Embodiments of substrate supports for use in a process chamber are provided herein. In some embodiments a substrate support for use in a process chamber includes a pedestal having an upper surface for supporting a substrate and an opposite lower surface, a first heater disposed within the pedestal between the upper surface and the lower surface, and thermal baffles having a plurality of voids that are fluidly isolated from each other disposed between the first heater and the lower surface to reduce heat transfer from the first heater to the lower surface of the pedestal.

A technique is capable of preventing particles from adhering onto a wafer when a lid is attached or detached from a pod. A substrate processing apparatus includes: a placement part whereon a substrate container is placed; a guide part constituting a lid opening/closing space; a gate part separating the lid opening/closing space from a transfer chamber; a lid opening/closing mechanism provided in the lid opening/closing space and configured to attach or detach a lid of the substrate container; a gas introduction mechanism configured to supply a gas into the substrate container; a monitor part configured to monitor and adjust an inner pressure of the substrate container; and a controller configured to: (i) control the lid opening/closing mechanism; and (ii) control the monitor part to maintain the inner pressure of the substrate container higher than an inner pressure of the lid opening/closing space while the lid opening/closing mechanism detaches the lid.

The invention discloses a reticle storage device including a top lid, a bottom lid and a soft contact member. The top lid has a ceiling and a cover surrounding the ceiling. The bottom lid has a carrier and a peripheral structure surrounding the carrier. The soft contact member is configured to laterally extend in between the cover and the peripheral structure when the top lid and the bottom lid engage with each other, and to extend from an inside to an outside of the device in order to buffer the contact among the two lids.

The present invention provides a quick-release valve module which includes a flexible grommet defining a channel, and a piston having a disc portion at an end thereof, wherein the disc portion of the piston is exposed to the flexible grommet.

A reticle storage device includes a top lid having a ceiling and a cover surrounding the ceiling, and a bottom lid having a carrier and a peripheral structure surrounding the carrier. When the top lid engages with the bottom lid, a passage is defined therebetween and therefore the reticle storage device is not sealed.

A device is provided. The device is configured to measure the air speed near an air outlet of an air curtain. The air curtain is mounted near an open of a wafer box. Receiving grooves are defined in the wafer box. Each receiving groove is configured to receive a wafer. The device includes one or more fixing members and one or more air speed measuring members. Each fixing members is received and held in one receiving groove. Each air speed measuring member is arranged on one fixing member. Each air speed measuring member includes one or more sensors. Each sensor extends outside the wafer box and is positioned below the air curtain. Each sensor is configured to measure the air speed near the air outlet of the air curtain. A related wafer box is also provided.

A safeguarding device, in particular a safeguarding device for a wafer transport container includes at least one positive-fit unit configured at least for a safeguarding of a wafer-transport-container opening element of a wafer transport container, which is held in its closure position by a closing mechanism.

Corrosion resistance of valves is enhanced, while ensuring the check valve function of the valves against an inflow of outside air. Disclosed is a substrate storage container that includes: a container body for storing at least one substrate; a lid for closing an opening of the container body; and at least one valve for controlling gas flow to the container body or from the container body. The at least one valve includes an elastic, non-metallic seal lip in a communication passage that extends in a first direction and communicates between an outside of the container body and an inside of the container body. The seal lip has an umbrella-like form which closes on one side in the first direction and opens on the other side in the first direction, the seal lip abutting an inner peripheral wall of the communication passage on the other side.

A cassette lid opening device for use in a clean room apparatus configured for cooperation with a wafer cassette. The cassette lid opening device comprises a wall structure having a separation wall having a wall opening for transferring wafers therethrough, a cassette docking port, and a lid handler provided to the wall structure. The cassette docking port is arranged at a first side of the wall structure for docking a wafer cassette. The lid handler is movable relative to the wall opening and configured to engage a cassette lid of the wafer cassette docked in the cassette docking port. The cassette lid opening device further comprises a blower having an elongated, slit-like nozzle substantially spanning a height or a width of the wall opening and configured to blow a curtain-shaped jet stream of a purge gas into a cassette interior of the wafer cassette.

A semiconductor manufacturing apparatus including at least one load module including a load port on which a substrate container is located, a plurality of substrates being mountable on the substrate container; at least one loadlock module including a loadlock chamber directly connected to the substrate container, the loadlock chamber interchangeably having atmospheric pressure and vacuum pressure, a first transfer robot within the loadlock chamber, and a substrate stage within the loadlock chamber, the plurality of substrates being mountable on the substrate stage; a transfer module including a transfer chamber connected to the loadlock chamber, a second transfer robot within the transfer chamber, and a substrate aligner within the transfer chamber; and at least one process module including at least one process chamber connected to the transfer module.