A system for transferring a substrate includes a substrate transporter at which is captured a first image with which a position of the substrate at the substrate transporter is determined; a tray at which is captured a second image with which a position of each of a plurality of substrates relative to the tray is determined; a substrate mover with which the substrate is movable in a revolving manner between the substrate transporter and the tray, the substrate mover including: an arm portion movable in the revolving manner between the substrate transporter and the tray, and a substrate securing portion movable together with the arm portion; and an imager with which the first image and the second image are captured, the imager connected to the arm portion and movable in the revolving manner between the substrate transporter and the tray together with the arm portion.

A support member system is described for association with an overhead transport system. The support member system provides a safety feature to the overhead transport system by which the overhead transport system is able to avoid damage to wafers that are contained within a wafer cassette that is unintentionally released by the overhead transport system. The support member system is able to prevent such released cassettes from impacting the ground or tools located under the overhead transport system. The support member system targets wafer cassettes that have dimensions which are different than the dimensions of wafer cassettes for which the overhead transport system was originally designed to transport. Stocker systems for receiving, storing and delivering different types of wafer cassettes are also described.

A transfer vehicle system in which transfer vehicles travel on a track includes a measurement portion in a portion of a path continuing to the track to measure a measurement target portion included in the transfer vehicle on the path, an identifier to identify the transfer vehicle for which the measurement target portion has been measured by the measurement portion, a storage to store a measurement result measured by the measurement portion and an identification result identified by the identifier in association with each other, and a display to provide notification of information concerning a state of the measurement target portion determined based on the measurement result and a reference value.

The disclosed technology generally relates to semiconductor processing and more particularly to placing a substrate in a semiconductor manufacturing equipment for processing, and to apparatuses for placing the substrate in the semiconductor manufacturing equipment. In one aspect, a method of calibrating a process position of a semiconductor substrate in a process chamber comprises securing a calibration substrate on a susceptor in a processing chamber under an open chamber condition using a securing device, wherein securing comprises preventing the substrate from sliding laterally on the susceptor by more than a predefined tolerance from a centered position relative to a susceptor center. The method additionally comprises subjecting the calibration substrate under a process condition different from the open chamber condition. The method additionally comprises transferring the calibration substrate from the susceptor using a robot arm. The method further comprises detecting a position of the calibration substrate and recording coordinates of the robot arm corresponding to the detected position of the calibration substrate. Detection can be conducted on the fly. The securing device can be removed prior to processing substrates.

A wafer forming apparatus includes a conveying tray having an ingot accommodating section that accommodates a semiconductor ingot and a wafer accommodating section that accommodates a wafer formed from the semiconductor ingot, a belt conveyor unit that conveys the conveying tray to each processing apparatus, a cassette rack on which cassettes accommodating the wafers are placed correspondingly to the conveying trays, and a transferring unit that transfers the wafer from the wafer accommodating section of the conveying tray to the cassette placed on the cassette rack. The conveying tray is provided with an identification mark. The cassette rack or the cassette corresponding to the conveying tray is provided with the same identification mark as the identification mark provided on the conveying tray.

An apparatus for executing a direct transfer of a semiconductor device die from a first substrate to a second substrate. The apparatus includes a first substrate conveyance mechanism movable in two axes. A micro-adjustment mechanism is coupled with the first substrate conveyance mechanism and is configured to hold the first substrate and to make positional adjustments on a scale smaller than positional adjustments caused by the first substrate conveyance mechanism. The micro-adjustment mechanism includes a micro-adjustment actuator having a distal end and a first substrate holder frame that is movable via contact with the distal end of the micro-adjustment actuator. A second frame is configured to secure the second substrate such that a transfer surface is disposed facing the semiconductor device die disposed on a surface of the first substrate. A transfer mechanism is configured to press the semiconductor device die into contact with the transfer surface of the substrate.

The present disclosure provides a device for conveying and dispersing a silicon wafer (100). The device for conveying and dispersing a silicon wafer (100) includes: a conveying component (20) configured for conveying a plurality of silicon wafers (200); a clamping component (10) disposed at two sides of the conveying component (20), the clamping component (10) being capable of clamping and conveying the plurality of silicon wafers (200); and a spraying component (30) disposed on the clamping component (10), wherein after the plurality of silicon wafers (200) are conveyed to an end of the conveying component (20) proximal to the spraying component (30) via the conveying component (20) and the clamping component (10), the spraying component (30) is capable of spraying water on the plurality of silicon wafers (200) to separate adjacent two of the plurality of silicon wafers (200).

A floor-to-floor transport system that transports an article between different floors by using an upward path and a downward path in a vertical transporter that revolves in one direction includes, on at least one floor: a loading transport line that transports to the vertical transporter an article to be transported to another floor; a first loading opening through which the article is loaded into the upward path in the vertical transporter; a second loading opening through which the article is loaded into the downward path in the vertical transporter; a transferor that selectively transfers to the first loading opening or the second loading opening an article transported by the loading transport line; and a controller that controls the transferor depending on a destination of the article.

A wafer storage box, wafer transfer device and wafer storage box and transfer assembly. The wafer storage and transfer assembly includes a chassis which is capable of translating or rotating, a sliding shaft, connecting levers, arms and at least two positioning sidewall. The chassis includes a groove. The sliding shaft can translate along the groove. The connecting levers are connected to the sliding shaft. Each arm extends from a connecting lever. The two positioning sidewall are respectively arranged on opposite sides of the chassis. Each positioning sidewall includes tracks accommodating the pins of connecting levers. The width of each of the tracks reduces from the front end of the positioning sidewall to the back end of the positioning sidewall. The wafer storage and transfer assembly can vacuum adsorb several wafers to achieve high efficiency of wafer storing and transferring.

The present disclosure relates to a substrate transfer apparatus. The substrate transfer apparatus includes a first transfer apparatus, a second transfer apparatus, a substrate carrier driver, a sensor, a swing apparatus, and a controller. The first transfer apparatus is configured to transfer a substrate in a first direction. The second transfer apparatus is configured to receive the substrate from the first transfer apparatus and transfer the substrate and comprising a substrate carrier on which the substrate transferred from the first transfer apparatus is seated. The substrate carrier driver is configured to move the substrate carrier. The sensor is configured to detect an abnormal transfer of the substrate from the first transfer apparatus to the second transfer apparatus and generate a detection signal corresponding to the abnormal transfer of the substrate. The swing apparatus is configured to swing the substrate carrier. The controller is connected to the sensor and the swing apparatus and configured to control the swing apparatus based on the detection signal of the sensor.