The substrate receiving portion and the substrate pressing portion are present within a range of greater than or equal to 0 mm and less than or equal to 80 mm in the horizontal direction from a vertical center line that passes through the center of the container main body when the lid is viewed from the front.

A substrate storage container includes: a container body configured to store a substrate; a lid configured to close an opening formed on the front side of the container body; and a retainer arranged on the back of the lid and configured to restrict the substrate from moving to the front side. The retainer includes an integration of: a frame configured to be detachably attached to the back of the lid; a contact portion including a convex portion configured to contact the substrate and restrict the substrate from moving to the front side; and a beam structure that connects the frame and the contact portion. The contact portion and the beam structure are configured to be spaced apart from the lid.

A cassette hold down includes a frame, a first cassette contact extending in a vertical direction with respect to the frame, and a second cassette contact extending in the same vertical direction. The first and second cassette contacts are separated along a length direction of the frame. The cassette contacts can contact a wafer cassette on either side of a horizontal bar of the wafer cassette that interfaces with a channel provided on a door for a wafer container including the cassette and cassette hold down. The second cassette contact can be joined to the frame by a spring. Mounting features such as bosses can be included to connect the cassette hold down to the wafer container. Hard stops extending opposite the cassette contacts can be included to limit travel of the cassette contacts by mechanical interference with the wafer container.

A back side substrate support portion 6 includes a lower side inclined face 622 on which an end of a back face of a substrate W slides, and a substrate support portion 632 that is located above the lower side inclined face 622 and can support an edge portion of the substrate W. When a container main body opening portion 21 is closed by a lid body 3, the edge portion of the substrate W slides on the lower side inclined face 622 and reaches the substrate support portion 632. At least a portion of the lower side inclined face 622 is configured from a second member that is different from a first member that configures the substrate support portion 632, and the second member has a lower maximum static friction coefficient and lower wear resistance than the first member.

A substrate storing container provided with a container main body, a lid body, a lateral substrate support portion, a lid body side substrate support portion, and a back side substrate support portion includes a casting-off portion that casts off a substrate in a state being supported by the back side substrate support portion and the lid body side substrate support portion from at least one of the back side substrate support portion or the lid body side substrate support portion. When the lid body is opened from the container main body opening portion from a state in which the container main body opening portion is closed by the lid body.

A method for containing a reticle in a pod is provided. The method includes opening the pod such that a pressing element retained movably on the pod by a limiting cap moves to a first position, wherein a shoulder part of the pressing element between a pressure receiving part and a pressing part of the pressing element is spaced from the limiting cap. The method further includes placing the reticle in the pod such that the reticle is pressed by the pressing element.

The present disclosure is directed to a wafer container including: a housing configured for transporting a plurality of wafers, wherein the plurality of wafers are stacked on a base of the housing in a first direction; a plurality of wafer separator rings; each of the wafer separator rings configured to encircle a wafer of the plurality of wafers in a second direction that is substantially perpendicular to the first direction, each of the wafer separator rings including a top surface and a bottom surface, defining a thickness there between extending in the first direction, which is about 0.3 mm-1.4 mm; and each of the wafer separator rings including an inner side wall and an outer side wall defined by an inner diameter and an outer diameter, respectively, in the second direction, wherein the inner diameter of the wafer separator ring is greater than 300 mm and configured to be spaced apart from the wafer it is encircling.

A transportation system for semiconductor substrates includes a tray, lid and packaging bag. The tray includes a bottom and circumferential sidewalls. The tray has an opening on a top side and is configured to receive semiconductor substrates through the opening, the substrates being stacked onto each other in the tray in parallel to the tray bottom. The lid includes a cover plate and at least two arms extending from the plate. The arms are configured to be inserted into the tray between the tray sidewalls and the semiconductor substrates. The cover plate is configured to cover the tray opening when the lid is fully mounted to the tray. The packaging bag is configured to enclose the tray with the substrates stacked therein and lid arranged thereon, and to be evacuated of air and sealed such that the tray and lid arranged in the bag are vacuum sealed inside the bag.

A container (1) for transporting a semiconductor wafer includes: a container body (10) having one end provided with an opening (11) and the other end provided with a mounter (12) that faces the opening (11) and on which stacked wafers are housed; and a cover (20) that closes the opening (11). The container body (10) includes: body side walls (14) having an arc shape, disposed upright on the mounter (12), sectioning a housing (13) that houses the wafers; and auxiliary walls (14a) that are disposed upright and folded toward a back surface on both edges of the body side walls (14).

A wafer storage container and a cap assembly according to an embodiment include a storage container having a space accommodating at least one wafer therein, a fastening portion having a fastening space capable of fastening a cap, and the cap having a locking portion which is formed linearly on a first side of the cap and which has an end portion provided with a first protrusion portion, the cap being configured in a structure in which the locking portion is fastened to the fastening portion. The fastening portion includes an inner wall, and a fastening hole which is formed in a first side of the fastening portion such that the locking portion is fastened thereto. The cap includes a fixing wall in close contact with the inner wall, thereby fixing the cap to the fastening portion.