The present disclosure describes a device and a method for substrate storage. The device can include a first and a second groups of panels configured to form an enclosed volume, and fin structures disposed at inner surfaces of the second group of panels. Each of the fin structures can be configured to hold a substrate. Each fin structure can include a protrusion extending inwardly into the enclosed volume and a binding device disposed over the protrusion. The binding device can be configured to bind the substrate over the protrusion.

A container includes a deflector, disposed in an interior of a substrate container, having a longitudinal opening and a deflection surface and a gas distributor configured to provide a purging gas to purge an interior of a substrate container. The gas distributor is configured such that at least a portion of the purging gas flows into a gap formed between the gas distributor and the deflector. The deflector is configured such that at least a portion of the purging gas in the gap flows through the longitudinal opening. The deflector directs a gas flow pattern of the purging gas from the gas distributor to an outlet of the substrate container to improve purging efficacy of the substrate container.

A load port system includes an isolation compartment coupled to an equipment front end module (EFEM). Reactive gas is to be removed from the isolation compartment. The load port system further includes an elevator disposed in the isolation compartment. The elevator is coupled to an elevator arm that extends from the isolation compartment into the EFEM through an opening to raise and lower a carrier opener within the EFEM.

The present invention relates to an EFEM for transferring a wafer between a wafer storage container and process equipment and, specifically, to an EFEM which can reduce the defect rate of wafers received in a wafer storage container by actively using a downflow flowing along a wall surface of the EFEM. The present invention relates to an EFEM system for transferring a wafer between a wafer storage container and process equipment and, specifically, to an EFEM system which can selectively achieve moisture removal from wafers and fume removal from wafers depending on conditions of the wafers by controlling the direction of a downflow in a wafer transfer chamber in accordance with environmental conditions inside a wafer storage container.

Provided are a door opening/closing system which prevents the entry of atmospheric air into a front-opening unified pod (FOUP) and an equipment front end module (EFEM) when the FOUP and the EFEM are placed in communication with each other, and a load port equipped with the door opening/closing system. The door opening/closing system is provided with: a base which constitutes a part of a wall isolating a conveyance space from an external space, an opening portion provided in the base; a door which is capable of opening and closing the opening portion; a first seal member which seals a gap between the base and a container; a second seal member which seals a gap between the base and the door, a sealed space which is constituted by the base, the first seal member, the second seal member, a lid member, and the door when the container is in a state of contact with the opening portion with the first seal member therebetween, a first gas injection unit which injects gas into the sealed space; and a second gas discharge unit 88 which evacuates the sealed space.

A technique that improves a quality of substrate processing. A substrate processing apparatus includes: a plurality of processing chambers and transfer chambers; a vacuum transfer chamber; a plurality of gate valves; a plurality of first gas supply units to supply an inert gas to a substrate; a transfer robot; and a control unit to control the plurality of first gas supply units and the transfer robot to: supply the inert gas to the substrate at a first flow rate when a distance between a gas supply port and the substrate passing through the plurality of gate valves is a first distance; and supply the inert gas to the substrate at a second flow rate greater than the first flow rate when the distance between the gas supply port and the substrate is a second distance greater than the first distance when the substrate passes through the plurality of gate valves.

An equipment front end module (EFEM) includes sidewalls forming an EFEM chamber configured to receive inert gas from an inert gas supply. The sidewalls include a first sidewall configured to attach to a panel first side of a panel. The panel forms a panel opening extending between the panel first side and a panel second side. The panel second side is configured to attach to a side storage pod. The EFEM further includes a robot disposed in the EFEM chamber. The robot is configured to transfer substrates from the EFEM chamber into the side storage pod via the panel opening. An exhaust conduit is coupled to the side storage pod to exhaust gas from the side storage pod to an exterior of the side storage pod.

There is provided a gas injection device configured to prevent entry of atmospheric air when charging gas into a FOUP. In order to realize such a gas injection device, the gas injection device is structured so as to include: a gas supply port 72 through which inert gas is supplied; a nozzle main body 71 including a gas passage 77 communicating with the gas supply port 72; an opening/closing mechanism 92 configured to close the gas supply port 72; and an opener 96 configured to cause the opening/closing mechanism 92 to open the gas supply port 72 closed by the opening/closing mechanism 92.

A substrate storage container and gas replacement units are provided in which variations in humidity or concentration in an internal space are small. This is achieved by providing a container body capable of housing substrates, at least one intake valve for supplying an external gas to the internal space of the container body, and gas replacement units for blowing the supplied gas into the internal space of the container body. The container body is formed in an open front box, the intake valve is attached at the back of the bottom surface of the container, the gas replacement units each include a housing member and a cover member, each housing member has a plurality of first blowout holes for blowing the stored gas in one direction, and each cover member has a plurality of second blowout holes for blowing in a direction substantially opposite direction.

An embodiment provides a wafer cassette stoker comprising: a cassette on which a plurality of wafers are loaded; a plurality of chambers disposed in one line while forming at least one layer, wherein the cassette after being cleaned is inserted in each of the chambers and a humidity control unit for supplying a compressed dry air (CDA) into the insides of the chambers so as to control humidity of the cassette.