A system and method for treating a substrate in a reaction chamber. A transfer chamber is arranged between a first lock and a second lock, wherein the second lock is provided between the transfer chamber and the reaction chamber. A substrate is transferred into the transfer chamber through the first lock, and the first lock is closed. In a next step, the transfer chamber is flooded with the same gas as in the reaction chamber and the pressure and temperature of the gaseous atmosphere in the transfer chamber is controlled to be the same as in the reaction chamber. Then, the second lock is opened and the substrate is transferred from the transfer chamber into the reaction chamber to treat the substrate. A computer program product for carrying out the above method.

According to one embodiment, a substrate storage container comprises: a container body configured to store a substrate; a lid that closes a rectangular opening of the container body; and an annular gasket located between the container body and the lid. The container body has at least either one of a guide rib or a guide slit in an opening portion around the opening. The lid has at least either one of a guide slit or a guide rib that is engageable with the guide rib or the guide slit of the container body. The guide rib and the guide slit engage each other when the opening is closed with the lid and prevent the lid from tilting at a predetermined tilt angle or more with respect to an opening surface where the opening is formed.

To protect a plurality of semiconductor chips of a sawn wafer housed in a shipping case and a method of manufacturing a semiconductor device includes a step of vacuum packing a sawn wafer while being housed in a shipping case; the shipping case has the following structure: the shipping case has a lid portion that covers the upper surface of the sawn wafer and a body portion that covers the lower surface of the sawn wafer, the lid portion has a recess portion that covers a plurality of semiconductor chips and a ventilation route communicated with the recess portion. In a step of reducing pressure in the shipping case, a gas in the shipping case is discharged outside via a ventilation route.

An apparatus and a method for repairing defects of a semiconductor are provided in the present invention. A reaction gas is introduced into a first chamber with a specific temperature and a specific pressure, thereby performing a defect repairing process to a semiconductor element in the first chamber at a lower temperature. Moreover, the disposition of the second chamber is used to avoid the reaction gas leaking out to the environment.

A substrate container includes a casing, a rack, a lid, a lid holder, and a substrate separating mechanism. The casing has on its front face an opening. The substrate separating mechanism has a contact part that directly contacts substrates. The contact part is movable relative to the lid holder. The lid moves forward to the opening, and the contact part moves backward relative to the lid holder, whereby the lid holder holds ends of the substrates. The lid moves backward from the opening, and the contact part moves forward to the lid holder, whereby the substrate separating mechanism separates the substrates from the lid holder.

A photomask blank substrate container having an inner member, inner cassette and retainer member, container main body having a lower box and an upper lid, and a sealing tape, in which the container main body and inner member include a polymer-based material in which when 0.1 g of a sample thereof is retained at 40° C. for 60 minutes to release an outgas component, the outgas total amount detected by a gas chromatography mass spectrometer is 1.9×103 ng or less in terms of n-tetradecane, and the sealing tape is a material in which when a size of 10 mm×10 mm of a sample thereof is retained at 150° C. for 10 minutes to release an outgas component, the outgas total amount detected by a gas chromatography mass spectrometer is 1.8×103 ng or less in terms of n-tetradecane. This photomask blank substrate container allows storing and transporting the photomask blank substrate while suppressing influence on the resist pattern.

A purge configurable wafer shipper. The container includes an enclosure portion with an open side or bottom, a door to sealing close the open side or bottom. One of the door and the container portion includes an opening formed in the enclosure to provide a fluid passageway from an interior of the wafer shipper to an exterior region. The opening may include a module receiving structure that defines the fluid passageway. A sealing member is included for insertion into the module receiving structure. The sealing member has a body portion including a support flange positioned proximate a lower portion of the body portion, a circumferential groove in the exterior surface of the body portion, and an O-ring positioned at least partially within the circumferential groove.

A reticle container for containing a reticle including a base plate having one or more windows. Each of the windows can include mounting recess having a recess sidewall including an undercut defined therein. A transparent substrate can be disposed in the mounting recess and is retained therein by a retention member having an arcuate portion extending between a first end portion and a second end portion. At least the first end portion of the retention member can be positioned in the undercut defined in the recess sidewall such that the arcuate portion of the retention member contacts the transparent substrate to retain the transparent substrate in the mounting recess.

There is provided a device and method for controlling a tightness of at least one transport enclosure for conveyance and atmospheric storage of semiconductor substrates, the transport enclosure including at least two ventilation ports, the device including at least one interface configured to be coupled to the transport enclosure, the interface including at least two connecting heads, at least one connecting head of the heads being formed by a measurement head configured to engage in a ventilation port of the ventilation ports of the transport enclosure, the measurement head including a projecting end piece, opening through at least one aperture, and a peripheral sealing element surrounding the end piece, all of the ventilation ports of the transport enclosure being coupled to the connecting head of the interface. There is also provided a method for controlling the tightness of the transport enclosure.

A wafer container that reduces or alleviates one or more of the problems associated with excessive container wall deflection due to loading and excessive particulate generation, particularly as those problems are experienced with containers for 450 mm diameter and larger wafers. The container has an enclosure and door with interlocking features to enable transfer of tension load to the door to minimize deflection of container surfaces. The container may include a gasketing arrangement compatible with the interlock feature. The container may include a removable door guide that improves centering of the door during door installation, and that is made of low particle generating material to reduce particulates.