A stocker includes a wall that separates inside and outside of the stocker, a storage area on an inner side of the wall to store articles, a duct on a wall side of the storage area and extending in a vertical direction, an inlet at an upper end of the duct to introduce air flowing downward into the duct, a flow regulator to regulate an airflow between an upper side and a lower side of the duct, blowout openings on a storage area side of the duct to blow out air to the storage area, and a fan on a lower side of the flow regulator of the duct to draw in outside air and introduce the outside air into the duct.

An ESD protection composite structure includes a link layer, a progressive layer, and a composite layer. The link layer is used for disposing the ESD protection composite structure on a substrate, wherein a material of the link layer includes a metal material. The progressive layer is disposed on the link layer, wherein the material of the progressive layer includes a non-stoichiometric metal oxide material, and an oxygen concentration in the non-stoichiometric metal oxide material is increased gradually away from the substrate in a thickness direction of the progressive layer. The composite layer is disposed on the progressive layer, wherein the composite layer includes a stoichiometric metal oxide material and a non-stoichiometric metal oxide material, and a ratio of the non-stoichiometric metal oxide material and the stoichiometric metal oxide material in the composite layer may make a sheet resistance value of the composite layer 110.sup.7 /sq to 110.sup.8 /sq.

A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.

An array substrate, a fabricating method thereof, and a related display device are provided. The method for forming an array substrate can comprises: forming a plurality of signal lines over a base substrate; forming a conductive line over the base substrate, the conductive line connecting at least two of the plurality of signal lines; forming an insulating layer over the base substrate, the plurality of signal lines, and the conductive line; forming a via hole through the insulating layer at a position over the conductive line and between the at least two of the plurality of signal lines; and removing a portion of the conductive line through the via hole to disconnect the conductive line.

An array substrate, a fabricating method thereof, and a related display device are provided. The method for forming an array substrate can comprises: forming a plurality of signal lines over a base substrate; forming a conductive line over the base substrate, the conductive line connecting at least two of the plurality of signal lines; forming an insulating layer over the base substrate, the plurality of signal lines, and the conductive line; forming a via hole through the insulating layer at a position over the conductive line and between the at least two of the plurality of signal lines; and removing a portion of the conductive line through the via hole to disconnect the conductive line.

An insulating wafer-storing container for storing substrates inside the container is provided in which at least one exterior surface of the container is formed with a contact portion that is to be in contact with an object other than the container and a non-contact portion that is not to be in contact with the object when the object is brought into contact with the at least one exterior surface, and the area of the contact portion is 40% or less of the total of the area of the contact portion and the area of the non-contact portion.

An array substrate, a fabricating method thereof, and a related display device are provided. The method for forming an array substrate can comprises: forming a plurality of signal lines over a base substrate; forming a conductive line over the base substrate, the conductive line connecting at least two of the plurality of signal lines; forming an insulating layer over the base substrate, the plurality of signal lines, and the conductive line; forming a via hole through the insulating layer at a position over the conductive line and between the at least two of the plurality of signal lines; and removing a portion of the conductive line through the via hole to disconnect the conductive line.

A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.

According to various embodiments, a frame cassette includes a housing and a mounting structure within the housing. The mounting structure includes a plurality of tape-frame slots, each tape-frame slot configured to receive a tape-frame. The housing includes an opening configured to introduce a tape-frame into a tape-frame slot of the plurality of tape-frame slots, or to remove the tape frame from the tape-frame slot of the plurality of tape-frame slots. The housing also includes an electrostatic discharge protection. A corresponding automatic transportation system and method of automatic transportation of semiconductor wafers is also provided.

A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.