A purge nozzle module for supplying nitrogen (N2) to a semiconductor wafer processing apparatus includes a nozzle body with a purge hole formed at a center thereof, and a vacuum pad combined with an upper side of the nozzle body, having a through hole connected to the purge hole formed therethrough, and making close contact with a bottom of a FOUP (Front Opening Unified Pod) by a vacuum pressure.

Provided is sensor built-in filter structure arranged in a wafer accommodation container, comprising: a first filter; a second filter arranged closer to a wafer accommodation chamber of the wafer accommodation container than to the first filter; and a gas detection sensor arranged between the first filter and the second filter to detect a state of a gas.

Optimizing purge flow parameters in a substrate container, includes streaming a purge working fluid into an interior of the substrate container, discharging the purge working fluid from the interior of the substrate container, and varying purge flow parameters of the purge working fluid for a predetermined period of time, detecting at least one environmental condition in the interior of the substrate container during the predetermined period of time, determining optimized purge flow parameters based on the varied purge flow parameters and the at least one detected environmental condition during the predetermined period of time, and adjusting the streaming and the discharging in accordance with the optimized purge flow parameters. The substrate container may include, for example, a front opening unified pod or a reticle pod.

Equipment front end module (EFEM) includes front located return ducts. The EFEM may include a front wall, a rear wall, and two side walls, the front wall including a plurality of load ports, and the rear wall configured to couple to a load lock apparatus. An EFEM chamber is formed between the front wall, the rear wall, and the two side walls. An upper plenum is positioned at a top of the EFEM and includes an opening into the EFEM chamber. Return ducts provide a return gas flow path enabling recirculation of gas from the EFEM chamber to the upper plenum. At least some of the plurality of return ducts are located between the load ports. Electronic device manufacturing assemblies and methods of operating equipment front end modules are also disclosed.

A substrate processing apparatus includes: a carrier storage rack configured to place and store a carrier that accommodates a substrate; a gas supply configured to supply an inert gas into the carrier placed on the carrier storage rack; and a controller configured to control whether to supply the inert gas into the carrier based on at least one of carrier information and substrate information.

The present invention relates to a wafer storage container capable of removing fumes on a wafer or removing moisture therefrom by supplying purge gas to the wafer stored in a storage chamber. More particularly, the present invention relates to a wafer storage container capable of quickly blocking an injection hole and an exhaust hole and of preventing contaminants from flowing into a storage chamber upon the blocking of the exhaust hole.

A substrate storage container includes a container body configured to store substrates, a lid that closes an opening of the container body, and a valve unit that controls the flow of gas to the container body. The valve unit includes an elastic valve having a valve opening that connects a first passage communicating with the outside of the container body to a second passage communicating with the inside of the container body, a holding member that holds the elastic valve, and a clamping cap that is inserted in the elastic valve and secures the elastic valve to the holding member. The valve opening is tightly closed by the elastic force of the elastic valve.

Provided is an exhaust system of a wafer treatment device, and the main purpose thereof is to prevent secondary contamination of a wafer by not allowing foreign substances such as process gases and fumes and the like floating in the wafer treatment device to make contact with the wafer in a side storage. The wafer treatment device comprises: a cleaning device for removing foreign substances remaining on a wafer; and an exhaust device comprising first and second main bodies at the lower side of a main body of the wafer treatment device. By not allowing foreign substances such as process gases and fumes and the like floating in the wafer treatment device to make contact with a wafer in a side storage, secondary contamination of the wafer is prevented.

The present invention discloses a reticle container which comprises an upper cover and a lower cover. A plurality of identification modules is disposed on the edge of the reticle container. Therefore, the user can quickly identify the usage of the reticle container or number per se. On the other hand, the reticle container of the present invention further comprises supporters, sustainers and connecting modules. Therefore, the reticle container of the present invention is able to satisfy various structural requirements and conditions for carrying the reticle in a sealed environment.

A system comprises a front opening universal pod (FOUP) configured to hold one or more semiconductor wafers and a load dock having a stage and a receiving portion extending above the stage. The FOUP is positioned on the stage. A fan filter unit (FFU) positioned above the load dock. An air flow optimizer device is disposed on the receiving portion and under the FFU. The air flow optimizer device has an inlet opening and an outlet opening and a channel extends between the inlet opening and the outlet opening.