The present disclosure relates to a tray assembly. The tray assembly may include a die transport tray. The die transport tray may include an inner bottom surface for accommodating a plurality of dies. The tray assembly may further include a lid. The lid may include an inner top surface, wherein the inner top surface of the lid may face the inner bottom surface of the die transport tray when the lid is assembled over the die transport tray. The lid may further include a shock absorbing material on the inner top surface for contacting the plurality of dies, if present.

A carrier FOUP and a method of placing a carrier are provided. The carrier FOUP includes a body and a door. The body includes a plurality of chamfers, and one or more carriers are placed on, and supported by, the plurality of chamfers. The method of placing a carrier includes placing the carrier in the carrier FOUP and closing the door of the carrier FOUP. When the door is closed, the door pushes against the carrier and aligns the carrier with the alignment feature. The alignment features align the carrier, removing the need to be aligned by the factory interface robot when placing or removing the carrier from the carrier FOUP.

Disclosed is a substrate treating apparatus. The substrate treating apparatus includes an index unit including a load pot, in which a container is seated, and an index chamber connected to the load pot, and a process executing unit having a load lock chamber connected to the index chamber and a process chamber that treats a substrate transferred to the load lock chamber, the index unit further includes an alignment unit provided in the index chamber and that aligns a substrate type sensor transferred to the process chamber.

A wafer container includes a pod, a door, a wafer cassette with a top wall, a baseplate, and a biasing member. The pod includes side wall(s), a closed end, and an open end. When closed by the door, the baseplate is located between the door and the wafer cassette and the biasing member is compressed between the wafer cassette and the closed end of the pod. A size adaption system for securing a wafer cassette within an internal space of a closed pod includes a baseplate and a biasing member. The baseplate includes at least one of a projection for coupling the baseplate and the wafer cassette and a notch for coupling the baseplate and the door. The biasing member to be disposed in compression between the wafer cassette and a closed end of the pod.

A wafer storage container and a cap assembly according to an embodiment include a storage container having a space accommodating at least one wafer therein, a fastening portion having a fastening space capable of fastening a cap, and the cap having a locking portion which is formed linearly on a first side of the cap and which has an end portion provided with a first protrusion portion, the cap being configured in a structure in which the locking portion is fastened to the fastening portion. The fastening portion includes an inner wall, and a fastening hole which is formed in a first side of the fastening portion such that the locking portion is fastened thereto. The cap includes a fixing wall in close contact with the inner wall, thereby fixing the cap to the fastening portion.

In an embodiment, a system includes: a warehousing apparatus configured to interface with a semiconductor die processing tool configured to process a semiconductor die singulated from a wafer, wherein the semiconductor die processing tool comprise an in-port and an out-port, wherein the warehousing apparatus is configured to: move a first die vessel that contains the semiconductor die to the in-port from a first die vessel container, wherein the first die vessel container is configured to house the first die vessel; move the first die vessel from the in-port to a buffer region; and move a second die vessel from the buffer region to the out-port.

A substrate storage container includes: a container body configured to store a substrate; a lid configured to close an opening formed on the front side of the container body; and a retainer arranged on the back of the lid and configured to restrict the substrate from moving to the front side. The retainer includes an integration of: a frame configured to be detachably attached to the back of the lid; a contact portion including a convex portion configured to contact the substrate and restrict the substrate from moving to the front side; and a beam structure that connects the frame and the contact portion. The contact portion and the beam structure are configured to be spaced apart from the lid.

There is provided a substrate storage container 1 capable of suppressing deformation of a functional member insert-molded and a method of manufacturing the container 1, and an device positioning member 4 as the functional member including: an attachment part 41 having a thick section 413 formed in thickness equal to a wall member of a container body 10 or a lid 20 and a thin section 410 decreasing in thickness as it approaches toward an outer edge from the thick section 413; and a body part 42 coupled to the attachment part 41, the device positioning member 4 being disposed on the container body 10 or the lid 20 so that a first surface 420 of the thick section 413 is flush with an inner surface of the wall member.

Embodiments of substrate transfer apparatus are provided herein. In some embodiments, an apparatus for storing and transporting at least one substrate in a vacuum includes a carrying case for storing one or more substrates, wherein the carrying case includes a vacuum port and a plurality of holders to hold one or more substrates within an inner volume of the carrying case; and a vacuum source in fluid connection with the carrying case via the vacuum port.

The instant disclosure discloses a workpiece container system comprising a storage assembly. The storage assembly comprises a seat member and a seat cover. The seat member defines a workpiece receiving region that encompasses a geometric center region thereof, configured to receive a workpiece; wherein a lower diffuse inducing component is provided on the seat member within a planar projection of the workpiece yet offsets the geometric center region. The seat cover is configured to engage the seat member at a periphery region around the workpiece receiving region thereof, so as to cooperatively form an enclosure for housing the workpiece; wherein an upper diffuse inducing component is provided on the seat cover over the planar projection of the workpiece and protectively overlaps the geometric center region of the seat member.